摘要:
A resin-sealing mold for sealing a semiconductor element with resin includes an upper die (12), a lower die (14) disposed so as to be opposed to the upper die (12), and a plurality of middle dies (13a, 13b) sandwiched between the upper die (12) and the lower die (14), wherein the plurality of middle dies (13a, 13b) are provided with molding faces at tip ends and are placed so that the molding faces are opposed to each other during the sealing. Because of this, the middle dies (13a, 13b) can be opened to the right and left from dividing faces I, and even a resin package of a semiconductor device with a concave part formed in a side surface can be molded.
摘要:
A semiconductor light-emitting device 10 has a semiconductor chip 12 for emitting light having a wavelength in blue to ultraviolet regions, and a sealing portion 16 formed in at least a partial region on a passage path on which the light is passed. The sealing portion 16 includes a sealing material 16d which is a composite material including a matrix material 16a made of a resin, nano-particles 16b made of an inorganic material which are distributed in the matrix material 16a, the nano-particle 16b having an effective particle size which is ¼ or less of the wavelength of the light in the matrix material 16a, and a fluorescent material 16c.
摘要:
There is provided a light emitting device having a small area for mounting. The light emitting device of the invention includes a light emitting element having an electric signal terminal, that is driven to emit light by an electric signal given to the electric signal terminal from outside, and a semiconductor chip for driving the light emitting element, having a light emitting element drive circuit that is made of a semiconductor, outputs and applies the electric signal to the electric signal terminal. The light emitting elements are mounted on the surface of the semiconductor chip for driving the light emitting element, and a conductive path is provided for mutually connecting a plurality of light emitting elements on the surface of the semiconductor chip for driving the light emitting element.
摘要:
A linear light source includes light emitting elements 5 which are arranged on a square rod-shaped printed board 4 along the longitudinal direction thereof and reflectors 6 which are arranged alternately with the light emitting elements 5. The opposing surfaces 6a of the reflectors 6 sandwiching the light emitting element are inclined such that the distance between the opposing surfaces of the reflectors increases in the direction of light emitted from the light emitting element 5. The linear light source further includes resin seal layers 10 which are in the form of a trapezoidal prism or a truncated pyramid and formed by filling recesses, each of which is defined by the printed board 4, light emitting element 5 and reflectors 6, with a light-transmissive resin sealant. A strip-shaped reflection member made of a reflection sheet 1 or a vapor-deposited film 12 is arranged to cover a region ranging from the end face of the printed board 4 adjoining to the component side to the tips of the reflectors 6.
摘要:
This invention provides an expansion valve combined with a solenoid valve which prevents a water hammer phenomenon from occurring when a refrigerant passage is opened and closed by the solenoid valve. Refrigerant passages (P1, P2) are formed in a valve body (1) between a primary port (1a) and a secondary port (1b). The solenoid valve (V) attached to the valve body (1) opens and closes the refrigerant passages (P1, P2) in their intermediate portion. An expansion valve disk (6)--which is moved by the action of a diaphragm (8) that defines an outer pressure chamber (R2) communicating to a temperature sensing cylinder (E) and an inner pressure chamber (R1)--is brought into and out of engagement with a valve seat (S1) formed on the primary port (1a) side of the refrigerant passage (P1). The secondary port (1b) side and the inner pressure chamber (R1) are communicated via an inner pressure equalizing hole (15) formed in the valve body (1).
摘要:
A light-emitting device (1) having a base (10) and a light-emitting element (11) placed on the base (10) includes a first sealing material layer (12) covering the light-emitting element (11) and a second sealing material layer (13) surrounding a side surface of the first sealing material layer (12), wherein the refractive index of the first sealing material layer (12) and the refractive index of the second sealing material layer (13) are different from each other. The light-emitting device (1) is capable of controlling a radiation pattern from the light-emitting element (11) by controlling the refractive index of the first sealing material layer (12) and the refractive index of the second sealing material layer (13). This can facilitate the miniaturization and reduction in thickness of the light-emitting device (1), and prevent the decrease in a light output efficiency of the light-emitting device (1).
摘要:
A linear light source includes light emitting elements 5 which are arranged on a square rod-shaped printed board 4 along the longitudinal direction thereof and reflectors 6 which are arranged alternately with the light emitting elements 5. The opposing surfaces 6a of the reflectors 6 sandwiching the light emitting element are inclined such that the distance between the opposing surfaces of the reflectors increases in the direction of light emitted from the light emitting element 5. The linear light source further includes resin seal layers 10 which are in the form of a trapezoidal prism or a truncated pyramid and formed by filling recesses, each of which is defined by the printed board 4, light emitting element 5 and reflectors 6, with a light-transmissive resin sealant. A strip-shaped reflection member made of a reflection sheet 1 or a vapor-deposited film 12 is arranged to cover a region ranging from the end face of the printed board 4 adjoining to the component side to the tips of the reflectors 6.
摘要:
A chip-type light-emitting semiconductor device includes: a substrate 4; a blue LED 1 mounted on the substrate 4; and a luminescent layer 3 made of a mixture of yellow/yellowish phosphor particles 2 and a base material 13 (translucent resin). The yellow/yellowish phosphor particles 2 is a silicate phosphor which absorbs blue light emitted by the blue LED 1 to emit a fluorescence having a main emission peak in the wavelength range from 550 nm to 600 nm, inclusive, and which contains, as a main component, a compound expressed by the chemical formula: (Sr1−a1−b1−xBaa1Cab1Eux)2SiO4 (0≦a1≦0.3, 0≦b1≦0.8 and 0
摘要翻译:芯片型发光半导体器件包括:基板4; 安装在基板4上的蓝色LED1; 以及由黄色/黄色荧光体颗粒2和基材13(半透明树脂)的混合物制成的发光层3。 黄/黄色荧光体颗粒2是一种硅酸盐荧光体,其吸收由蓝色LED1发射的蓝色光,以发射在550nm至600nm的波长范围内具有主发光峰的荧光,并且其包含作为主要 组分,由化学式表示的化合物:(Sr 1-a 1-b 1-x Ba)a a1 Ca 2 Sb x x (0 <= a1 <= 0.3,0 <= b1 <= 0.8和0
摘要:
A light-emitting diode 1 according to the present invention includes: a semiconductor light-emitting device 4 mounted on the surface of lead frames 2 and 3; and a transparent resin package 5 covering the front side of the semiconductor light-emitting device 4. A convex lens portion 8 for concentrating light emitted from the semiconductor light-emitting device 4 toward the front is provided in a surface part of the resin package 5. A circular flat portion 11 for diffusing light emitted from the semiconductor light-emitting device 4 toward the sides is provided in a part of the convex lens portion 8 intersecting the optical axis of the convex lens portion 8. Part of the convex lens portion 8 surrounding the circular flat portion 11 is a convex-lens side face. A recess 7 whose side wall is partly the convex-lens side face is provided to surround the convex lens portion.
摘要:
A chip-type light-emitting semiconductor device includes: a substrate 4; a blue LED 1 mounted on the substrate 4; and a luminescent layer 3 made of a mixture of yellow/yellowish phosphor particles 2 and a base material 13 (translucent resin). The yellow/yellowish phosphor particles 2 is a silicate phosphor which absorbs blue light emitted by the blue LED 1 to emit a fluorescence having a main emission peak in the wavelength range from 550 nm to 600 nm, inclusive, and which contains, as a main component, a compound expressed by the chemical formula: (Sr1-a1-b1-xBaa1Cab1Eux)2SiO4 (0≦a1≦0.3, 0≦b1≦0.8 and 0
摘要翻译:芯片型发光半导体器件包括:基板4; 安装在基板4上的蓝色LED1; 以及由黄色/黄色荧光体颗粒2和基材13(半透明树脂)的混合物制成的发光层3。 黄/黄色荧光体颗粒2是一种硅酸盐荧光体,其吸收由蓝色LED1发射的蓝色光,以发射在550nm至600nm的波长范围内具有主发光峰的荧光,并且其包含作为主要 组分,由化学式表示的化合物:(Sr 1-a 1-b 1-x Ba)a a1 Ca 2 Sb x x (0 <= a1 <= 0.3,0 <= b1 <= 0.8和0