公开(公告)号：US12297545B2

公开(公告)日：2025-05-13

申请号：US18146489

申请日：2022-12-27

Applicant: SEMES CO., LTD.

Inventor： Jun Kil Hwang ,  Min Jung Kim ,  Hee Hwan Kim ,  Seong Soo Lee

IPC: C23F1/46 ,  B08B3/02 ,  B08B3/04 ,  B08B3/08 ,  H01L21/02

Abstract: Disclosed is a method of adjusting a concentration of a chemical liquid in a treatment liquid, the method including: treating a substrate by supplying a treatment liquid stored in a main tank from a nozzle in a heated state to the substrate, and recovering the treatment liquid used in the treatment of the substrate to the main tank directly or via still another tank, and then reusing the recovered treatment liquid, a concentration adjustment operation of adjusting a concentration of the treatment liquid in the main tank is performed in a standby time period in which the substrate is not treated with the treatment liquid, and the concentration adjustment operation is performed by discharging the treatment liquid in a heated state from the nozzle to evaporate a part of the diluting solution, and recovering the discharged treatment liquid to the main tank.

公开(公告)号：US20250149389A1

公开(公告)日：2025-05-08

申请号：US18787320

申请日：2024-07-29

Applicant: SEMES CO., LTD.

Inventor： Il Young KIM ,  Seong Kwang LEE ,  Hahn Joo YOON ,  Yong Hoon SUNG ,  Sang Man PARK ,  Tae Wan KIM ,  Jun Ho SEO

IPC: H01L21/66 ,  H01J37/32 ,  H01L21/67

Abstract: Disclosed are a substrate processing method and a substrate processing apparatus. The substrate processing method of etching a thin film formed on a substrate in units of atomic layers includes a modifying step of supplying a modifying gas to a processing space in a chamber accommodating the substrate to modify a surface of the thin film and form a modified film having a first thickness, a surface adsorption step of supplying a precursor to the processing space to adsorb the precursor to the modified surface of the thin film, and an etching step of supplying heat to the substrate adsorbed with the precursor to etch the modified surface of the thin film adsorbed with the precursor. The surface adsorption step and the etching step are repeatedly performed multiple times until the modified film having the first thickness is etched.

公开(公告)号：US20250149312A1

公开(公告)日：2025-05-08

申请号：US18939452

申请日：2024-11-06

Applicant: SEMES CO., LTD.

Inventor： Tae Sung KIM ,  Duk Hyun SON

IPC: H01J37/32 ,  G05D7/06 ,  H01L21/683

Abstract: Disclosed are a substrate processing apparatus including a fluid supply unit and a fluid control method for controlling a flow rate of fluid. The fluid control method for controlling a flow rate of fluid to be supplied to a lower surface of a substrate from a fluid supply unit including a fluid source for supplying fluid and fluid supply lines connected to the fluid source includes a dimension measurement step of measuring lengths and cross-sectional areas of the fluid supply lines, a volume calculation step of calculating volumes of the fluid supply lines using the lengths and the cross-sectional areas measured in the dimension measurement step, a time measurement step of opening a valve provided in the fluid source to measure a time for which fluid is supplied to the fluid supply lines, and a control step of controlling a flow rate of fluid based on data obtained in the previous steps.

公开(公告)号：US20250146129A1

公开(公告)日：2025-05-08

申请号：US18907446

申请日：2024-10-04

Applicant: SEMES CO., LTD.

Inventor： Yeong Gyu KIM ,  Guen Do PARK

IPC: C23C16/448 ,  C23C16/24 ,  C23C16/40 ,  C23C16/455 ,  C23C16/458 ,  C23C16/50 ,  C23C16/52

Abstract: Disclosed are a semiconductor manufacturing facility and a shower head coating method using the same. The semiconductor manufacturing facility includes an index block, a processing block including a substrate processing apparatus, and a substrate transferring block. The substrate processing apparatus includes a chamber including a processing space defined therein, a substrate support unit disposed in the processing space and including a first heating member configured to heat the substrate coated with the precursor, a gas supply unit configured to supply gas to the processing space, a plasma generation unit configured to convert the supplied gas into plasma, a shower head configured to supply the supplied gas to the processing space, and a controller. The controller controls the first heating member to heat the substrate supported by the substrate support unit so that the precursor applied to the substrate is vaporized and a coating layer is formed on the shower head.

公开(公告)号：US12291029B2

公开(公告)日：2025-05-06

申请号：US17945089

申请日：2022-09-15

Applicant: SEMES CO., LTD.

Inventor： Sung Ho Kim ,  Bo Yeon Hwang ,  Chang Jin Moon ,  Sol Min Park ,  Sang Seok Kim

IPC: B41J2/04 ,  B41J2/045 ,  B41M3/00 ,  B41M5/00

Abstract: The present disclosure provides a method for processing a substrate that can maintain a production amount even when a production model is changed. The method for processing a substrate comprises: disposing the substrate on a levitation stage; measuring a distance between the substrate and an inkjet head module; and changing a discharging speed of ink to be discharged from the inkjet head module based on the measured distance.

公开(公告)号：US20250140576A1

公开(公告)日：2025-05-01

申请号：US18921283

申请日：2024-10-21

Applicant: SEMES CO., LTD.

Inventor： Jun Hee CHOI ,  Tae Keun KIM ,  Kang Sul KIM ,  Kyeong Min LEE ,  Yong Jun KIM ,  Hyeong Soo PARK

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/304

Abstract: Disclosed is a method of processing a substrate, the method including: a coating operation of supplying a coating liquid containing a volatile component to a top surface of the substrate to form a cleaning film; and a cleaning film processing operation of processing the cleaning film, in which the cleaning film processing operation includes: a crack formation operation of generating a crack in the cleaning film formed on the substrate to form film flakes; and a delamination operation of delaminating the film flakes from the top surface of the substrate by volatilizing the volatile component contained in the film flake.

公开(公告)号：US20250140534A1

公开(公告)日：2025-05-01

申请号：US18826150

申请日：2024-09-05

Applicant: SEMES CO., LTD.

Inventor： Young Seo AN ,  Sang Man PARK ,  Han Lim KANG ,  In Hoe KIM ,  Yoon Seok CHOI ,  Sung Suk WI ,  Tae Hun KANG

IPC: H01J37/32

Abstract: Disclosed are a substrate processing apparatus and a substrate processing method. The substrate processing apparatus includes a chamber including a processing space defined therein, a substrate support unit configured to support a substrate in the processing space, a microwave unit configured to supply microwaves to the processing space, a window member disposed below the microwave unit and configured to transmit the microwaves supplied from the microwave unit, a heat transfer plate disposed in the processing space so as to be spaced a predetermined distance from the window member and configured to be heated by the microwaves supplied to the processing space and to transfer heat to the substrate, and a controller configured to control the microwave unit.

公开(公告)号：US20250136383A1

公开(公告)日：2025-05-01

申请号：US18885692

申请日：2024-09-15

Applicant: SEMES CO., LTD.

Inventor： Hyun Jun LEE ,  Tae Hyun JO

IPC: B65G35/06 ,  B66C11/08

Abstract: A transport apparatus includes: a vehicle; a housing connected to the vehicle and forming an internal space with an open bottom; a hand unit provided to be movable in an up-down direction, in the housing, and to grip and upgrip a transport object; and a slide unit separated from the hand unit, in the housing, and moving horizontally in a direction where the hand unit is disposed, wherein the slide unit includes: a base plate provided in the internal space of the housing; a slide plate sliding from the base plate in the direction where the hand unit is disposed and seating the transport object; and a drive module provided on the base plate, and sliding the slide plate so that the slide plate protrudes from the base plate.

公开(公告)号：US20250135510A1

公开(公告)日：2025-05-01

申请号：US18929782

申请日：2024-10-29

Applicant: SEMES CO., LTD.

Inventor： Si Nae SONG ,  Ho Jin JEONG ,  Kyung Min KIM ,  Sung Bum PARK ,  Dong Ho LIM ,  Soo Young PARK

IPC: B08B3/04 ,  B08B3/08 ,  H01L21/02

Abstract: Disclosed is a substrate treating apparatus including: a substrate support unit for supporting and rotating a substrate; a liquid supply unit for supplying a treatment solution onto the substrate; a collection cup provided to surround the substrate support unit, and having a plurality of collection spaces for collecting a treatment solution scattered from the substrate; a lifting unit for changing a relative position between the collection cup and the substrate; and a controller for controlling the lifting unit to vary a relative height between the substrate and the collection cup in accordance with a process recipe for treating the substrate.

公开(公告)号：US12283510B2

公开(公告)日：2025-04-22

申请号：US17747914

申请日：2022-05-18

Applicant: SEMES CO., LTD.

Inventor： Sang Oh Kim ,  Myung Jin Lee

IPC: H01L21/68 ,  B65G47/90 ,  H01L21/677 ,  H01L21/687

Abstract: The present disclosure provides a substrate treating apparatus having improved efficiency and productivity. The substrate treating apparatus of the present disclosure comprises a process chamber having a treating space therein, a transfer robot comprising a robot hand for loading and unloading a substrate into and out of the treating space and gripping the substrate, and a teaching buffer for aligning the robot hand, wherein the teaching buffer comprises a teaching plate for providing a reference point, and at least one camera looking at the teaching plate, wherein the camera captures the reference point of the teaching plate, wherein the transfer robot aligns the robot hand with the reference point using the camera.