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公开(公告)号：US20240304382A1
公开(公告)日：2024-09-12
申请号：US18376102
申请日：2023-10-03
发明人： Sangyeop Kim , Kihun Jeon , Beomjoon Cho
摘要： An electronic component including: a ceramic main body; first and second external electrodes respectively provided on two opposite end surfaces spaced apart from each other in a longitudinal direction of the ceramic main body; a first metal frame including a first junction part joined to the first external electrode, a first support part extending from the first junction part in the longitudinal direction of the ceramic main body and configured to support the first external electrode, a first base part parallel to the first support part, and a first connection part configured to connect the first support part and the first base part, wherein the first connection part is connected to a point spaced apart from one end of the first support part along the longitudinal direction of the ceramic main body.
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公开(公告)号：US12089337B2
公开(公告)日：2024-09-10
申请号：US17683569
申请日：2022-03-01
发明人： Jun Oh Hwang
CPC分类号： H05K1/183 , H05K1/0298 , H05K1/115 , H05K1/185 , H05K2201/09036
摘要： A circuit board includes a core portion including a first cavity formed in one surface, and a second cavity formed in the other surface opposing the one surface and having a diameter different from a diameter of the first cavity; a first metal layer disposed on the one surface of the core portion; a second metal layer buried in the core portion; and a third metal layer disposed on the other surface of the core portion, wherein each of the first and second cavities of the core portion exposes at least a portion of the second metal layer.
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公开(公告)号：US12087509B2
公开(公告)日：2024-09-10
申请号：US17725246
申请日：2022-04-20
发明人： Gyu Ho Yeon , Won Kuen Oh , Seo Won Jung
CPC分类号： H01G4/2325 , H01G4/30
摘要： A multilayer ceramic capacitor includes a body including a dielectric layer and internal electrodes and external electrodes disposed on one surface of the body, wherein the external electrodes respectively include a first electrode layer connected to the internal electrodes and including copper (Cu); a second electrode layer disposed on the first electrode layer and including silver (Ag) and palladium (Pd); and a copper-palladium intermetallic compound formed at an interface between the first electrode layer and the second electrode layer, wherein the second electrode layer includes a first layer and a second layer formed to be sequentially adjacent to the first electrode layer, and the first layer has a content of palladium higher than a content of palladium of the second layer.
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34.发明公开公开(公告)号：US20240298409A1
公开(公告)日：2024-09-05
申请号：US18386963
申请日：2023-11-03
发明人： Jong-Seok Na , Yunje Ji , Yonghoon Kim , Seungeun Lee
CPC分类号： H05K1/181 , H05K1/185 , H05K3/4007 , H05K3/4697 , H05K3/0017
摘要： The present disclosure provides a circuit board including: an insulating layer; a circuit wire disposed in a first area inside the insulating layer, a first conductive pad connected to the circuit wire and having an upper surface protruding above an upper surface of the insulating layer and a lower surface embedded in the insulating layer; and a circuit element disposed to have a boundary surface parallel to the upper surface of the insulating layer in a second area different from the first area inside the insulating layer and including an element pad.
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公开(公告)号：US20240298407A1
公开(公告)日：2024-09-05
申请号：US18380906
申请日：2023-10-17
发明人： Gyumook Kim , Sanghoon Kim , Young Kuk Ko
CPC分类号： H05K1/145 , H05K1/112 , H05K1/117 , H05K1/144 , H05K3/301 , H05K3/36 , H05K2201/10689 , H05K2201/2009 , H05K2203/304
摘要： A connecting board according to an embodiment includes a core layer having a cavity in a thickness direction to pass through an inner center region of the core layer based on a plane perpendicular to the thickness direction, a via passing through the core layer, and connection pads that are coupled to both ends of the via. The core layer includes coupling ribs which protrude from an inner surface of the core layer facing the cavity toward the cavity.
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36.发明公开公开(公告)号：US20240295746A1
公开(公告)日：2024-09-05
申请号：US18661002
申请日：2024-05-10
发明人： Ah Hyeon IM , Bong Won JEONG , Nam Ki PARK , Ta Kyoung LEE
CPC分类号： G02B27/646 , G02B7/021 , G02B7/08 , G02B7/09 , G02B13/0065 , G02B26/0816 , G03B5/00 , G03B17/17 , G03B2205/0023 , G03B2205/003 , G03B2205/0069
摘要： A reflecting module for optical image stabilization (OIS) includes a housing; a rotation holder provided in the housing and comprising a reflecting member; a rotation plate provided in the housing between an inner wall of the housing and the rotation holder so that the rotation holder is supported by the inner wall of the housing via the rotation plate; and a driving part configured to apply a driving force to the rotation holder to move the rotation holder.
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公开(公告)号：US20240292529A1
公开(公告)日：2024-08-29
申请号：US18399156
申请日：2023-12-28
发明人： Inhwan Oh , Sanghoon Kim , Chulmin Lee , Chanhoon Ko , Kyounghee Lim , Sohyun Bae
CPC分类号： H05K1/0298 , H05K1/111 , H05K3/06 , H05K2201/10378 , H05K2201/10734
摘要： The disclosed circuit board includes: a substrate portion that includes a first insulation layer and a first wiring layer buried by the first insulation layer, and a first element mounting portion and a second element mounting portion disposed on an upper surface of the substrate portion; a first protective layer disposed on the substrate portion; and an auxiliary layer that is disposed to overlap at least a part of a boundary area including a region between the first element mounting portion and the second element mounting portion, and has higher strength than the first protective layer.
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公开(公告)号：US20240290949A1
公开(公告)日：2024-08-29
申请号：US18026655
申请日：2022-12-09
发明人： Myungjin Jung , Taehoon Kim , Minsoo Kim
IPC分类号： H01M4/36 , H01M10/058 , H01M50/449 , H01M50/466
CPC分类号： H01M4/366 , H01M10/058 , H01M50/449 , H01M50/466
摘要： An all-solid-state battery includes an electrode layer including a current collector extending in a plane direction and an electrode active material layer disposed on at least one surface of the current collector, and a solid electrolyte layer disposed adjacent to the electrode layer in a stacking direction perpendicular to the plane direction, in which the electrode active material layer includes an extension portion extending in the stacking direction and having a portion disposed adjacent to a neighboring electrode active material layer in the plane direction.
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公开(公告)号：US20240290542A1
公开(公告)日：2024-08-29
申请号：US18410179
申请日：2024-01-11
发明人： Jin Yeop YOO , Young Hoon SONG , Dong Ju KIM
CPC分类号： H01G4/1227 , H01G4/30 , H01G4/012 , H01G4/2325
摘要： A multilayer electronic component includes: a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; and an external electrode disposed on the body, in which the body includes a capacitance formation portion and margin portions disposed on both surfaces of the capacitance formation portion in a width direction, the margin portions include a first region adjacent to the capacitance formation portion, a third region adjacent to an external surface of the margin portion, and a second region disposed between the first and third regions, and G2>G1 and G2>G3 when an average grain size of a dielectric grain included in the first region is referred to as G1, an average grain size of a dielectric grain included in the second region is referred to as G2, and an average grain size of a dielectric grain included in the third region is referred to as G3.
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公开(公告)号：US12072510B2
公开(公告)日：2024-08-27
申请号：US17332233
申请日：2021-05-27
发明人： Ga Yeon Ju , Yeun Ho Jung , Jung Kyun Cho , Yong Joo Jo
CPC分类号： G02B27/646 , G02B5/003 , G02B13/0065 , G02B27/0018 , G03B13/36
摘要： A camera module includes a housing including an opening and configured to accommodate an optical path conversion unit and a lens module, a shielding member configured to shield the opening of the housing, and a reflection reducing member disposed on an inner surface of the shielding member and configured to reduce internal reflections from the inner surface of the shielding member occurring between an end of the lens module and an image sensor.
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