摘要:
The present invention provides an integrated circuit having a better ESD protection capability and capable of reducing a circuit layout area. The integrated circuit comprises: an internal circuit, a first pad, and at least a first impedance matching unit. The first impedance matching unit is coupled between the internal circuit and the first pad, and the first impedance matching unit comprises: a first switch unit and a first resistance unit. The first switch unit is coupled to the internal circuit, and the first resistance unit is coupled between the first switch unit and the first pad, wherein the first resistance unit has a first terminal and a second terminal. The first terminal is directly electrically connected to the first pad and the second terminal is coupled to the first switch unit.
摘要:
A hybrid driving apparatus and a method thereof are provided. The hybrid driving apparatus includes a first driving unit, a second driving unit, and a resistor. The first driving unit has a first output end. The second driving unit has a second output end coupled to a first bonding pad. The resistor is coupled between the first output end and the first bonding pad to serve as a matching impedance. When the driving apparatus operates in a first transmission mode, the first driving unit and the second driving unit jointly drive the first bonding pad. When the driving apparatus operates in a second transmission mode, the first driving unit and the second driving unit drive the first bonding pad and a second bonding pad respectively.
摘要:
A fabrication method for a system-on-chip (SoC) module is provided. The fabrication method includes the steps of providing at least two SoC sub-modules and connecting the SoC sub-modules. The SoC sub-modules are electrically connected with each other by connection interfaces of the SoC sub-modules so as to form the SoC module. As the SoC sub-modules have been verified in advance, the time required for verifying the resulting SoC module can be significantly reduced. As for application-specific SoC modules, they are fabricated by connecting with application-specific SoC sub-modules via the appropriate connection interfaces. Thus, the time and costs for developing SoC modules can both be minimized.
摘要:
An intelligent power socket system is disclosed. The system is composed of a control module, a switched electricity receptacle module, a switched USB module and a dimming receptacle module. Each module has a power plug and a power socket. The control module can receive control commands from a smartphone by a user. The other three functional modules can be controlled by the control module through power line communication (PLC). The modules may be located at different places within an electricity supply division so that they can communicate through the power lines.
摘要:
The showerhead includes a main body; a power generator disposed in the main body; a power monitor module, disposed in the main body, electrically connected to the power generator, and configured for monitoring quality of power from the power generator and switching on/off power supply of the power generator; and a control module, disposed in the main body, electrically connected to the power monitor module, and configured for controlling functions.
摘要:
The ignition system includes a mini hydroelectric generator module connecting an inlet pipe for generating electricity by water flow passing through the inlet pipe and it; a power quality monitoring module electrically connecting the mini hydroelectric generator module for monitoring output electricity quality of the mini hydroelectric generator module and switching on/off the electricity; an ignitor electrically connecting the power quality monitoring module for receiving electricity from the power quality monitoring module to ignite; and an electronic valve electrically connecting the power quality monitoring module for receiving electricity from the power quality monitoring module to switch on/off a gas pipe.
摘要:
A method for arranging memories of a low-complexity low-density parity-check (LDPC) decoder and a low-complexity LDPC decoder using the same method are provided. The main idea of the method for arranging memories of a low-complexity LDPC decoder is to merge at least one or two small-capacity memory blocks into one memory group, so that the memory area can be reduced and the power consumption in reading or writing data is lowered. Besides, as the merged memory group shares the same address line in reading or writing data, at least one delay unit is used to adjust the reading or writing order and thereby ensure data validity. A low-complexity LDPC decoder using the disclosed method can meet the demands of high processing rate and low power consumption.
摘要:
A method and an apparatus for automatic noise compensation used with audio reproduction equipment are provided. The method comprises: (a) collecting a plurality of mixed audio signals, each mixed audio signal including equipment sound output by the audio reproduction equipment, and background noise; (b) removing the equipment sound from the mixed audio signals to obtain the background noise therein; (c) determining whether or not a plurality of mixed audio signals under inspection include a significant sound; and (d) adjusting the volume of the audio reproduction equipment according to whether or not a significant sound has been generated in the surrounding area and the magnitude of the background noise in the mixed audio signals under inspection to satisfy a plurality of predetermined compensation conditions.
摘要:
A hand-off monitoring method is provided for monitoring a space divided into several monitoring regions. Each of the monitoring regions is monitored by a surveillance camera. The hand-off monitoring method comprises receiving a warning signal from a location and identifying a first surveillance camera related to the location according to the warning signal. Then, an object triggering the warning signal is identified according to a video signal provided by the first surveillance camera. A moving path of the object is predicted according to a non-linear movement prediction model. Then, a control operation is performed, according to the moving path, to control the surveillance cameras in the monitoring regions where the moving path passes so as to hand-off monitor the object.
摘要:
The present invention discloses a carrier structure of a System-on-Chip (SoC) with a custom interface. The carrier structure includes a substrate, at least one common die, at least one custom interface and a molding compound. The common die and the custom interface are disposed on the substrate. The molding compound is used to package the common die which electrically connects to the substrate and the custom interface respectively. The carrier structure which includes the common die can form a complete SoC by connecting to an expansive die through the custom interface. The carrier structure with the common die which can be tested and certified in advance allows reducing and simplifying the developing procedures of the SoC.