公开(公告)号：US20130016496A1

公开(公告)日：2013-01-17

申请号：US13180431

申请日：2011-07-11

Applicant: Guan-Chyun Hsieh ,  Cheng-Chih Chu

Inventor： Guan-Chyun Hsieh ,  Cheng-Chih Chu

IPC: G09F13/04 ,  H05B37/02 ,  F21S4/00

CPC classification number: H05B33/0827

Abstract: Method for managing power of a display and apparatus thereof are provided. The proposed method includes the following steps: calculating a most appropriating voltage value and a most appropriating current value form a plurality of LEDs; and obtaining a first optimal working point according to the most appropriating voltage value and the most appropriating current value, wherein the first optimal working point is used for arranging the plurality of LEDs.

Abstract translation: 提供了用于管理显示器的电源的方法及其装置。 所提出的方法包括以下步骤：由多个LED计算最适当的电压值和最适当的电流值; 并且根据最适当的电压值和最适当的电流值获得第一最佳工作点，其中第一最佳工作点用于布置多个LED。

公开(公告)号：US08012797B2

公开(公告)日：2011-09-06

申请号：US12547063

申请日：2009-08-25

Applicant: Chi-Chih Shen ,  Jen-Chuan Chen ,  Wen-Hsiung Chang ,  Chi-Chih Chu ,  Cheng-Yi Weng

Inventor： Chi-Chih Shen ,  Jen-Chuan Chen ,  Wen-Hsiung Chang ,  Chi-Chih Chu ,  Cheng-Yi Weng

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L21/565 ,  H01L21/4853 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45015 ,  H01L2924/207

Abstract: In one embodiment, a manufacturing method includes: (1) applying a first electrically conductive material to an upper surface of a substrate to form first conductive bumps; (2) electrically connecting a semiconductor device to the upper surface of the substrate; (3) applying a molding material to form a molded structure covering the first conductive bumps and the semiconductor device, upper ends of the first conductive bumps being recessed below an upper surface of the molded structure; (4) forming openings adjacent to the upper surface of the molded structure, the openings exposing the upper ends of the first conductive bumps; (5) applying, through the openings, a second electrically conductive material to form second conductive bumps; and (6) forming cutting slits extending through the molded structure and the substrate.

Abstract translation: 在一个实施例中，制造方法包括：（1）将第一导电材料施加到衬底的上表面以形成第一导电凸块; （2）将半导体器件电连接到衬底的上表面; （3）施加模塑材料以形成覆盖所述第一导电凸块和所述半导体器件的模制结构，所述第一导电凸块的上端在所述模制结构的上表面下方凹入; （4）形成与模制结构的上表面相邻的开口，所述开口暴露第一导电凸块的上端; （5）通过所述开口施加第二导电材料以形成第二导电凸块; 和（6）形成延伸穿过模制结构和基底的切割狭缝。

公开(公告)号：US07821497B2

公开(公告)日：2010-10-26

申请号：US11176124

申请日：2005-07-07

Applicant: Wen-Chih Chu ,  Hsiao-Lung Chiang

Inventor： Wen-Chih Chu ,  Hsiao-Lung Chiang

IPC: G09G5/08

CPC classification number: G06F3/03543 ,  G06F3/038

Abstract: A wireless mouse includes a wireless receiver and a mouse main body. The mouse main body includes an upper cover, a base, a receiving part and a withdrawing part. The base includes a first sidewall and a second sidewall. The receiving part is defined at an end of the first sidewall. The withdrawing part is defined at an end of the second sidewall. The wireless receiver is stored within the mouse main body through the receiving part, and the wireless receiver having been stored within the mouse main body is partially detached from the mouse main body through the withdrawing part.

Abstract translation: 无线鼠标包括无线接收器和鼠标主体。 鼠标主体包括上盖，底座，接收部和抽出部。 底座包括第一侧壁和第二侧壁。 接收部分限定在第一侧壁的端部。 抽出部分限定在第二侧壁的一端。 无线接收器通过接收部分存储在鼠标主体内，并且已经存储在鼠标主体内的无线接收器通过撤回部分与鼠标主体部分地分离。

公开(公告)号：US20100171205A1

公开(公告)日：2010-07-08

申请号：US12507305

申请日：2009-07-22

Applicant: Kuang-Hsiung CHEN ,  Chi-Chih SHEN ,  Jen-Chuan CHEN ,  Wen-Hsiung CHANG ,  Hui-Shan CHANG ,  Pei-Yu HSU ,  Fa-Hao WU ,  Chen-Yu CHIA ,  Chi-Chih CHU ,  Cheng-Yi WENG ,  Ya-Wen HSU

Inventor： Kuang-Hsiung CHEN ,  Chi-Chih SHEN ,  Jen-Chuan CHEN ,  Wen-Hsiung CHANG ,  Hui-Shan CHANG ,  Pei-Yu HSU ,  Fa-Hao WU ,  Chen-Yu CHIA ,  Chi-Chih CHU ,  Cheng-Yi WENG ,  Ya-Wen HSU

IPC: H01L21/56 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L23/3128 ,  H01L21/565 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45015 ,  H01L2924/207

Abstract: In one embodiment, a semiconductor device package includes: (1) a substrate unit; (2) connecting elements disposed adjacent to a periphery of the substrate unit and extending upwardly from an upper surface of the substrate unit; (3) a semiconductor device disposed adjacent to the upper surface of the substrate unit and electrically connected to the substrate unit; and (4) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit. The package body defines openings that at least partially expose respective ones of the connecting elements. At least one of the connecting elements has a width WC, and at least one of the openings has a width WU adjacent to an upper surface of the package body, such that WU>WC.

Abstract translation: 在一个实施例中，半导体器件封装包括：（1）衬底单元; （2）连接元件，其邻近所述基板单元的周边设置并从所述基板单元的上表面向上延伸; （3）半导体器件，与所述衬底单元的上表面相邻并且电连接到所述衬底单元; 和（4）与衬底单元的上表面相邻并且覆盖半导体器件的封装体。 封装主体的侧表面基本上与衬底单元的侧表面对准。 包装体限定了至少部分地暴露相应的连接元件的开口。 连接元件中的至少一个具有宽度WC，并且至少一个开口具有与封装主体的上表面相邻的宽度WU，使得WU> WC。

公开(公告)号：US07642133B2

公开(公告)日：2010-01-05

申请号：US11828352

申请日：2007-07-26

Applicant: Yen-Yi Wu ,  Wei-Yueh Sung ,  Pao-Huei Chang Chien ,  Chi-Chih Chu ,  Cheng-Yin Lee ,  Gwo-Liang Weng

Inventor： Yen-Yi Wu ,  Wei-Yueh Sung ,  Pao-Huei Chang Chien ,  Chi-Chih Chu ,  Cheng-Yin Lee ,  Gwo-Liang Weng

IPC: H01L21/00 ,  H01L21/44 ,  H01L23/02

CPC classification number: H01L24/14 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/1405 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention relates to a semiconductor package and a semiconductor device and a method of making the same. The method of making the semiconductor package comprises: providing a substrate; attaching a chip to a surface of the substrate; forming a plurality of connecting elements for electrically connecting the chip and the substrate; forming a plurality of first conductive bodies on the surface of the substrate; forming a molding compound for encapsulating the surface of the substrate, the chip, the connecting elements and the first conductive bodies; and removing a part of a border portion of the molding compound, so that the molding compound has two heights and one end of each first conductive bodies is exposed. Thereby, the molding compound covers the entire surface of the substrate, so that the bonding pads on the surface of the substrate will not be polluted.

Abstract translation: 本发明涉及半导体封装和半导体器件及其制造方法。 制造半导体封装的方法包括：提供衬底; 将芯片附接到所述基板的表面; 形成用于电连接所述芯片和所述基板的多个连接元件; 在所述基板的表面上形成多个第一导电体; 形成用于封装基板，芯片，连接元件和第一导电体的表面的模塑料; 并且除去模塑料的边界部分的一部分，使得模塑料具有两个高度，并且暴露出每个第一导电体的一端。 因此，成型化合物覆盖基板的整个表面，使得基板表面上的接合焊盘不会被污染。

公开(公告)号：US20090290381A1

公开(公告)日：2009-11-26

申请号：US12177578

申请日：2008-07-22

Applicant: Keng-ju Liu ,  Wen-yuan Cheng ,  Chi-chih Chu

Inventor： Keng-ju Liu ,  Wen-yuan Cheng ,  Chi-chih Chu

IPC: F21V8/00

CPC classification number: G02B6/009 ,  G02B6/0083

Abstract: The present invention discloses a backlight module having replaceable light apparatus. The backlight module includes the replaceable light apparatus, a back plate and a frame body. The replaceable light apparatus includes a light control circuit, a securing device and conducting wires. The light control circuit is adapted to a frame body and a back plate of the backlight module. Additionally, the light control circuit has a plurality of light sources, a first end portion and a second end portion. The securing device has a supporting housing which has a position protrusion and a clamping portion for supporting the first end portion of the light control circuit along a first direction (X) and a third direction (Z). The clamping portion clamps the first end portion of the light control circuit along a second direction (Y) and the third direction (Z).

Abstract translation: 本发明公开了一种具有可更换灯具的背光模块。 背光模块包括可替换的灯装置，背板和框体。 可替换的光装置包括光控制电路，固定装置和导线。 光控制电路适用于背光模块的框体和背板。 另外，光控制电路具有多个光源，第一端部和第二端部。 固定装置具有支撑壳体，其具有位置突起和夹持部分，用于沿着第一方向（X）和第三方向（Z）支撑光控制电路的第一端部。 夹持部沿着第二方向（Y）和第三方向（Z）夹持光控制电路的第一端部。

公开(公告)号：US07439619B2

公开(公告)日：2008-10-21

申请号：US11028718

申请日：2005-01-03

Applicant: Chi-Chih Chu ,  Gwo-Liang Weng ,  Shih-Chang Lee

Inventor： Chi-Chih Chu ,  Gwo-Liang Weng ,  Shih-Chang Lee

IPC: H01L23/34

CPC classification number: H01L23/564 ,  H01L21/563 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/16 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83102 ,  H01L2224/83851 ,  H01L2224/90 ,  H01L2224/92125 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention provides an electronic packaging process. The surface of the chip carrier includes at least a chip attachment region and a film attachment region adjacent to the chip attachment region. At least a baffle is formed on the surface of the chip carrier, between the chip attachment region and the film attachment region. After attaching the thin film to the film attachment region of the chip carrier through an affixture layer, the chip is electrically and physically connected to the chip attachment region of the chip carrier through an adhesive layer. The baffle can effectively prevent the gas that is released from the adhesive layer from damaging the bonding between the thin film and the affixture layer. Therefore, almost no bubbles are formed and good electrical connection between the thin film and the affixture layer is maintained.

Abstract translation: 本发明提供一种电子包装方法。 芯片载体的表面至少包括芯片附着区域和与芯片连接区域相邻的膜附着区域。 在芯片载体的表面上，在芯片安装区域和膜附着区域之间形成至少一个挡板。 在通过粘合层将薄膜附着到芯片载体的膜附着区域之后，芯片通过粘合剂层电连接并且物理地连接到芯片载体的芯片连接区域。 挡板可以有效地防止从粘合剂层释放的气体损害薄膜和固定层之间的粘结。 因此，几乎不形成气泡，并且保持薄膜和附着层之间良好的电连接。

公开(公告)号：US20070132093A1

公开(公告)日：2007-06-14

申请号：US11420230

申请日：2006-05-25

Applicant: Meng-Jung Chuang ,  Cheng-Yin Lee ,  Wei-Chang Tai ,  Chi-Chih Chu

Inventor： Meng-Jung Chuang ,  Cheng-Yin Lee ,  Wei-Chang Tai ,  Chi-Chih Chu

IPC: H01L23/34

CPC classification number: H01L25/105 ,  H01L23/3128 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K3/284 ,  H05K3/3452 ,  H05K2203/0588 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A system-in-package structure includes a carrier substrate having a molding area and a periphery area, at least a chip disposed in the molding area, an encapsulation covering the chip and the molding area, a plurality of solder pads disposed in the periphery area, and a solder mask disposed in the periphery area and partially exposing the surface of the solder pads. The solder mask includes at least a void therein.

Abstract translation: 系统级封装结构包括具有成型区域和周边区域的载体基板，至少设置在模制区域中的芯片，覆盖芯片和模制区域的封装，设置在外围区域中的多个焊盘 以及设置在周边区域中并部分地暴露焊盘表面的焊接掩模。 焊料掩模至少包括其中的空隙。

公开(公告)号：US07126221B2

公开(公告)日：2006-10-24

申请号：US10868495

申请日：2004-06-14

Applicant: Gwo-Liang Weng ,  Yung-Li Lu ,  Chi-Chih Chu ,  Shih-Chang Lee

Inventor： Gwo-Liang Weng ,  Yung-Li Lu ,  Chi-Chih Chu ,  Shih-Chang Lee

IPC: H01L23/48 ,  H01L23/52 ,  H01L23/40

CPC classification number: H05K3/305 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H05K2201/10734 ,  H05K2203/0545 ,  Y02P70/613 ,  H01L2924/00014

Abstract: A semiconductor package comprising a substrate and a semiconductor device disposed on the substrate by flip-chip bonding. The present invention is characterized by a connection structure disposed between the semiconductor device and the substrate that extends along the periphery of the bottom surface of the semiconductor device. As a result, it can preferably provide additional mounting support between the two. The connection structure can be formed from cured adhesive. The present invention also provides a method of manufacturing the semiconductor package.

Abstract translation: 一种半导体封装，包括通过倒装芯片接合设置在衬底上的衬底和半导体器件。 本发明的特征在于设置在半导体器件和基板之间的连接结构，该连接结构沿着半导体器件的底表面的周边延伸。 结果，它可以优选地在两者之间提供附加的安装支撑。 连接结构可以由固化的粘合剂形成。 本发明还提供一种半导体封装的制造方法。

公开(公告)号：US5844398A

公开(公告)日：1998-12-01

申请号：US260655

申请日：1994-06-16

Applicant: Hing-Hin Kwan ,  Yao-Ching Chen ,  Cheng-Chih Chu ,  Shu-Chin Chen ,  Chun-Sheng Wang

Inventor： Hing-Hin Kwan ,  Yao-Ching Chen ,  Cheng-Chih Chu ,  Shu-Chin Chen ,  Chun-Sheng Wang

IPC: H01M10/44 ,  H01M10/46 ,  H02J7/00

CPC classification number: H02J7/0029 ,  H01M10/46 ,  H02J7/0075 ,  H02J7/0083 ,  H01M10/44 ,  Y02B40/90 ,  Y02E70/40

Abstract: An automatic charging system for charging nickel-metal-hydride batteries is presented. The battery charging system uses a method of detecting the lowest charge current to control its charging process. The system has a constant voltage power supply including a short-circuit protection device, a battery voltage detector, a current detector, a current to voltage converter, a voltage amplifier, an analog to digital converter, a single chip microcomputer, a capacity indicator, a time indicator and a full-charge indicator. The system uses a constant voltage to charge batteries with a floating current according to the quantity of the active ions in the batteries. The battery charge current is converted to a voltage signal which is then amplified and digitized. The microcomputer detects the digitized signal to estimate the magnitude of the charge current. By detecting continuous increase in the charge current, the system determines if the charging process has reached its end and shuts down the power supply at appropriate time. It avoids providing too much input energy and generating extra heat. Therefore, the system has high charging efficiency and is less likely to damage the batteries.

Abstract translation: 介绍了镍氢电池充电自动充电系统。 电池充电系统使用检测最低充电电流来控制其充电过程的方法。 该系统具有恒压电源，包括短路保护装置，电池电压检测器，电流检测器，电流 - 电压转换器，电压放大器，模数转换器，单片机，容量指示器， 时间指示器和满充电指示器。 系统使用恒定电压，根据电池中活性离子的数量，以浮动电流对电池充电。 电池充电电流被转换成电压信号，然后被放大和数字化。 微型计算机检测数字化信号以估计充电电流的大小。 通过检测充电电流的持续增加，系统确定充电过程是否已到达终端，并在适当的时间关闭电源。 它避免提供太多的输入能量和产生额外的热量。 因此，该系统具有高的充电效率，并且不太可能损坏电池。