公开(公告)号：US20250167190A1

公开(公告)日：2025-05-22

申请号：US19035670

申请日：2025-01-23

Applicant: Applied Materials, Inc.

Inventor： Lisong Xu ,  Byung Sung Kwak ,  Mingwei Zhu ,  Hou T. Ng ,  Nag B. Patibandla ,  Christopher Dennis Bencher

IPC: H01L25/16 ,  H01L25/075 ,  H10H20/01 ,  H10H20/825 ,  H10H20/84 ,  H10H20/85 ,  H10H20/853 ,  H10H20/855 ,  H10H20/856

Abstract: A display screen includes a backplane, an array of light-emitting diodes electrically integrated with the backplane, the array of light-emitting diodes configured to emit UV light in a first wavelength range, and a plurality of isolation walls formed on the backplane between adjacent light-emitting diodes of the array of light-emitting diodes with the isolation walls spaced apart from the light-emitting diodes and extending above the light-emitting diodes. The plurality of isolation walls include a core of a first material and a coating covering at least a portion of the core extending above the light-emitting diodes. The coating is an opaque second material having transmittance less than 1% of light in the first wavelength range.

公开(公告)号：US20240194836A1

公开(公告)日：2024-06-13

申请号：US18444277

申请日：2024-02-16

Applicant: Applied Materials, Inc.

Inventor： Yingdong Luo ,  Daihua Zhang ,  Hou T. Ng ,  Sivapackia Ganapathiappan ,  Nag B. Patibandla

IPC: H01L33/50 ,  H01L27/15 ,  H01L33/30

CPC classification number: H01L33/504 ,  H01L27/156 ,  H01L33/30

Abstract: A photocurable composition includes quantum dots, quantum dot precursor materials, a chelating agent, one or more monomers, and a photoinitiator. The quantum dots are selected to emit radiation in a first wavelength band in the visible light range in response to absorption of radiation in a second wavelength band in the UV or visible light range. The second wavelength band is different than the first wavelength band. The quantum dot precursor materials include metal atoms or metal ions corresponding to metal components present in the quantum dots. The chelating agent is configured to chelate the quantum dot precursor materials. The photoinitiator initiates polymerization of the one or more monomers in response to absorption of radiation in the second wavelength band.

公开(公告)号：US11908979B2

公开(公告)日：2024-02-20

申请号：US17901831

申请日：2022-09-01

Applicant: Applied Materials, Inc.

Inventor： Yingdong Luo ,  Daihua Zhang ,  Hou T. Ng ,  Sivapackia Ganapathiappan ,  Nag B. Patibandla

IPC: H01L33/50 ,  H01L33/30 ,  H01L27/15

CPC classification number: H01L33/504 ,  H01L27/156 ,  H01L33/30

Abstract: A photocurable composition includes quantum dots, quantum dot precursor materials, a chelating agent, one or more monomers, and a photoinitiator. The quantum dots are selected to emit radiation in a first wavelength band in the visible light range in response to absorption of radiation in a second wavelength band in the UV or visible light range. The second wavelength band is different than the first wavelength band. The quantum dot precursor materials include metal atoms or metal ions corresponding to metal components present in the quantum dots. The chelating agent is configured to chelate the quantum dot precursor materials. The photoinitiator initiates polymerization of the one or more monomers in response to absorption of radiation in the second wavelength band.

公开(公告)号：US11901477B2

公开(公告)日：2024-02-13

申请号：US17350523

申请日：2021-06-17

Applicant: Applied Materials, Inc.

Inventor： Fabio Pieralisi ,  Mingwei Zhu ,  Zihao Yang ,  Liang Zhao ,  Jeffrey L. Franklin ,  Hou T. Ng ,  Nag Patibandla

IPC: H01L33/00 ,  H01L25/075 ,  H01L33/06 ,  H01L33/32 ,  H01L33/46 ,  H01L33/50 ,  H01L33/62

CPC classification number: H01L33/0093 ,  H01L25/0753 ,  H01L33/007 ,  H01L33/06 ,  H01L33/32 ,  H01L33/46 ,  H01L33/50 ,  H01L33/62 ,  H01L2933/0066

Abstract: Exemplary processing methods include forming a group of LED structures on a substrate layer to form a patterned LED substrate. A light absorption barrier may be deposited on the patterned LED substrate. The methods may further include exposing the patterned LED substrate to light. The light may be absorbed by surfaces of the LED structures that are in contact with the substrate layer, and the light absorption barrier. The methods may still further include separating the LED structures for the substrate layer. The bonding between the LED structures and the substrate layer may be weakened by the absorption of the light by the surfaces of the LED structures in contact with the substrate layer.

公开(公告)号：US11888096B2

公开(公告)日：2024-01-30

申请号：US17380998

申请日：2021-07-20

Applicant: Applied Materials, Inc.

Inventor： Yingdong Luo ,  Sivapackia Ganapathiappan ,  Daihua Zhang ,  Hou T. Ng ,  Nag B. Patibandla

IPC: H01L33/50 ,  H01L27/15 ,  H01L33/56 ,  C09K11/02 ,  C08F22/14 ,  C09D4/06 ,  C09D4/00 ,  C08G75/045 ,  B82Y20/00 ,  B82Y40/00

CPC classification number: H01L33/502 ,  C08F22/14 ,  C08G75/045 ,  C09D4/00 ,  C09D4/06 ,  C09K11/025 ,  H01L27/156 ,  H01L33/56 ,  B82Y20/00 ,  B82Y40/00 ,  C08F2800/20 ,  C08F2810/20

Abstract: A photocurable composition includes a nanomaterial selected to emit radiation in a first wavelength band in the visible light range in response to absorption of radiation in a second wavelength band in the UV or visible light range. The second wavelength band is different than the first wavelength band. The photocurable composition further includes one or more (meth)acrylate monomers, a thiol crosslinker, and a photoinitiator that initiates polymerization of the one or more (meth)acrylate monomers in response to absorption of radiation in the second wavelength band. A light-emitting device includes a plurality of light-emitting diodes and the cured photocurable composition in contact with a surface through which radiation in a first wavelength band in the UV or visible light range is emitted from each of the light-emitting diodes.

公开(公告)号：US11798831B2

公开(公告)日：2023-10-24

申请号：US17735018

申请日：2022-05-02

Applicant: Applied Materials, Inc.

Inventor： Daihua Zhang ,  Hou T. Ng ,  Nag B. Patibandla ,  Sivapackia Ganapathiappan ,  Yingdong Luo ,  Kyuil Cho ,  Han-Wen Chen

IPC: H01L21/68 ,  H01L21/67 ,  H01L21/02

CPC classification number: H01L21/68 ,  H01L21/02288 ,  H01L21/6715

Abstract: A method for printing on a substrate includes printing a support structure by printing a liquid precursor material and curing the liquid precursor material, positioning a substrate within the support structure, printing one or more anchors on the substrate and the support structure by printing and curing the liquid precursor material to secure the substrate to the support structure, and printing one or more device structures on the substrate while anchored by printing and curing the liquid precursor material.

公开(公告)号：US11772229B2

公开(公告)日：2023-10-03

申请号：US16298802

申请日：2019-03-11

Applicant: Applied Materials, Inc.

Inventor： Sivapackia Ganapathiappan ,  Boyi Fu ,  Ashwin Chockalingam ,  Daniel Redfield ,  Rajeev Bajaj ,  Mahendra C. Orilall ,  Hou T. Ng ,  Jason G. Fung ,  Mayu Yamamura

IPC: B24B37/24

CPC classification number: B24B37/24

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.

公开(公告)号：US20220399479A1

公开(公告)日：2022-12-15

申请号：US17345970

申请日：2021-06-11

Applicant: Applied Materials, Inc.

Inventor： Lisong Xu ,  Mingwei Zhu ,  Byung Sung Kwak ,  Hyunsung Bang ,  Liang Zhao ,  Hou T. Ng ,  Sivapackia Ganapathiappan ,  Nag Patibandla

IPC: H01L33/44 ,  H01L33/62 ,  H01L25/075 ,  H01L33/50 ,  H01L33/00 ,  H01L21/66 ,  G02B27/01

Abstract: Methods of making high-pixel-density LED structures are described. The methods may include forming a backplane substrate and a LED substrate. The backplane substrate and the LED substrate may be bonded together, and the bonded substrates may include an array of LED pixels. Each of the LED pixels may include a group of isolated subpixels. A quantum dot layer may be formed on at least one of the isolated subpixels in each of the LED pixels. The methods may further include repairing at least one defective LED pixel by forming a replacement quantum dot layer on a quantum-dot-layer-free subpixel in the defective LED pixel. The methods may also include forming a UV barrier layer on the array of LED pixels after the repairing of the at least one defective LED pixel.

公开(公告)号：US20220336246A1

公开(公告)日：2022-10-20

申请号：US17735018

申请日：2022-05-02

Applicant: Applied Materials, Inc.

Inventor： Daihua Zhang ,  Hou T. Ng ,  Nag B. Patibandla ,  Sivapackia Ganapathiappan ,  Yingdong Luo ,  Kyuil Cho ,  Han-Wen Chen

IPC: H01L21/68 ,  H01L21/67 ,  H01L21/02

Abstract: A method for printing on a substrate includes printing a support structure by printing a liquid precursor material and curing the liquid precursor material, positioning a substrate within the support structure, printing one or more anchors on the substrate and the support structure by printing and curing the liquid precursor material to secure the substrate to the support structure, and printing one or more device structures on the substrate while anchored by printing and curing the liquid precursor material.

公开(公告)号：US20220328336A1

公开(公告)日：2022-10-13

申请号：US17842681

申请日：2022-06-16

Applicant: Applied Materials, Inc.

Inventor： Daihua Zhang ,  Hou T. Ng ,  Nag B. Patibandla ,  Sivapackia Ganapathiappan ,  Yingdong Luo ,  Kyuil Cho ,  Han-Wen Chen

IPC: H01L21/68 ,  H01L21/67 ,  H01L21/02

Abstract: Printing on a substrate includes printing a support structure by printing a liquid precursor material and curing the liquid precursor material, printing one or more alignment markers by printing the liquid precursor material outside the support structure and curing the liquid precursor material, positioning a substrate within the support structure, performing a registration of the substrate using the one or more alignment markers, and printing one or more device structures on the substrate while registered by printing and curing the liquid precursor material.