DISPLAY APPARATUS AND DRIVING METHOD THEREOF
    32.
    发明申请
    DISPLAY APPARATUS AND DRIVING METHOD THEREOF 有权
    显示装置及其驱动方法

    公开(公告)号:US20110090447A1

    公开(公告)日:2011-04-21

    申请号:US12976910

    申请日:2010-12-22

    CPC classification number: G02F1/13624 G02F1/136213 G02F2001/134345

    Abstract: A display apparatus including a plurality of gate lines, a data line intersecting the plurality of gate lines; a first pixel unit connected with a n-th gate line of the plurality of gate lines and the data line. A second pixel unit connected with a (n+1)-th gate line of the plurality of gate lines; and a coupling capacitor disposed between the first pixel unit and the second pixel unit, wherein the first pixel unit comprises a first liquid crystal capacitor and a first thin film transistor (TFT), the second pixel unit comprises a second liquid crystal capacitor and a second thin film transistor (TFT), and a source electrode and a drain electrode of the second TFT are connected with both electrodes of the coupling capacitor, respectively.

    Abstract translation: 一种显示装置,包括多条栅极线,与多条栅极线相交的数据线; 与多条栅极线的第n条栅极线和数据线连接的第一像素单元。 与所述多个栅极线中的第(n + 1)栅极线连接的第二像素单元; 以及设置在所述第一像素单元和所述第二像素单元之间的耦合电容器,其中所述第一像素单元包括第一液晶电容器和第一薄膜晶体管(TFT),所述第二像素单元包括第二液晶电容器和第二液晶电容器 薄膜晶体管(TFT),第二TFT的源电极和漏电极分别与耦合电容器的两个电极连接。

    Semiconductor device and method of fabricating the same
    37.
    发明授权
    Semiconductor device and method of fabricating the same 有权
    半导体装置及其制造方法

    公开(公告)号:US07833902B2

    公开(公告)日:2010-11-16

    申请号:US11903575

    申请日:2007-09-24

    Applicant: Jin-won Lee

    Inventor: Jin-won Lee

    Abstract: In a semiconductor device and a method of fabricating the same, the semiconductor device includes a contact pad in a first interlayer insulating layer on a semiconductor substrate, a contact hole in a second interlayer insulating layer on the first interlayer insulating layer, selectively exposing the contact pad, a contact spacer on internal walls of the contact hole, a first contact plug connected to the contact pad exposed by the contact hole having the contact spacer on the internal walls thereof, the first contact plug partially filling the contact hole, a metal silicide layer on a surface of the first contact plug, and a second contact plug on the metal silicide layer and partially filling the remaining portion of the contact hole.

    Abstract translation: 在半导体器件及其制造方法中,半导体器件包括在半导体衬底上的第一层间绝缘层中的接触焊盘,在第一层间绝缘层上的第二层间绝缘层中的接触孔,选择性地暴露接触 焊盘,接触孔的内壁上的接触间隔件,连接到接触垫的第一接触插塞,该接触焊盘由其内壁上具有接触间隔件的接触孔暴露,第一接触插塞部分地填充接触孔,金属硅化物 第一接触插塞的表面上的第二接触插塞和金属硅化物层上的第二接触插塞,并部分地填充接触孔的剩余部分。

    Lead pin for package boards
    40.
    发明申请
    Lead pin for package boards 失效
    封装板引脚

    公开(公告)号:US20100000761A1

    公开(公告)日:2010-01-07

    申请号:US12232316

    申请日:2008-09-15

    Abstract: Provided is a lead pin for package boards including a disk-shaped head of which the diameter increases toward the middle portion thereof and that has a hexagonal vertical cross-sectional shape; and a connection pin that is formed so as to project from the center of the upper surface of the head.

    Abstract translation: 提供一种用于封装板的引脚,包括直径朝向其中间部分增加的圆盘形头部,并且具有六边形垂直横截面形状; 以及形成为从头部的上表面的中心突出的连接销。

Patent Agency Ranking