中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

36 records (took 0.017 seconds)

    LED STRUCTURE
    32.
    发明申请
    LED STRUCTURE 审中-公开
    LED结构

    公开(公告)号：US20090068496A1

    公开(公告)日：2009-03-12

    申请号：US11852461

    申请日：2007-09-10

    Applicant: Liann-Be Chang ,  Chin-Huai Young ,  Yu-Lin Lee

    Inventor： Liann-Be Chang ,  Chin-Huai Young ,  Yu-Lin Lee

    IPC: B32B9/00

    CPC classification number: H01L33/44

    Abstract: The present invention discloses an improved LED structure and comprises: a circuit brace, a bowl member; a light chip; a welding line; a packing mask; and a photocatalystic agent. The volume of an LED is smaller so as to be convenient for installment. Compared the present invention to a light tube with same power, the present invention can be added several LEDs in order to increase the curve surface area to contact air, so that the functions of disinfection, deodorization, and mildewproof can be effectively achieved.

    Abstract translation: 本发明公开了一种改进的LED结构，包括：电路支架，碗状部件; 一个灯芯片; 焊接线; 包装面膜; 和光催化剂。 LED的体积较小，便于安装。 将本发明与具有相同功率的光管相比，本发明可以添加几个LED，以增加曲面接触空气的面积，从而可以有效地实现消毒，除臭和防霉功能。

    Method for reducing time lapse of consecutive scan of LCD pixel
    33.
    发明申请
    Method for reducing time lapse of consecutive scan of LCD pixel 有权
    减少LCD像素连续扫描时间的方法

    公开(公告)号：US20070075945A1

    公开(公告)日：2007-04-05

    申请号：US11241184

    申请日：2005-09-30

    Applicant: Yuh-Ren Shen ,  Yu-Lin Lee ,  Chang-Cheng Lin

    Inventor： Yuh-Ren Shen ,  Yu-Lin Lee ,  Chang-Cheng Lin

    IPC: G09G3/36

    CPC classification number: G09G3/3666 ,  G09G2310/0205 ,  G09G2310/0208 ,  G09G2310/0221 ,  G09G2310/06 ,  G09G2320/0252

    Abstract: A double-frame-rate method for reducing the time lapse of a LCD pixel between its two consecutive scans within a frame is provided. The method horizontally partitions the scan lines into (k) non-overlapping regions, each containing m1, m2, . . . , mk scan lines. The method then scans each of the regions twice before continuing to the next region and, as such, completes two passes of scanning of the entire frame. For a pixel in a region (j), the time lapse between the pixel's two consecutive scans during the frame's frame time is (mj/n) of the time lapse of conventional double-frame-rate methods.

    Abstract translation: 提供了一种用于在帧内减少其两次连续扫描之间的LCD像素的时间流逝的双帧速率方法。 该方法将扫描线水平地划分为（k）个非重叠区域，每个区域包含m 1，m 2 2。 。 。 ，扫描线。 然后，该方法在继续到下一个区域之前扫描每个区域两次，并且因此完成整个帧的扫描的两个遍。 对于区域（j）中的像素，在帧的帧时间期间像素的两次连续扫描之间的时间流逝是常规双帧率方法的时间流逝的（m / j / n / n） 。

    Hybrid constant current LED lamp
    34.
    发明授权
    Hybrid constant current LED lamp 有权
    混合恒流LED灯

    公开(公告)号：US09241378B2

    公开(公告)日：2016-01-19

    申请号：US14205782

    申请日：2014-03-12

    Applicant: Yu-Lin Lee

    Inventor： Yu-Lin Lee ,  Kuo- Chung Huang

    IPC: H05B37/02 ,  H05B33/08

    CPC classification number: H05B33/0815 ,  H05B37/02

    Abstract: The present invention relates to a hybrid constant current LED lamp. The LED lamp includes a rectifier unit, a filter circuit, a switching mode power supply, at least one main LED and a subsidiary LED. The main LED is electrically connected in series to the output terminal of the rectifier unit and the input port of the primary-side circuit of the switching mode power supply. The subsidiary LED is connected to the secondary-side circuit. The invention not only provides circuit architecture capable of providing a constant current, but also improves the power efficiency of the lamp.

    Abstract translation: 本发明涉及混合型恒流LED灯。 LED灯包括整流器单元，滤波器电路，开关模式电源，至少一个主LED和辅助LED。 主LED与整流器单元的输出端子和开关模式电源的初级侧电路的输入端口串联电连接。 辅助LED连接到次级侧电路。 本发明不仅提供能够提供恒定电流的电路架构，而且还提高了灯的功率效率。

    CHIP PACKAGE
    36.
    发明申请
    CHIP PACKAGE 审中-公开
    芯片包装

    公开(公告)号：US20080105962A1

    公开(公告)日：2008-05-08

    申请号：US11833716

    申请日：2007-08-03

    Applicant: Yu-Lin Lee ,  Gwo-Liang Weng

    Inventor： Yu-Lin Lee ,  Gwo-Liang Weng

    IPC: H01L23/02

    CPC classification number: H01L25/03 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00

    Abstract: A chip package and a process thereof are provided. The chip package includes a first package unit and a second package unit. The first package unit includes a carrier; a chip, disposed on the carrier and electrically connected thereto; a first encapsulant, disposed on the carrier and covering the chip; an interposer, disposed on the first encapsulant, having a plurality of pads thereon, and electrically connected to the carrier; a plurality of conducting elements, respectively disposed on the pads; and a second encapsulant, covering the surface of the carrier, encapsulating the chip, the first encapsulant, the interposer, and the conducting elements, and exposing the top of each conducting element. The second package unit is disposed on the first package unit, and electrically connected to the interposer through the conducting elements.

    Abstract translation: 提供了芯片封装及其工艺。 芯片封装包括第一封装单元和第二封装单元。 第一包装单元包括载体; 芯片，设置在载体上并与其电连接; 第一密封剂，设置在载体上并覆盖芯片; 布置在所述第一密封剂上的插入件，其上具有多个焊盘，并且电连接到所述载体; 分别设置在所述垫上的多个导电元件; 以及第二密封剂，其覆盖所述载体的表面，封装所述芯片，所述第一密封剂，所述插入件和所述导电元件，以及暴露每个导电元件的顶部。 第二封装单元设置在第一封装单元上，并通过导电元件电连接到插入器。

Patent Agency Ranking