Abstract:
An electronic component has an integrated protective device which responds in the event of a thermal overload and interrupts a current flow through the component. The protective device has an electrical terminal which may be brought under spring pretension by intrinsic resilience and assumes a mounting position in the pretensioned state and a current interrupting position in the untensioned state.
Abstract:
A composite structure includes an electronic component and a supporting member. The electronic component includes a main body and a plurality of pins extended outwardly from the main body. The supporting member includes a first supporting part and a second supporting part. The first supporting part is foldable with respect to the second supporting part. The main body of the electronic component is accommodated within the first supporting part of the supporting member. The pins are accommodated with the second supporting part of the supporting member. The first supporting part is folded with respect to the second supporting part such that the pins are bent to define a bent structure.
Abstract:
A light bar structure includes a circuit board and a plurality of light emitting units. A plurality of holes is formed on the circuit board. Each light emitting unit includes a main body and a plurality of leads. The main body is disposed in one of the holes. The main body has a light emitting surface and a non-light emitting surface opposite to the light emitting surface. Each lead has a first connecting portion, a second connecting portion and an extending portion. The first connecting portion is connected to the non-light emitting surface. The extending portion is extended from the first connecting portion toward the light emitting surface. The second connecting portion is extended from the extending portion and connected to a surface of the circuit board.
Abstract:
A receptacle structure includes a housing structure, a terminal insulating board, a first terminal and a second terminal. The housing structure is configured to be mounted on a printed wiring board and to accommodate a plug. The terminal insulating board includes a top face and a bottom face that is opposite to the top face. The terminal insulating board is disposed inside the housing structure with the bottom face facing towards the printed wiring board. The first terminal is connected to the printed wiring board via the first rear connection part and to the terminal insulating board. The second terminal is connected to the printed wiring board via the first front connection part and to the terminal insulating board. The first front connection part has a width narrower than the first rear connection part and is connected to the printed wiring board away from the first rear connection part.
Abstract:
An integrated circuit board includes a bridging filtering capacitor, a bypass capacitor, a thermistor, and a varistor. The integrated circuit board further includes an electrolytic capacitor set having a plurality of electrolytic capacitors, which are arranged in parallel and adjacent to each other, and a mounting frame for grouping the electrolytic capacitors. The present invention uses the above elements to reduce the vertical height, the horizontal width, and the occupied area. Therefore, the overall dimension of the circuit board can be reduced to make the electronic devices smaller, especially for thin electronic devices such as LCD TVs and screens.
Abstract:
An electronic circuit contains a circuit board with conducting tracks to which one or more electronic components with conducting contacts are positioned overlying portions of the conducting tracks and each such electronic component is held in place by a clamp that covers and is contact with the top surface of the electronic components so as to hold their conducting contacts in electrical contact with the conducting tracks of the circuit board. The clamp can include a resilient layer held between the top surface of electronic components and a rigid clamping sheet.
Abstract:
A composite structure includes an electronic component and a supporting member. The electronic component includes a main body and a plurality of pins extended outwardly from the main body. The supporting member includes a first supporting part and a second supporting part. The first supporting part is foldable with respect to the second supporting part. The main body of the electronic component is accommodated within the first supporting part of the supporting member. The pins are accommodated with the second supporting part of the supporting member. The first supporting part is folded with respect to the second supporting part such that the pins are bent to define a bent structure.
Abstract:
A transformer comprises a core formed by laminations, each having a rectangular plate with two spaced windows for receiving a set of coils passing through the windows in turn; a dielectric bobbin threading the windows, the coils being wound over the bobbin passing through the windows in turn to form primary and secondary windings, each of the coil ends having connection pins arranged in at least two arrays, a pair of pin supports formed integral to the bobbin to span the width of the transformer and carry the arrays of connection pins, the supports extending through the core laminations down to the bottom thereof and terminating by flat bottoms resting upon the circuit board, and outwardly bent sections of the connection pins in one of the arrays to hook the circuit board at its thru holes making instantly a secure provisional joint with the trace of the circuit board.
Abstract:
The invention relates to an arrangement comprising a shunt resistor with at least an electrically conductive first connecting leg and an electrically conductive second connecting leg. A resistance area of the shunt resistor is electrically connected to the first connecting leg and to the second connecting leg. The arrangement further comprises a circuit carrier with a first metallization and a second metallization. The first connecting leg is directly joined to the first metallization and the second connecting leg is directly joined to the second metallization. The resistance area of the shunt resistor is in thermal contact with the thermally conductive substrate by use of a thermal filler arranged between the resistance area and the substrate, and/or by directly contacting the resistance area with the substrate.The invention further relates to a method for producing an arrangement with a shunt resistor and a circuit carrier.
Abstract:
A direct attach interconnect includes a housing and spring contacts. The housing has top and bottom sides lying in parallel planes defined by x and y axes. The spring contacts are individually disposed within a passage in the housing such that a top end of the spring contacts extends out through the top housing side and a bottom end of the spring contacts extend out through the bottom housing side. The middle portion of each spring contact includes a connector which movably connects the middle portion of the spring contact to the passage for the spring contact such that the spring contact is movable along the x, y, and z axes. The bottom end of each spring contact includes a solder sphere and a solder pad. The top end of each spring contact is a land grid array or a pin rid array socket connector.