Abstract:
A semiconductor light emitting apparatus includes a solid-state light emitting device and a wavelength converter that converts primary light emitted by the solid-state light emitting device into secondary light at a loner-wavelength. The wavelength converter is an inorganic compact that includes a transparent wavelength conversion layer containing phosphor having a garnet crystal structure. The phosphor contains a constituent element group composed of at least one element selected from the group consisting of Mg, Ca, Sr, Ba, Y, La, Gd, Tb, and Lu. Part of the constituent element group is substituted by Ce3+ and the amount of Ce+ is 1 atomic % less of the entire constituent element group. As a result, a high-power and highly reliable semiconductor light emitting apparatus suitable as a point light source is provided. In addition, such a semiconductor light emitting apparatus is manufactured through a simple application of traditionally used practical technicians.
Abstract:
A light-emitting device includes a phosphor layer containing a phosphor and a light-emitting element. The light-emitting element has an emission peak at 360 nm to less than 500 nm, and the phosphor is excited with light emitted by the light-emitting element. The light emitting device contains light-emitting component light emitted by the phosphor as output light. The phosphor contains a nitride phosphor or an oxynitride phosphor and alkaline-earth metal orthosilicate phosphor that are activated with Eu2+. The nitride phosphor or the oxynitride phosphor has an emission peak at 600 nm to less than 660 nm, and the alkaline-earth metal orthosilicate phosphor has the emission peak at 500 nm to less than 600 nm. An internal quantum efficiency of each phosphor is at least 80% under the excitation with light emitted by the light-emitting element.
Abstract:
A semiconductor light-emitting device of the present invention includes at least one conductor A, that is patterned electrode, 2a, a conductor B, that is patterned electrode, 2b, and a solid-state light-emitting element 3 on one side of an insulating heat dissipating substrate 1. The solid-state light-emitting element 3 is mounted on the conductor A 2a but is not mounted on the conductor B 2b. The solid-state light-emitting element 3 is mounted in such a manner that the whole lower surface that is a surface opposing to a main light extraction surface of the solid-state light-emitting element 3 adheres to the conductor A 2a. When a mounting surface of the solid-state light-emitting element 3 is viewed from above, the conductor A 2a has an element mounting area on which the whole lower surface of the solid-state light-emitting element 3 is mounted and a plurality of outflow-adhesive capturing areas that are provided adjacent to the periphery of the element mounting area without directional bias with respect to the periphery of the element mounting area. The conductor B 2b is disposed in a portion adjacent to the periphery of the element mounting area other than the outflow-adhesive capturing areas while being electrically separated from the conductor A 2a. In this manner, a semiconductor light-emitting device can be provided that can be produced using orthodox practical techniques, can have high output power, can be mounted with high density, and can be designed with consideration given to the case of lighting failures.
Abstract:
A chip-type light-emitting semiconductor device includes: a substrate 4; a blue LED 1 mounted on the substrate 4; and a luminescent layer 3 made of a mixture of yellow/yellowish phosphor particles 2 and a base material 13 (translucent resin). The yellow/yellowish phosphor particles 2 is a silicate phosphor which absorbs blue light emitted by the blue LED 1 to emit a fluorescence having a main emission peak in the wavelength range from 550 nm to 600 nm, inclusive, and which contains, as a main component, a compound expressed by the chemical formula: (Sr1-a1-b1-xBaa1Cab1Eux)2SiO4 (0≦a1≦0.3, 0≦b1≦0.8 and 0
Abstract:
A nitridosilicate-based compound is produced by reacting an alkaline-earth metal compound capable of generating an alkaline-earth metal oxide by heating or a rare earth compound capable of generating a rare earth oxide by heating with at least a silicon compound, while the alkaline-earth metal compound or the rare earth compound is being reduced and nitrided by the reaction with carbon in an atmosphere of nitriding gas. Because of this, a nitridosilicate-based compound of high quality can be produced industrially at low cost.
Abstract:
A light-emitting device is produced using a phosphor composition containing a phosphor host having as a main component a composition represented by a composition formula: aM3N2.bAlN.cSi3N4, where “M” is at least one element selected from the group consisting of Mg, Ca, Sr, Ba, and Zn, and “a”, “b”, and “c” are numerical values satisfying 0.2≦a/(a+b)≦0.95, 0.05≦b/(b+c)≦0.8, and 0.4≦c/(c+a)≦0.95. This enables a light-emitting device emitting white light and satisfying both a high color rendering property and a high luminous flux to be provided.
Abstract translation:使用荧光体组合物制造发光装置,该荧光体组合物含有作为主要成分的荧光体主体,其组成如下:组成式:aM 3 N 2 N b B n N c Si 3“,其中”M“为选自Mg,Ca,Sr,Ba和Zn中的至少一种元素,”a“,” b“和”c“是满足0.2 <= a /(a + b)<= 0.95,0.05 <= b /(b + c)<= 0.8和0.4 <= c /(c + <= 0.95。 这使得能够提供发出白光的发光装置,同时满足高显色性和高光通量。
Abstract:
A light-emitting device is produced using a phosphor composition containing a phosphor host having as a main component a composition represented by a composition formula: aM3N2.bAlN.cSi3N4, where “M” is at least one element selected from the group consisting of Mg, Ca, Sr, Ba, and Zn, and “a”, “b”, and “c” are numerical values satisfying 0.2≦a/(a+b)≦0.95, 0.05≦b/(b+c)≦0.8, and 0.4≦c/(c+a)≦0.95. This enables a light-emitting device emitting white light and satisfying both a high color rendering property and a high luminous flux to be provided.
Abstract translation:使用荧光体组合物制造发光装置,该荧光体组合物含有作为主要成分的荧光体主体,其组成如下:组成式:aM 3 N 2 N b B n N c Si 3“,其中”M“为选自Mg,Ca,Sr,Ba和Zn中的至少一种元素,”a“,” b“和”c“是满足0.2 <= a /(a + b)<= 0.95,0.05 <= b /(b + c)<= 0.8和0.4 <= c /(c + <= 0.95。 这使得能够提供发出白光的发光装置,同时满足高显色性和高光通量。
Abstract:
The semiconductor light emitting device is composed of a combination of a near ultraviolet LED and a phosphor layer including a plurality of phosphors for absorbing near ultraviolet emitted by the near ultraviolet LED and for emitting fluorescence having an emission peak in a visible wavelength region, and the phosphor layer includes four kinds of phosphors, that is, a blue-based phosphor, a green-based phosphor, a red-based phosphor and a yellow-based phosphor. Thus, lowering of luminous flux derived from red-based light with low luminosity is compensated by yellow-based light with comparatively high luminosity, and the resultant white-based light can be well color balanced, and hence, a semiconductor light emitting device emitting white-based light with high luminous flux and a large Ra can be obtained.
Abstract:
A chip-type light-emitting semiconductor device includes: a substrate 4; a blue LED 1 mounted on the substrate 4; and a luminescent layer 3 made of a mixture of yellow/yellowish phosphor particles 2 and a base material 13 (translucent resin). The yellow/yellowish phosphor particles 2 is a silicate phosphor which absorbs blue light emitted by the blue LED 1 to emit a fluorescence having a main emission peak in the wavelength range from 550 nm to 600 nm, inclusive, and which contains, as a main component, a compound expressed by the chemical formula: (Sr1-a1-b1-xBaa1Cab1Eux)2SiO4 (0≦a1≦0.3, 0≦b1≦0.8 and 0
Abstract translation:芯片型发光半导体器件包括:基板4; 安装在基板4上的蓝色LED1; 以及由黄色/黄色荧光体颗粒2和基材13(半透明树脂)的混合物制成的发光层3。 黄/黄色荧光体颗粒2是一种硅酸盐荧光体,其吸收由蓝色LED1发射的蓝色光,以发射在550nm至600nm的波长范围内具有主发光峰的荧光,并且其包含作为主要 组分,由化学式表示的化合物:(Sr 1-a 1-b 1-x Ba)a a1 Ca 2 Sb x x (0 <= a1 <= 0.3,0 <= b1 <= 0.8和0
Abstract:
A light emission apparatus that can restrict deterioration of resin used for the light emission apparatus, and that has a reasonable structure fit for actual use is provided, in which a light reflective layer is provided to cover the side surfaces of the chips 26 provided in the concave 2a. According to this, excitation light reflected by the phosphor layer 32, such as ultraviolet light, is reflected again by the light reflective layer 27. Therefore, the excitation light will not reach the resin layer 21, thereby restraining the deterioration of the resin. Moreover, the light reflective layer 27 covers the side surfaces of the chips 26, thereby efficiently conducting the heat emitted from the chips 26 to the metal substrate 20 via the resin layer 21. This improves the heat-dissipation efficiency of the chips 26.