HEAT RESISTANCE RESIN COMPOSITION AND INJECTION MOLDED BODY THEREOF

    公开(公告)号:US20230265288A1

    公开(公告)日:2023-08-24

    申请号:US18017963

    申请日:2021-09-02

    IPC分类号: C08L79/08 B29C45/00

    摘要: A heat resistant resin composition which does not cause stringing when performing fusion-bonding using heated plates. A heat resistant resin composition, including: a maleimide-based copolymer; and at least one resin selected from the group including: ABS resin, ASA resin, AES resin, and SAN resin; wherein: the heat resistant resin composition has a ratio G′/G″ of storage modulus (G′) to loss modulus (G″) measured in accordance with JIS K 7244-10 under conditions of 240° C. at an angular velocity of 0.63 rad/s is 0.30 or more and 1.00 or less.