-
21.
公开(公告)号:US20230279183A1
公开(公告)日:2023-09-07
申请号:US18098281
申请日:2023-01-18
发明人: Dong Ki KIM , Young Chul PARK , Eun Sang LEE , Sung Mook CHOI
IPC分类号: C08G73/10 , C08J5/18 , C08L79/08 , H01L21/304 , H01L21/683
CPC分类号: C08G73/1007 , C08G73/105 , C08J5/18 , C08L79/08 , H01L21/304 , H01L21/6836 , C08L2203/16 , C08J2379/08 , H01L2221/68318 , H01L2221/68381
摘要: A polyimide precursor composition according to an exemplary embodiment includes an imide precursor having an organic group derived from a cyclic ether group-containing compound. A polyimide film formed using the polyimide precursor composition has improved heat resistance and mechanical properties, and has high absorbance in a wavelength range in an ultraviolet region.
-
公开(公告)号:US20230265288A1
公开(公告)日:2023-08-24
申请号:US18017963
申请日:2021-09-02
发明人: Soichiro NAKANISHI
CPC分类号: C08L79/08 , B29C45/0001 , B29K2079/08
摘要: A heat resistant resin composition which does not cause stringing when performing fusion-bonding using heated plates. A heat resistant resin composition, including: a maleimide-based copolymer; and at least one resin selected from the group including: ABS resin, ASA resin, AES resin, and SAN resin; wherein: the heat resistant resin composition has a ratio G′/G″ of storage modulus (G′) to loss modulus (G″) measured in accordance with JIS K 7244-10 under conditions of 240° C. at an angular velocity of 0.63 rad/s is 0.30 or more and 1.00 or less.
-
公开(公告)号:US11732164B2
公开(公告)日:2023-08-22
申请号:US16767251
申请日:2019-05-17
申请人: TOYOBO CO., LTD.
发明人: Ryo Sonoda , Tadahiko Mikami , Tetsuo Kawakusu
IPC分类号: C09J11/06 , C09J7/30 , C09J11/08 , C08L63/00 , C08L79/08 , C08K5/06 , H05K1/03 , B32B15/09 , B32B15/12 , B32B15/20 , B32B27/10 , B32B15/18 , C09J123/26 , H05K1/02 , H05K1/05
CPC分类号: C09J123/26 , C09J11/06 , H05K1/028 , H05K1/056 , H05K2201/0154 , H05K2201/0355
摘要: The present invention aims to provide an adhesive composition which exhibits high adhesive property not only to the conventional polyimide and polyester film but also to a metal substrate, can achieve high solder heat resistance and exhibits excellent low-dielectric characteristics. According to the present invention, there is provided an adhesive composition containing an acid-modified polyolefin (a), an oligo-phenylene ether (b) having a number-average molecular weight of 3000 or less, and an epoxy resin (c), wherein the adhesive composition satisfies the following requirement(s) (A) and/or (B):
(A) The adhesive composition contains more than 20 parts by mass and 60 parts by mass or less of the epoxy resin (c) to 100 parts by mass of the acid-modified polyolefin (a);
(B) The adhesive composition further contains a polycarbodiimide (d).-
公开(公告)号:US11702490B2
公开(公告)日:2023-07-18
申请号:US16690642
申请日:2019-11-21
发明人: Hsuan-Wei Lee , Cheng-Hsiu Tsai , Chiu-Tung Wang , Li-Duan Tsai , Tzu-Ying Chen
CPC分类号: C08F212/08 , C08K5/0025 , C08L73/02 , C08L79/08 , B01D15/361 , B01J39/19 , C08L2312/00
摘要: The present disclosure provides a polymer, including a first repeating unit represented by formula (I), a second repeating unit represented by formula (II), and a third repeating unit represented by formula (III). The first repeating unit, the second repeating unit, and the third repeating unit are arranged in an alternating fashion, in a random fashion, or in discrete blocks. The molar ratio of the first repeating unit, the second repeating unit and the third repeating unit is m:n:o, and m:(n+o) is from 60:40 to 85:15. The definitions of a, R1, R2, A−, and R+ are as defined in the specification.
-
公开(公告)号:US11700687B2
公开(公告)日:2023-07-11
申请号:US16899504
申请日:2020-06-11
CPC分类号: H05K1/036 , B32B15/08 , B32B27/281 , H05K1/0393 , C08J2479/08 , C08L79/08 , H05K2201/0154 , Y10T428/31681 , Y10T428/31721
摘要: In a first aspect, a polymer film includes a polyimide. The polyimide includes one or more dianhydrides and one or more diamines. Each of the dianhydrides and diamines is selected from the group consisting of crankshaft monomers, flexible monomers, rigid rotational monomers, rigid non-rotational monomers, and rotational inhibitor monomers. The polymer film has a Df of 0.005 or less, a water absorption of 2.0% or less and a water vapor transport rate of 50 (g×mil)/(m2×day) or less. In a second aspect, a metal-clad laminate includes the polymer film of first aspect and a first metal layer adhered to a first outer surface of the polymer film. In a third aspect, an electronic device includes the polymer film of the first aspect.
-
公开(公告)号:US11692090B2
公开(公告)日:2023-07-04
申请号:US16945680
申请日:2020-07-31
IPC分类号: C08K5/1535 , C08K5/3417 , C08K5/353 , C08F214/18 , C08L79/08 , C08L27/18 , C08L27/24 , C08L29/10 , C08L27/20 , C08G73/10 , C08K5/00
CPC分类号: C08L27/20 , C08L27/18 , C08L29/10 , C08F214/18 , C08F214/184 , C08G73/1046 , C08K5/0025 , C08K5/1535 , C08K5/3417 , C08K5/353 , C08L27/24 , C08L79/08 , C08L2205/025 , C08L2205/03 , C08L2205/08 , C08L2312/00
摘要: A polymer composition of cross-linked fluoropolymers is provided, that is generated using a fluoropolymer compatibilizer. The cross-linked fluoropolymers have excellent mechanical and dielectric characteristics at high temperatures, making them useful for such applications as insulation for automotive communications cables and PCB laminates.
-
27.
公开(公告)号:US20230183424A1
公开(公告)日:2023-06-15
申请号:US17962140
申请日:2022-10-07
申请人: SKC CO., LTD.
发明人: Han Jun KIM , Jin Woo LEE , Jin Yong LEE
CPC分类号: C08G73/14 , C08L79/08 , C08J5/18 , C08L2203/16 , C08J2379/08
摘要: The embodiments aim to provide a polyamide-imide-based film, which has a content of nitrogen (N) elements in the film of 6 to 7.5% by weight based on the sum of the weights of carbon (C), hydrogen (H), oxygen (O), and nitrogen (N) elements in the film, whereby it is uniform in quality and excellent in mechanical properties and optical properties, a process for preparing the same, and a cover window and a display device comprising the same.
-
公开(公告)号:US11667782B2
公开(公告)日:2023-06-06
申请号:US17134149
申请日:2020-12-24
发明人: Shu-Nung Chang , Wen-Bing Chu
CPC分类号: C08L27/16 , C08L71/02 , C08L79/08 , C08L2203/16
摘要: A polyvinylidene fluoride film composition and a polyvinylidene fluoride isolation film are provided. The polyvinylidene fluoride film composition includes a polyvinylidene fluoride, a polyetherimide, and a polyether-type nonionic surfactant. The weight ratio of the polyvinylidene fluoride to the polyetherimide is 1:1 to 19:1, and the content of the polyether-type nonionic surfactant is 0.1% to 10% by weight based on a total of 100% by weight of the polyvinylidene fluoride film composition.
-
公开(公告)号:US11667757B2
公开(公告)日:2023-06-06
申请号:US17139336
申请日:2020-12-31
发明人: Dong-Sen Chen , Yu-Ju Kuo , Yung-Lung Tseng , Chun-Wei Su
IPC分类号: C08G77/455 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/24 , C08G77/26 , C08G77/00 , C08G73/10 , C08K5/00 , C08L79/08 , C08G77/12
CPC分类号: C08G77/455 , C08G73/1039 , C08G73/1046 , C08G73/1064 , C08G73/1067 , C08G73/1075 , C08G73/1085 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/24 , C08G77/26 , C08G77/80 , C08K5/0025 , C08L79/08 , C08L2201/10 , C08L2203/20
摘要: A polymer, a composition, and a polysiloxane-polyimide material thereof are provided. The polymer includes a first repeat unit and a second repeat unit. The first repeat unit has a structure represented by Formula (I) and the second repeat unit has a structure represented by Formula (II)
wherein A1 and A3 are independently tetravalent moiety; A2 is a divalent moiety; n≥1; m≥1; R1 is independently hydrogen, C1-8 alkyl, C1-8 fluoroalkyl, C1-8 alkoxy, or C6-12 aryl; and R2 is independently hydrogen, C1-8 alkyl, C1-8 fluoroalkyl, C1-8 alkoxy, C6-12 aryl, or a reactive functional group.-
公开(公告)号:US20230167300A1
公开(公告)日:2023-06-01
申请号:US17903063
申请日:2022-09-06
发明人: Te-Chao Liao , Chien Kai Wei , Hung-Yi Chang
IPC分类号: C08L79/08
CPC分类号: C08L79/08 , C08L2312/00 , C08L2201/02 , C08L2203/20
摘要: A resin composition including resin and other additives is provided. The resin includes bisphenol M-type cyanate ester (CE) resin and bismaleimide (BMI) resin. The other additives are selected from at least one of flame retardants, inorganic fillers, and accelerators.
-
-
-
-
-
-
-
-
-