公开(公告)号：US5578249A

公开(公告)日：1996-11-26

申请号：US442225

申请日：1995-05-16

Applicant: Akira Ohtani ,  Yoshihiro Uetani ,  Masao Abe ,  Yasuhito Funada ,  Keisuke Kii

Inventor： Akira Ohtani ,  Yoshihiro Uetani ,  Masao Abe ,  Yasuhito Funada ,  Keisuke Kii

IPC: C08G73/02 ,  C08L79/02 ,  H01B1/12 ,  B05B5/12

CPC classification number: C08G73/0266 ,  C08L79/02 ,  H01B1/128

Abstract: An organic polymer solution composition and a process for producing an electrically conductive organic polymer using the composition are disclosed. The composition comprising in organic polymer having an imino-p-phenylene structural unit represented by formula (I): ##STR1## as the main repeating unit, a protonic acid salt, and an organic solvent, the polymer and the salt being dissolved in the organic solvent.

Abstract translation: 公开了一种有机聚合物溶液组合物和使用该组合物制备导电有机聚合物的方法。 该组合物包含在由式（I）表示的亚氨基对亚苯基结构单元作为主要重复单元的有机聚合物中，质子酸盐和有机溶剂，聚合物和盐溶于 有机溶剂。

公开(公告)号：US07501581B2

公开(公告)日：2009-03-10

申请号：US11634868

申请日：2006-12-07

Applicant: Yasuhito Funada ,  Jun Ishii

Inventor： Yasuhito Funada ,  Jun Ishii

IPC: H05K1/00

CPC classification number: H05K1/0269 ,  H05K1/056 ,  H05K3/44 ,  H05K2201/0338 ,  H05K2201/0347 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2203/0723

Abstract: A wired circuit board and a producing method thereof are provided which can precisely form an insulating layer and reduce transmission loss with a simple layer structure and also features excellent long-term reliability by preventing the occurrence of an ion migration phenomenon between a ground layer and a positioning mark layer, and the insulating layer to improve the adhesion therebetween and the conductivity of a conductor. A metal supporting board is prepared and a first metal thin film is formed on the metal supporting board. A resist is formed in a pattern and a ground layer and a positioning mark layer are formed on the first metal thin film exposed from the resist at the same time. A second metal thin film is formed over the ground layer and the positioning mark layer, then the resist is removed. An insulating base layer is formed on the first metal thin film including the upper surface of the second metal thin film, thereafter, a conductive pattern is formed on the insulating base layer.

公开(公告)号：US20070131449A1

公开(公告)日：2007-06-14

申请号：US11634868

申请日：2006-12-07

Applicant: Yasuhito Funada ,  Jun Ishii

Inventor： Yasuhito Funada ,  Jun Ishii

IPC: H05K1/00

CPC classification number: H05K1/0269 ,  H05K1/056 ,  H05K3/44 ,  H05K2201/0338 ,  H05K2201/0347 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2203/0723

Abstract: A wired circuit board and a producing method thereof are provided which can precisely form an insulating layer and reduce transmission loss with a simple layer structure and also features excellent long-term reliability by preventing the occurrence of an ion migration phenomenon between a ground layer and a positioning mark layer, and the insulating layer to improve the adhesion therebetween and the conductivity of a conductor. A metal supporting board is prepared and a first metal thin film is formed on the metal supporting board. A resist is formed in a pattern and a ground layer and a positioning mark layer are formed on the first metal thin film exposed from the resist at the same time. A second metal thin film is formed over the ground layer and the positioning mark layer, then the resist is removed. An insulating base layer is formed on the first metal thin film including the upper surface of the second metal thin film, thereafter, a conductive pattern is formed on the insulating base layer.

Abstract translation: 提供一种布线电路板及其制造方法，其可以精确地形成绝缘层，并且以简单的层结构减小传输损耗，并且还通过防止接地层和接地层之间的离子迁移现象的发生而具有优异的长期可靠性 定位标记层和绝缘层，以改善其间的粘附性和导体的导电性。 制备金属支撑板，在金属支撑板上形成第一金属薄膜。 在图案中形成抗蚀剂，同时在从抗蚀剂暴露的第一金属薄膜上形成接地层和定位标记层。 在接地层和定位标记层上形成第二金属薄膜，然后除去抗蚀剂。 在包括第二金属薄膜的上表面的第一金属薄膜上形成绝缘基底层，之后在绝缘基底层上形成导电图案。

公开(公告)号：US20050208421A1

公开(公告)日：2005-09-22

申请号：US11081516

申请日：2005-03-17

Applicant: Hirofumi Fujii ,  Yasuhito Funada ,  Satoshi Tanigawa

Inventor： Hirofumi Fujii ,  Yasuhito Funada ,  Satoshi Tanigawa

IPC: G03F7/031 ,  C08F2/44 ,  C08F283/04 ,  C08G73/10 ,  G03C1/492 ,  G03F7/004 ,  G03F7/027 ,  G03F7/037 ,  G03F7/20 ,  H01L21/027

CPC classification number: G03F7/031 ,  C08K5/3432 ,  C08L79/08 ,  G03F7/037 ,  C08L79/04

Abstract: A photosensitive resin composition which, when exposed to light through a photomask and then developed, can form a pattern comprising a polyimide film having a thickness of 20 μm or larger with high resolution; and a use of the composition, in particular, a method of forming a pattern comprising the polyimide film. The photosensitive resin composition comprises (a) a poly(amic acid), (b) a specific 1,4-dihydropyridine derivative, and (c) a specific imide acrylate compound.

Abstract translation: 一种光敏树脂组合物，当通过光掩模曝光然后显影时，可以以高分辨率形成包含厚度为20μm或更大的聚酰亚胺膜的图案; 以及组合物的使用，特别是形成包含聚酰亚胺膜的图案的方法。 感光性树脂组合物包含（a）聚（酰胺酸），（b）特定的1,4-二氢吡啶衍生物和（c）特定的酰亚胺丙烯酸酯化合物。

公开(公告)号：US06333139B1

公开(公告)日：2001-12-25

申请号：US09365786

申请日：1999-08-03

Applicant: Toshihiko Omote ,  Yasuhito Funada ,  Hideyuki Usui ,  Masanori Ueno ,  Kazumasa Igarashi

Inventor： Toshihiko Omote ,  Yasuhito Funada ,  Hideyuki Usui ,  Masanori Ueno ,  Kazumasa Igarashi

IPC: G03C500

CPC classification number: B32B15/08 ,  G03F7/037 ,  H05K1/056 ,  Y10T428/12229 ,  Y10T428/1241 ,  Y10T428/12431 ,  Y10T428/12806 ,  Y10T428/12903 ,  Y10T428/24917 ,  Y10T428/31681

Abstract: There are provided a circuit-forming substrate comprising a long stainless steel foil having formed on one surface or both surfaces thereof a polyimide resin layer wholly or partially, and a circuit substrate formed by using the circuit-forming substrate, wherein a conductor layer is finely patterned on the circuit-forming substrate. The circuit-forming substrate sufficiently satisfies low cost, high density and high reliability, scarcely causes warping of the substrate itself, and has excellent workability.

Abstract translation: 提供了一种电路形成基板，其包括长整个或不表面的聚酰亚胺树脂层的一个表面或两个表面上形成的长的不锈钢箔，以及通过使用电路形成基板形成的电路基板，其中导体层是细的 在电路形成衬底上图案化。 电路形成基板充分满足低成本，高密度和高可靠性，几乎不引起基板本身翘曲，并且具有优异的可加工性。

公开(公告)号：US6096482A

公开(公告)日：2000-08-01

申请号：US36024

申请日：1998-03-06

Applicant: Toshihiko Omote ,  Yasuhito Funada

Inventor： Toshihiko Omote ,  Yasuhito Funada

IPC: C08G69/26 ,  C08G73/10 ,  G03F7/004 ,  G03F7/038 ,  G11B3/00 ,  G11B5/48 ,  G11B5/60 ,  G11B21/00 ,  G11B21/02 ,  G11B21/16 ,  G11B21/18 ,  G11B25/04 ,  H05K1/03 ,  H05K1/05 ,  H05K3/46 ,  G03F7/00

CPC classification number: C08G73/1025 ,  C08G73/1039 ,  C08G73/1042 ,  G03F7/0387 ,  G11B21/00 ,  G11B5/486 ,  H05K1/056 ,  G03F7/0045 ,  Y10T428/24917

Abstract: A circuit substrate having an insulating layer comprising a polyimide resin on a metal foil substrate, wherein the polyimide resin is a polyimide resin obtained by the reaction of(A) aromatic diamines comprising(a) p-phenylene diamine and(b) 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl.(B) 3,4,3',4'-biphenyltetracarboxylic acid dianhydride.The circuit-formed substrate has a desired circuit comprising a conductive layer on the circuit substrate.The polyimide resin has a coefficient of thermal linear expansion close to that of the metal foil, and hence breakage does not occur on the resin layer, the resin layer does not separate, and warping does not occur.

公开(公告)号：US5858518A

公开(公告)日：1999-01-12

申请号：US799930

申请日：1997-02-13

Applicant: Toshihiko Omote ,  Yasuhito Funada

Inventor： Toshihiko Omote ,  Yasuhito Funada

IPC: B32B27/18 ,  C08G73/10 ,  C08K3/34 ,  C08K3/36 ,  C08K5/00 ,  C08L101/00 ,  C09K3/10 ,  G03F7/004 ,  G03F7/038 ,  G11B5/48 ,  G11B21/00 ,  H05K1/05

CPC classification number: G11B5/486 ,  B32B27/18 ,  C08G73/1025 ,  C08G73/1039 ,  C08G73/1042 ,  C08K3/36 ,  C08K5/0008 ,  G03F7/0387 ,  G11B21/00 ,  H05K1/056 ,  G03F7/0045 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/31681

Abstract: A circuit substrate having an insulating layer comprising a polyimide resin on a metal foil substrate, wherein the polyimide resin is a polyimide resin obtained by the reaction of(A) aromatic diamines comprising(a) 1,3-bis(4-aminophenoxy)benzene and(b) 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyland(B) aromatic tetracarboxylic acid dianhydrides comprising(a) 3,4,3',4'-biphenyltetracarboxylic acid dianhydrideand(b) 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride.The circuit-formed substrate has a desired circuit comprising a conductive layer on the circuit substrate.The polyimide resin has a low hygroscopic property and thus the substrate is excellent in the dimensional stability and does not cause warping even when the humidity in the environmental atmosphere is changed.

Abstract translation: 1.一种电路基板，具有在金属箔基板上具有聚酰亚胺树脂的绝缘层，其中，所述聚酰亚胺树脂是通过（A）芳族二胺与（a）1,3-双（4-氨基苯氧基）苯 和（b）2,2'-双（三氟甲基）-4,4'-二氨基联苯和（B）芳族四羧酸二酐，其包含（a）3,4,3'，4'-联苯四羧酸二酐和（b）2 ，2-双（3,4-二羧基苯基）六氟丙烷二酐。 电路形成的衬底具有包括在电路衬底上的导电层的所需电路。 聚酰亚胺树脂具有低吸湿性，因此基板的尺寸稳定性优异，即使环境氛围中的湿度发生变化也不会发生翘曲。