公开(公告)号：US11878532B2

公开(公告)日：2024-01-23

申请号：US17647820

申请日：2022-01-12

Applicant: Applied Materials, Inc.

Inventor： Daihua Zhang ,  Ludovic Godet ,  Michael David-Scott Kemp ,  Kang Luo ,  Kazuya Daito ,  Kenneth S. Ledford ,  Bahubali S. Upadhye ,  Hemantha Raju ,  John Rusconi ,  Elsa Massonneau ,  Mahendran Chidambaram ,  Alexey Stepanov ,  Visweswaren Sivaramakrishnan

IPC: B41J2/175 ,  H01L21/00

CPC classification number: B41J2/175 ,  H01L21/00

Abstract: Embodiments described herein relate to an inkjet printing platform. The inkjet printing platform is utilized for fabrication of optical films and optical device structures. The inkjet printing platform includes a transfer chamber, one or more inkjet chambers, a plurality of auxiliary modules, a substrate flipper, and load ports. The inkjet printing platform is operable to perform an inkjet printing process on a substrate to form an optical film and/or an optical device.

公开(公告)号：US11798831B2

公开(公告)日：2023-10-24

申请号：US17735018

申请日：2022-05-02

Applicant: Applied Materials, Inc.

Inventor： Daihua Zhang ,  Hou T. Ng ,  Nag B. Patibandla ,  Sivapackia Ganapathiappan ,  Yingdong Luo ,  Kyuil Cho ,  Han-Wen Chen

IPC: H01L21/68 ,  H01L21/67 ,  H01L21/02

CPC classification number: H01L21/68 ,  H01L21/02288 ,  H01L21/6715

Abstract: A method for printing on a substrate includes printing a support structure by printing a liquid precursor material and curing the liquid precursor material, positioning a substrate within the support structure, printing one or more anchors on the substrate and the support structure by printing and curing the liquid precursor material to secure the substrate to the support structure, and printing one or more device structures on the substrate while anchored by printing and curing the liquid precursor material.

公开(公告)号：US20220336246A1

公开(公告)日：2022-10-20

申请号：US17735018

申请日：2022-05-02

Applicant: Applied Materials, Inc.

Inventor： Daihua Zhang ,  Hou T. Ng ,  Nag B. Patibandla ,  Sivapackia Ganapathiappan ,  Yingdong Luo ,  Kyuil Cho ,  Han-Wen Chen

IPC: H01L21/68 ,  H01L21/67 ,  H01L21/02

Abstract: A method for printing on a substrate includes printing a support structure by printing a liquid precursor material and curing the liquid precursor material, positioning a substrate within the support structure, printing one or more anchors on the substrate and the support structure by printing and curing the liquid precursor material to secure the substrate to the support structure, and printing one or more device structures on the substrate while anchored by printing and curing the liquid precursor material.

公开(公告)号：US20220328336A1

公开(公告)日：2022-10-13

申请号：US17842681

申请日：2022-06-16

Applicant: Applied Materials, Inc.

Inventor： Daihua Zhang ,  Hou T. Ng ,  Nag B. Patibandla ,  Sivapackia Ganapathiappan ,  Yingdong Luo ,  Kyuil Cho ,  Han-Wen Chen

IPC: H01L21/68 ,  H01L21/67 ,  H01L21/02

Abstract: Printing on a substrate includes printing a support structure by printing a liquid precursor material and curing the liquid precursor material, printing one or more alignment markers by printing the liquid precursor material outside the support structure and curing the liquid precursor material, positioning a substrate within the support structure, performing a registration of the substrate using the one or more alignment markers, and printing one or more device structures on the substrate while registered by printing and curing the liquid precursor material.

公开(公告)号：US11329003B2

公开(公告)日：2022-05-10

申请号：US16839007

申请日：2020-04-02

Applicant: Applied Materials, Inc.

Inventor： Daihua Zhang ,  Hou T. Ng ,  Nag B. Patibandla ,  Sivapackia Ganapathiappan ,  Yingdong Luo ,  Kyuil Cho ,  Han-Wen Chen

IPC: H01L23/544 ,  H01L21/67 ,  H01L21/02

Abstract: A method of printing structures on a reconstructed wafer includes positioning a plurality of semiconductor dies on a support substrate, anchoring the plurality of semiconductor dies to the support substrate by printing a plurality of anchors that extend across edges of the semiconductor dies onto the support substrate and thus form a reconstructed wafer, and printing one or more device structures on the pluralities of semiconductor dies while anchored on the support substrate. The printing operations include ejecting droplets of a liquid precursor material and curing the liquid precursor material.

公开(公告)号：US11239213B2

公开(公告)日：2022-02-01

申请号：US16416098

申请日：2019-05-17

Applicant: Applied Materials Inc.

Inventor： Daihua Zhang ,  Yingdong Luo ,  Mingwei Zhu ,  Hou T. Ng ,  Sivapackia Ganapathiappan ,  Nag B. Patibandla

IPC: H01L33/50 ,  H01L25/075 ,  H01L33/00 ,  H01L33/32

Abstract: A method of fabricating a multi-color display includes dispensing a photo-curable fluid over a display having an array of LEDs disposed below a cover layer. The cover has an outer surface with a plurality of recesses, and the photo-curable fluid fills the recesses. The photo-curable fluid includes a color conversion agent. A plurality of LEDs in the array are activated to illuminate and cure the photo-curable fluid to form a color conversion layer in the recesses over the activated LEDs. This layer will convert light from these LEDs to light of a first color. An uncured remainder of the photo-curable fluid is removed. Then the process is repeated with a different photo-curable fluid having a different color conversion agent and a different plurality of LEDs. This forms a second color conversion layer in different plurality of recesses to convert light from these LEDs to light of a second color.

公开(公告)号：US20220017699A1

公开(公告)日：2022-01-20

申请号：US16933848

申请日：2020-07-20

Applicant: Applied Materials, Inc.

Inventor： Yingdong Luo ,  Sivapackia Ganapathiappan ,  Daihua Zhang ,  Hou T. Ng ,  Nag B. Patibandla

IPC: C08G77/04 ,  C09D183/08 ,  C08F220/18 ,  C08L33/12 ,  B29C64/153 ,  B29C64/35 ,  B29C64/357 ,  B29C64/314

Abstract: An implementation described herein provides a binder ink mixture for 3D printing of ceramic parts in a binder jet process. The binder ink mixture includes a molecular space filler and a free radical initiator.

公开(公告)号：US20190202127A1

公开(公告)日：2019-07-04

申请号：US15926997

申请日：2018-03-20

Applicant: Applied Materials, Inc.

Inventor： Hou T. Ng ,  Nag B. Patibandla ,  Daihua Zhang

IPC: B29C64/336 ,  B22F3/105 ,  C04B35/64 ,  B29C64/165 ,  B22F1/00 ,  B29C64/393

CPC classification number: B29C64/336 ,  B22F1/0059 ,  B22F3/008 ,  B22F3/10 ,  B22F3/1055 ,  B22F3/15 ,  B28B1/001 ,  B28B11/243 ,  B29C64/165 ,  B29C64/393 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y50/02 ,  C04B35/64

Abstract: An additive manufacturing apparatus has a platform, one or more supports positioned above the platform, an actuator coupled to at least one of the platform and the one or more supports and configured to create relative motion therebetween such that the one or more supports scan across the platform, a first dispenser system configured dispense a plurality of successive layers of powder onto a build area supported by the platform, a second dispenser system configured to dispense a binder material onto the build area, and an energy source configured to emit radiation toward the platform so as to solidify the binder material. The first dispenser system includes a first powder dispenser that is attached to and moves with a first support from the one or more supports and is configured to selectively dispense a first powder onto the build area.

公开(公告)号：US12283647B2

公开(公告)日：2025-04-22

申请号：US18444277

申请日：2024-02-16

Applicant: Applied Materials, Inc.

Inventor： Yingdong Luo ,  Daihua Zhang ,  Hou T. Ng ,  Sivapackia Ganapathiappan ,  Nag B. Patibandla

IPC: H01L33/50 ,  H01L27/15 ,  H01L33/30

Abstract: A photocurable composition includes quantum dots, quantum dot precursor materials, a chelating agent, one or more monomers, and a photoinitiator. The quantum dots are selected to emit radiation in a first wavelength band in the visible light range in response to absorption of radiation in a second wavelength band in the UV or visible light range. The second wavelength band is different than the first wavelength band. The quantum dot precursor materials include metal atoms or metal ions corresponding to metal components present in the quantum dots. The chelating agent is configured to chelate the quantum dot precursor materials. The photoinitiator initiates polymerization of the one or more monomers in response to absorption of radiation in the second wavelength band.

公开(公告)号：US12237445B2

公开(公告)日：2025-02-25

申请号：US17692012

申请日：2022-03-10

Applicant: Applied Materials, Inc.

Inventor： Hou T. Ng ,  Nag B. Patibandla ,  Giorgio Cellere ,  Daihua Zhang

IPC: H01L21/00 ,  B29D11/00 ,  G02B5/28 ,  H01L25/075 ,  H01L33/50 ,  G03F7/00 ,  G03F7/039

Abstract: A method of fabricating a multi-color display includes forming a host matrix over a display having an array of light emitting diodes. The host matrix is sensitive to ultraviolet light. A first plurality of light emitting diodes in a first plurality of wells are activated to illuminate a portion of the host matrix to cause the portion of the host matrix to develop internal porous structures. A first photo-curable fluid including a first color conversion agent is dispensed. The first plurality of light emitting diodes in the first plurality of wells are activated to illuminate and cure the first photo-curable fluid to form a first color conversion layer over each of the first plurality of light emitting diodes, and an uncured remainder of the first photo-curable fluid is removed.