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    Probe systems including imaging devices with objective lens isolators, and related methods
    31.
    发明授权
    Probe systems including imaging devices with objective lens isolators, and related methods 有权

    公开(公告)号：US11874301B2

    公开(公告)日：2024-01-16

    申请号：US17078778

    申请日：2020-10-23

    Applicant: FormFactor, Inc.

    Inventor： Kazuki Negishi ,  Yu-Wen Huang ,  Gerald Lee Gisler ,  Eric Robert Christenson ,  Michael E. Simmons

    IPC: G01R1/07 ,  G01R31/308 ,  G01R31/319

    CPC classification number: G01R1/07 ,  G01R31/308 ,  G01R31/31905

    Abstract: Probe systems including imaging devices with objective lens isolators and related methods are disclosed herein. A probe system includes an enclosure with an enclosure volume for enclosing a substrate that includes one or more devices under test (DUTs), a testing assembly, and an imaging device. The imaging device includes an imaging device objective lens, an imaging device body, and an objective lens isolator. In examples, the probe system includes an electrical grounding assembly configured to restrict electromagnetic noise from entering the enclosure volume. In examples, methods of preparing the imaging device include assembling the imaging device such that the imaging device objective lens is at least partially electrically isolated from the imaging device body. In some examples, utilizing the probe system includes testing the one or more DUTs while restricting electrical noise from propagating from the imaging device to the substrate.

    Probe systems configured to test a device under test and methods of operating the probe systems
    33.
    发明授权
    Probe systems configured to test a device under test and methods of operating the probe systems 有权

    公开(公告)号：US11598789B2

    公开(公告)日：2023-03-07

    申请号：US17506081

    申请日：2021-10-20

    Applicant: FormFactor, Inc.

    Inventor： Martin Schindler ,  Stefan Kreissig ,  Torsten Kiel

    IPC: G01R1/067 ,  G01R31/00 ,  G01R1/073

    Abstract: Probe systems configured to test a device under test and methods of operating the probe systems are disclosed herein. The probe systems include an electromagnetically shielded enclosure, which defines an enclosed volume, and a temperature-controlled chuck, which defines a support surface configured to support a substrate that includes the DUT. The probe systems also include a probe assembly and an optical microscope. The probe systems further include an electromagnet and an electronically controlled positioning assembly. The electronically controlled positioning assembly includes a two-dimensional positioning stage, which is configured to selectively position a positioned assembly along a first two-dimensional positioning axis and also along a second two-dimensional positioning axis. The electronically controlled positioning assembly also includes a first one-dimensional positioning stage that operatively attaches the optical microscope to the positioned assembly and a second one-dimensional positioning stage that operatively attaches the electromagnet to the positioning assembly.

    Methods for maintaining gap spacing between an optical probe of a probe system and an optical device of a device under test, and probe systems that perform the methods
    34.
    发明授权
    Methods for maintaining gap spacing between an optical probe of a probe system and an optical device of a device under test, and probe systems that perform the methods 有权

    公开(公告)号：US11204383B2

    公开(公告)日：2021-12-21

    申请号：US16914913

    申请日：2020-06-29

    Applicant: FormFactor, Inc.

    Inventor： Joseph George Frankel

    IPC: G01R31/28 ,  G01R1/067

    Abstract: Methods for maintaining gap spacing between an optical probe of a probe system and an optical device of a device under test and probe systems that perform the methods. The methods include determining a desired relative orientation between the optical probe and the DUT and optically testing the optical device with the optical probe. The methods also include maintaining the desired relative orientation during the optically testing. The maintaining includes repeatedly and sequentially collecting an existing DUT image of a DUT reference structure of the DUT and an existing probe image of a probe reference structure of the optical probe, determining a probe-DUT offset between an existing relative orientation between the optical probe and the DUT and the desired relative orientation, and adjusting the relative orientation to return the optical probe and the DUT to the desired relative orientation.

    METHODS OF PRODUCING AUGMENTED PROBE SYSTEM IMAGES AND ASSOCIATED PROBE SYSTEMS
    35.
    发明申请
    METHODS OF PRODUCING AUGMENTED PROBE SYSTEM IMAGES AND ASSOCIATED PROBE SYSTEMS 有权

    公开(公告)号：US20210373073A1

    公开(公告)日：2021-12-02

    申请号：US17313789

    申请日：2021-05-06

    Applicant: FormFactor, Inc.

    Inventor： Anthony James Lord ,  Gavin Neil Fisher ,  David Randle Hess

    IPC: G01R31/311 ,  G01R31/319

    Abstract: Methods of producing augmented probe system images and associated probe systems. A method of producing an augmented probe system image includes recording a base probe system image, generating the augmented probe system image at least partially based on the base probe system image, and presenting the augmented probe system image. The augmented probe system image includes a representation of at least a portion of the probe system that is obscured in the base probe system image. In some examples, a probe system includes a chuck, a probe assembly, an imaging device, and a controller programmed to perform methods disclosed herein.

    Wiring Substrate With Filled Vias To Accommodate Custom Terminals
    39.
    发明申请
    Wiring Substrate With Filled Vias To Accommodate Custom Terminals 有权
    带填充通孔的接线基板可容纳定制端子

    公开(公告)号：US20170067937A1

    公开(公告)日：2017-03-09

    申请号：US15353324

    申请日：2016-11-16

    Applicant: FormFactor, Inc.

    Inventor： Shawn Powell

    IPC: G01R1/073 ,  H01L21/48 ,  G01R3/00 ,  H05K1/11 ,  H05K3/40 ,  H05K1/02 ,  H01L23/498 ,  H01L21/66

    CPC classification number: G01R1/07378 ,  G01R1/07342 ,  G01R3/00 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/16225 ,  H05K1/0268 ,  H05K1/115 ,  H05K3/4038

    Abstract: A probe card assembly and associated processes of forming them may include a wiring substrate with a first surface and an opposite surface, an electrically conductive first via comprising electrically conductive material extending into the wiring substrate from the opposite surface and ending before reaching the first surface, and a plurality of electrically conductive second vias, and a custom electrically conductive terminal disposed on the first surface such that said custom terminal covers the first via and contacts one of the second vias adjacent to said first via without electrically contacting the first via. Each of the second vias may be electrically conductive from the first surface to the opposite surface. The first via may include electrically insulating material disposed within a hole in the first via.

    Abstract translation: 探针卡组件及其相关联的工艺可以包括具有第一表面和相对表面的布线基板，导电的第一通孔包括从相对表面延伸到布线基板中并在到达第一表面之前结束的导电材料， 以及多个导电的第二通孔以及设置在所述第一表面上的定制导电端子，使得所述定制端子覆盖所述第一通孔，并接触与所述第一通孔相邻的所述第二通孔中的一个，而不与所述第一通孔电接触。 每个第二通孔可以从第一表面到相对表面导电。 第一通孔可以包括设置在第一通孔中的孔内的电绝缘材料。

    Wiring substrate with filled vias to accommodate custom terminals
    40.
    发明授权
    Wiring substrate with filled vias to accommodate custom terminals 有权
    接线基板，带有通孔，以容纳定制端子

    公开(公告)号：US09523715B2

    公开(公告)日：2016-12-20

    申请号：US13856091

    申请日：2013-04-03

    Applicant: FormFactor, Inc.

    Inventor： Shawn Powell

    IPC: G01R1/073

    CPC classification number: G01R1/07378 ,  G01R1/07342 ,  G01R3/00 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/16225 ,  H05K1/0268 ,  H05K1/115 ,  H05K3/4038

    Abstract: A probe card assembly and associated processes of forming them may include a wiring substrate with a first surface and an opposite surface, an electrically conductive first via comprising electrically conductive material extending into the wiring substrate from the opposite surface and ending before reaching the first surface, and a plurality of electrically conductive second vias, and a custom electrically conductive terminal disposed on the first surface such that said custom terminal covers the first via and contacts one of the second vias adjacent to said first via without electrically contacting the first via. Each of the second vias may be electrically conductive from the first surface to the opposite surface. The first via may include electrically insulating material disposed within a hole in the first via.

    Abstract translation: 探针卡组件及其相关联的工艺可以包括具有第一表面和相对表面的布线基板，导电的第一通孔包括从相对表面延伸到布线基板中并在到达第一表面之前结束的导电材料， 以及多个导电的第二通孔以及设置在所述第一表面上的定制导电端子，使得所述定制端子覆盖所述第一通孔，并接触与所述第一通孔相邻的所述第二通孔中的一个，而不与所述第一通孔电接触。 每个第二通孔可以从第一表面到相对表面导电。 第一通孔可以包括设置在第一通孔中的孔内的电绝缘材料。

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