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公开(公告)号：US20120279647A1
公开(公告)日：2012-11-08
申请号：US13264941
申请日：2010-10-08
CPC分类号： C09J5/06 , B29C65/364 , B29C65/3644 , B29C65/368 , B29C65/3696 , B29C65/4855 , B29C65/5014 , B29C65/5057 , B29C65/8215 , B29C65/8246 , B29C66/1122 , B29C66/43 , B29C66/71 , B29C66/72321 , B29C66/73113 , B29C66/8244 , B29C66/8322 , B29C66/92445 , B29C66/929 , B29C66/949 , B29C66/954 , B29C66/959 , B29C66/9592 , B29K2995/0008 , C09J7/28 , B29K2069/00 , B29K2067/006 , B29K2067/003 , B29K2067/00 , B29K2055/02 , B29K2033/12 , B29K2027/06 , B29K2023/12
摘要： A method glues a heat-activated glueable surface element to an adhesive substrate which does not conduct electric current, whereby a surface thereof has only a low thermal conductivity. The heat-activated glueable surface element has an electrically conductive layer in addition to a heat-activated adhesive mass. The layer is inductively heated for a short time in an alternating magnetic field at a frequency from a middle frequency range. A high pressure of at least 1 MPa is exerted on the gluing surface simultaneously to the inductive heating, whereby preventing thermal decomposition reactions is possible. Further, a device performs the method and has an induction heater integrated in a press tool.
摘要翻译： 一种将热激活的可胶合表面元件粘合到不传导电流的粘合剂基底上，由此其表面仅具有低导热性。 热活化的可胶合表面元件除了热活化的粘合剂块之外还具有导电层。 该层在交变磁场中以中频范围的频率感应加热短时间。 至少1MPa的高压力与感应加热同时施加在胶合表面上，从而防止热分解反应。 此外，设备执行该方法并且具有集成在压制工具中的感应加热器。
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公开(公告)号：US20120064318A1
公开(公告)日：2012-03-15
申请号：US13264355
申请日：2010-04-08
CPC分类号： B32B27/08 , B32B15/08 , H01L51/448 , H01L51/5256 , H01L2251/5338 , H01M14/005 , Y10T428/24975
摘要： A novel, transparent, non-substrate-based permeation barrier film for encapsulating electronic, more particularly optoelectronic, assemblies consists of a first polymer layer (10), a first inorganic barrier layer (20), at least one at least partially organic compensation layer (30), at least one further inorganic barrier layer (21) and also at least one further polymer layer (11), wherein the polymer layers and the inorganic barrier layers, respectively, can be made of the same or different material, wherein the inorganic barrier layers have a thickness of between 2 and 1000 nm, and wherein the polymer layers and the at least partially organic compensation layer have a thickness of less than 5 [mu]m, preferably between 0.5 and 4 [mu]m. The film can have, on one or both sides, an auxiliary carrier attached by means of a re-releasable adhesive. It is also possible for a plurality of films to be laminated to one another by means of a further at least partially organic compensation layer.
摘要翻译： 用于封装电子，更具体地，光电子组件的新颖的，透明的，非基底的渗透阻挡膜由第一聚合物层（10），第一无机阻挡层（20），至少一个至少部分有机补偿层 （30），至少一个另外的无机阻挡层（21）和至少一个另外的聚合物层（11），其中聚合物层和无机阻挡层分别可以由相同或不同的材料制成，其中 无机阻挡层具有2至1000nm的厚度，并且其中聚合物层和至少部分有机补偿层具有小于5μm，优选0.5至4μm的厚度。 该膜可以在一侧或两侧上具有通过可再剥离粘合剂附着的辅助载体。 还可以通过另外的至少部分有机补偿层将多个膜彼此层压。
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公开(公告)号：US20110193010A1
公开(公告)日：2011-08-11
申请号：US12993887
申请日：2009-09-23
IPC分类号： C09K5/00
CPC分类号： C09J133/06 , F28D20/02 , F28F2013/006 , F28F2275/025 , Y02E60/145
摘要： Highly cohesive, thermally conductive adhesive mass, comprising a polymer and aluminum oxide particles, in which more than 95 wt. % of the aluminum oxide particles are alpha aluminum oxide.
摘要翻译： 高度内聚的导热粘合剂组合物，其包含聚合物和氧化铝颗粒，其中大于95wt。 ％的氧化铝颗粒是α氧化铝。
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公开(公告)号：US20110168376A1
公开(公告)日：2011-07-14
申请号：US12995583
申请日：2009-09-23
CPC分类号： C09J133/06 , C08K3/22 , C08K3/38 , F28D20/02 , F28F2013/006 , Y02E60/145 , Y10T29/4935 , Y10T428/25 , Y10T428/254 , Y10T428/257 , Y10T428/26
摘要： A heat conduction composition is proposed, comprising at least one polymer and a heat-conducting auxiliary material that has an especially high heat conductivity and at the same time has a high mechanical strength. To this end, the heat-conducting auxiliary material comprises particles that in turn are made up of primary particles and that have a mass-specific surface area of 1.3 m2/g or less. Also described are a heat-conducting surface element manufactured from said heat conduction composition as well as application possibilities thereof.
摘要翻译： 提出了一种导热组合物，其包括至少一种聚合物和导热辅助材料，其具有特别高的导热性，同时具有高的机械强度。 为此，导热辅助材料包括颗粒，其又由初级颗粒组成并且具有1.3m 2 / g或更小的质量比表面积。 还描述了由所述导热组合物制造的导热表面元件及其应用可能性。
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公开(公告)号：US20100148127A1
公开(公告)日：2010-06-17
申请号：US12634944
申请日：2009-12-10
IPC分类号： H01B1/00 , B32B27/32 , C08F210/00 , F21V9/06
CPC分类号： H01L51/107 , C08L23/22 , C08L2666/06 , C09J123/142 , H01L31/0481 , H01L51/448 , H01L51/5246 , Y02E10/549
摘要： A method for encapsulating an electronic, optionally optoelectronic, arrangement against permeants, in which a pressure-sensitive adhesive composition based on a partly crystalline polyolefin is applied onto and/or around the regions of the electronic arrangement which are to be encapsulated, wherein the polyolefin has a density between 0.86 and 0.89 g/cm and a crystallite melting point of at least 90° C.
摘要翻译： 一种用于将电子的，可选地光电子的装置封装在透过物中的方法，其中将基于部分结晶聚烯烃的压敏粘合剂组合物施加到待包封的电子装置的区域上和/或周围，其中聚烯烃 具有0.86至0.89g / cm 3的密度和至少90℃的微晶熔点。
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公开(公告)号：US20100068514A1
公开(公告)日：2010-03-18
申请号：US12549767
申请日：2009-08-28
IPC分类号： B32B27/06 , B32B37/14 , C09J153/00 , B05D5/12
CPC分类号： H01L51/5246 , C08L2666/02 , C09J153/02 , C09J153/025 , Y10T428/2835
摘要： The present invention relates to a method for encapsulating an electronic arrangement against permeants, in which a pressure-sensitive adhesive composition based on vinylaromatic block copolymers is provided, and in which the pressure-sensitive adhesive composition is applied onto and/or around the regions of the electronic arrangement which are to be encapsulated.
摘要翻译： 本发明涉及一种用于将电子装置封装在透气体中的方法，其中提供了基于乙烯基芳族嵌段共聚物的压敏粘合剂组合物，其中将压敏粘合剂组合物施加到和/ 要封装的电子装置。
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公开(公告)号：US06551704B2
公开(公告)日：2003-04-22
申请号：US08905905
申请日：1997-08-04
申请人： Peter Himmelsbach , Peter Jauchen , Andreas Albrod , Arthur-Hugh Andrews , Klaus Keite-Telgenbüscher , Reiner Leutz , Christian Scharnhorst , Thorsten Stradt , Andreas B. Kummer , Sebastian Trotter
发明人： Peter Himmelsbach , Peter Jauchen , Andreas Albrod , Arthur-Hugh Andrews , Klaus Keite-Telgenbüscher , Reiner Leutz , Christian Scharnhorst , Thorsten Stradt , Andreas B. Kummer , Sebastian Trotter
IPC分类号： B32B712
CPC分类号： C09J153/00 , A61L15/58 , A61L15/585 , C08L53/00 , C09J7/38 , C09J191/06 , C09J2201/28 , C09J2453/00 , Y10T428/28 , Y10T428/2826 , Y10T442/2754
摘要： Backing materials which have been given a self-adhesive treatment on at least one side, characterized in that the self-adhesive composition is a pressure-sensitive hotmelt adhesive composition which at a frequency of 0.1 rad/s has a dynamic-complex glass transition temperature of less than −3° C., preferably from −6° C. to −30° C. and, with particular preference, from −9° C. to −25° C., and their use, in particular, for producing medical products such as plasters, bandages or dressings.
摘要翻译： 在至少一侧已经进行了自粘合处理的背衬材料，其特征在于，所述自粘合组合物是压敏热熔粘合剂组合物，其在0.1rad / s的频率下具有动态复合玻璃化转变温度 小于-3℃，优选为-6℃至-30℃，特别优选为-9℃至-25℃，并且特别优选用于生产 医疗产品如膏药，绷带或敷料。
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