Abstract:
A process for forming a trench gate power MOS transistor includes forming an epitaxial layer having a first type of conductivity on a semiconductor substrate, and forming a body region having a second type of conductivity on the epitaxial layer. A gate trench is formed in the body region and in the epitaxial layer. The process further includes countersinking upper portions of the gate trench, and forming a gate dielectric layer on surfaces of the gate trench including the upper portions thereof. A gate conducting layer is formed on surfaces of the gate dielectric layer for defining a gate electrode. The gate conducting layer has a thickness that is insufficient for completely filling the gate trench so that a residual cavity remains therein. The residual cavity is filled with a filler layer. The gate conducting layer is removed from an upper surface of the body region while using the filler layer as a self-aligned mask. The edge surfaces of the gate conducting layer are oxidized. Source regions are formed by implanting dopants in the body region while using the oxidized edge surfaces as a self-aligned mask, and the implanted dopants are diffused in the body region.
Abstract:
A method is for low-dielectric-constant film deposition on a surface of a semiconductor substrate. The deposition may be by chemical vapor deposition (CVD) techniques and may include a wide class of precursor monomeric compounds, namely organosilanes.
Abstract:
A decoding structure for a memory device with a control code is used in a memory including a matrix of memory cells grouped into pages to each of which a block of control information is associated, and a plurality of reading elements for reading a plurality of pages in parallel. The decoding structure selectively connects each reading element to a plurality of memory cells, and selectively connects each memory cell to a plurality of reading elements.
Abstract:
A memory cell of a stacked type is formed by a MOS transistor and a ferroelectric capacitor. The MOS transistor is formed in an active region of a substrate of semiconductor material and comprises a conductive region. The ferroelectric capacitor is formed on top of the active region and comprises a first and a second electrodes separated by a ferroelectric region. A contact region connects the conductive region of the MOS transistor to the first electrode of the ferroelectric capacitor. The ferroelectric capacitor has a non-planar structure, formed by a horizontal portion and two side portions extending transversely to, and in direct electrical contact with, the horizontal portion.
Abstract:
A process for bonding two distinct substrates that integrate microsystems, including the steps of forming micro-integrated devices in at least one of two substrates using micro-electronic processing techniques and bonding the substrates. Bonding is performed by forming on a first substrate bonding regions of deformable material and pressing the substrates one against another so as to deform the bonding regions and to cause them to react chemically with the second substrate. The bonding regions are preferably formed by a thick layer of a material chosen from among aluminum, copper and nickel, covered by a thin layer of a material chosen from between palladium and platinum. Spacing regions ensure exact spacing between the two wafers.
Abstract:
A process for format conversion of DCT macroblocks in an MPEG video bitstream that are divided into blocks, each of which includes a plurality of microblocks. In each DCT block, the significant frequencies are identified and preserved, isolating a corresponding microblock preferably consisting of the microblock on the top left of each block and setting to zero the coefficients of the remaining microblocks. On the microblock thus isolated there is performed an inverse discrete cosine transform, and the microblock thus obtained is merged with the homologous microblocks obtained from the other blocks comprised in a respective starting macroblock, so as to give rise to a merging block. The merging block thus obtained undergoes a discrete cosine transform so as to obtain a final block, which can be assembled into a macroblock with converted format.
Abstract:
A negative charge pump circuit includes a cascade connection of a plurality of charge pump stages, each stage including at least a charge capacitance and a pass transistor driven by a corresponding phase signal. An input stage may be coupled to an input reference potential. An output stage may include an output terminal for generating a first pumped voltage. In addition, the charge pump circuit may further include a second output stage connected downstream to the input stage and including a second output terminal for generating a second pumped potential. The architecture may also be implemented in positive charge pump circuits.
Abstract:
A method and a circuit for minimizing glitches in phase-locked loops is presented. The circuit includes an input terminal connected to an input of a phase detector; a series of a charge pump generator, a filter and a voltage controlled oscillator connected downstream of the phase detector; and a frequency divider feedback connected between an output of the voltage controlled oscillator and a second input of the phase detector. The circuit provides for the inclusion of a compensation circuit connected between the charge pump generator and the filter to absorb an amount of the charge passed therethrough. This compensation circuit includes a storage element connected in series to two switches. The first switch is coupled to and controlled by an output of the charge pump and the second switch is coupled to and controlled by an output of a phase detector.
Abstract:
A circuit for computing the inner of scalar product of two vectors in a finite Galois field defined by a generator polynomial, wherein each vector includes at least two elements belonging to said finite field, comprises one or more look-up tables storing digital words indicative of said possible combinations and said possible reductions. The digital words in question are defined as a function of the second elements of said vectors and the generator polynomial of the field. The input register(s) and the look-up table(s) are configured to co-operate in a plurality of subsequent steps to generate at each step a partial product result identified by at least one of digital word addressed in a corresponding look-up table as a function of the digital signals stored in the input register(s). The circuit also includes an accumulator unit for adding up the partial results generated at each step to give a final product result deriving from accumulation of said partial results.
Abstract:
A method for manufacturing an integrated circuit having a memory device and a logic circuit includes forming a plurality of first transistors in a first portion of a semiconductor substrate, a plurality of second transistors in a second portion of the semiconductor substrate, and a plurality of memory cells in a third portion of the semiconductor substrate. A matrix mask used for selectively removing a dielectric layer from the first and third portions of the semiconductor substrate allows dielectric to remain on a floating gate of the plurality of memory cells and on the gate electrodes of the plurality of first transistors. A control gate is then formed on the floating gate, which is separated by the dielectric. Portions of the gate electrodes for the plurality of first transistors are left free so that contact is made with the transistors.