公开(公告)号：US07746089B2

公开(公告)日：2010-06-29

申请号：US11537164

申请日：2006-09-29

Applicant: Eric D. Hobbs ,  Alexander H. Slocum

Inventor： Eric D. Hobbs ,  Alexander H. Slocum

IPC: G01R31/02

CPC classification number: G01R1/07364

Abstract: Methods and apparatus for indirect planarization of a substrate are provided herein. In one embodiment, an apparatus for indirectly planarizing a probe card assembly includes an adjustment portion for controlling a force applied to a probe substrate of the probe card assembly; a force application portion configured to apply the force to the probe substrate at a location that is laterally offset from the adjustment portion; and a mechanism coupling the adjustment portion to the force application portion.

Abstract translation: 本文提供了用于衬底的间接平面化的方法和装置。 在一个实施例中，用于间接平面化探针卡组件的装置包括用于控制施加到探针卡组件的探针基板的力的调节部分; 力施加部，其构造成在从所述调节部侧向偏移的位置处向所述探针基板施加力; 以及将调节部联接到力施加部的机构。

公开(公告)号：US07622935B2

公开(公告)日：2009-11-24

申请号：US11551545

申请日：2006-10-20

Applicant: Eric D. Hobbs ,  Alexander H. Slocum ,  Benjamin N. Eldridge ,  Keith J. Breinlinger ,  Shawn Powell

Inventor： Eric D. Hobbs ,  Alexander H. Slocum ,  Benjamin N. Eldridge ,  Keith J. Breinlinger ,  Shawn Powell

IPC: G01R31/02 ,  G01R31/28

CPC classification number: G01R31/2893

Abstract: A probe card assembly can comprise a probe head assembly and a wiring substrate. The probe head assembly can comprise a plurality of probes disposed to contact an electronic device disposed on a holder in a test housing. The wiring substrate can include an electrical interface to a test controller and a plurality of electrical wiring composing electrical paths between the electrical interface and ones of the probes, and the wiring substrate can comprise a first portion on which the electrical interface is disposed and a second portion composing the probe head assembly. The second portion of the wiring substrate can be moveable with respect to the first portion of the wiring substrate.

Abstract translation: 探针卡组件可以包括探针头组件和布线衬底。 探针头组件可以包括多个探针，其设置成接触设置在测试壳体中的保持器上的电子设备。 布线基板可以包括与测试控制器的电接口以及构成电接口和探针之间的电气路径的多个电线，并且布线基板可以包括其上设置有电接口的第一部分和第二部分 组成探头组件的部分。 布线基板的第二部分能够相对于布线基板的第一部分移动。

公开(公告)号：US20080203268A1

公开(公告)日：2008-08-28

申请号：US12116032

申请日：2008-05-06

Applicant: Eric D. Hobbs ,  Christopher D. McCoy ,  James M. Porter ,  Alexander H. Slocum

Inventor： Eric D. Hobbs ,  Christopher D. McCoy ,  James M. Porter ,  Alexander H. Slocum

IPC: G01R31/02 ,  F16M13/00

CPC classification number: G01R31/2891 ,  G01R31/31905

Abstract: A probe card assembly can comprise a support structure to which a plurality of probes can be directly or indirectly attached. The probes can be disposed to contact an electronic device to be tested. The probe card assembly can further comprise actuators, which can be configured to change selectively an attitude of the support structure with respect to a reference structure. The probe card assembly can also comprise a plurality of lockable compliant structures. While unlocked, the lockable compliant structures can allow the support structure to move with respect to the reference structure. While locked, however, the compliant structures can provide mechanical resistance to movement of the support structure with respect to the reference structure.

Abstract translation: 探针卡组件可以包括支撑结构，多个探针可以直接或间接附接到支撑结构。 可以将探针设置成接触要测试的电子设备。 探针卡组件还可以包括致动器，其可以被配置为相对于参考结构选择性地改变支撑结构的姿态。 探针卡组件还可以包括多个可锁定的柔顺结构。 当解锁时，可锁定的柔性结构可以允许支撑结构相对于参考结构移动。 然而，当锁定时，柔性结构可以提供对支撑结构相对于参考结构的移动的机械阻力。

公开(公告)号：US12162006B2

公开(公告)日：2024-12-10

申请号：US15634097

申请日：2017-06-27

Applicant: Keith Joseph Breinlinger ,  Eric D. Hobbs ,  Dorian Liepmann ,  Joshua Tanner Nevill ,  Mark P. White ,  Maria Jimena Loureiro

Inventor： Keith Joseph Breinlinger ,  Eric D. Hobbs ,  Dorian Liepmann ,  Joshua Tanner Nevill ,  Mark P. White ,  Maria Jimena Loureiro

IPC: B01L3/00 ,  C12M3/06

Abstract: Some configurations of a microfluidic apparatus can comprise a fluidic circuit of interconnected fluidic structures into which a plurality of different media can be introduced or extracted. A variety of operations can be performed with the different media including isolating with a second medium one or more of the fluidic structures that is filled partially or fully with a first medium. Discrete volumes of a medium can be moved through the isolating second medium to deliver materials or micro-objects to or remove micro-objects or materials from a fluidic structure that is otherwise isolated by the second medium. Some configurations of a microfluidic apparatus can isolate microfluidic structures in a microfluidic apparatus using flow rates or blocking structures, and some configurations can manage bubbles in fluidic structures.

公开(公告)号：US08400173B2

公开(公告)日：2013-03-19

申请号：US12492177

申请日：2009-06-26

Applicant: Eric D. Hobbs

Inventor： Eric D. Hobbs

IPC: G01R31/00 ,  G01R31/10

CPC classification number: G01R31/2874

Abstract: Embodiments of probe cards and methods for fabricating and using same are provided herein. In some embodiments, an apparatus for testing a device (DUT) may include a probe card configured for testing a DUT; a thermal management apparatus disposed on the probe card to heat and/or cool the probe card; a sensor disposed on the probe card and coupled to the thermal management apparatus to provide data to the thermal management apparatus corresponding to a temperature of a location of the probe card; a first connector disposed on the probe card and coupled to the thermal management apparatus for connecting to a first power source internal to a tester; and a second connector, different than the first connector, disposed on the probe card and coupled to the thermal management apparatus for connecting to a second power source external to the tester.

Abstract translation: 本文提供了探针卡及其制造和使用方法的实施例。 在一些实施例中，用于测试设备（DUT）的设备可以包括配置用于测试DUT的探针卡; 设置在探针卡上以加热和/或冷却探针卡的热管理装置; 传感器，设置在所述探针卡上并耦合到所述热管理装置，以向与所述探针卡的位置的温度相对应的所述热管理装置提供数据; 第一连接器，其设置在所述探针卡上并且耦合到所述热管理装置，用于连接到测试仪内部的第一电源; 以及与第一连接器不同的第二连接器，其设置在探针卡上并且耦合到热管理装置，用于连接到测试仪外部的第二电源。

公开(公告)号：US08138859B2

公开(公告)日：2012-03-20

申请号：US12106364

申请日：2008-04-21

Applicant: John K. Gritters ,  Eric D. Hobbs ,  Sangtae Park ,  Jun Jason Yao

Inventor： John K. Gritters ,  Eric D. Hobbs ,  Sangtae Park ,  Jun Jason Yao

IPC: H01H51/22 ,  H01H57/00

CPC classification number: H01H1/60 ,  H01H1/0036 ,  H01H59/0009 ,  H01H2001/0047 ,  H01H2001/0052 ,  H01H2001/0078

Abstract: Embodiments of the present invention provide microelectromechanical systems (MEMS) switching methods and apparatus having improved performance and lifetime as compared to conventional MEMS switches. In some embodiments, a MEMS switch may include a resilient contact element comprising a beam and a tip configured to wipe a contact surface; and a MEMS actuator having an open position that maintains the tip and the contact surface in a spaced apart relation and a closed position that brings the tip into contact with the contact surface, wherein the resilient contact element and the MEMS actuator are disposed on a substrate and are movable in a plane substantially parallel to the substrate. In some embodiments, various contact elements are provided for the MEMS switch. In some embodiments, various actuators are provided for control of the operation of the MEMS switch.

Abstract translation: 与常规MEMS开关相比，本发明的实施例提供了具有改进的性能和寿命的微机电系统（MEMS）开关方法和装置。 在一些实施例中，MEMS开关可以包括弹性接触元件，其包括梁和构造成擦拭接触表面的尖端; 以及MEMS致动器，其具有将尖端和接触表面保持间隔开的关闭位置和使尖端与接触表面接触的闭合位置，其中弹性接触元件和MEMS致动器设置在基板上 并且可以在基本上平行于基板的平面中移动。 在一些实施例中，为MEMS开关提供各种接触元件。 在一些实施例中，提供各种致动器用于控制MEMS开关的操作。

公开(公告)号：US20110156735A1

公开(公告)日：2011-06-30

申请号：US12979200

申请日：2010-12-27

Applicant: Keith J. Breinlinger ,  Eric D. Hobbs

Inventor： Keith J. Breinlinger ,  Eric D. Hobbs

IPC: G01R31/00

CPC classification number: G01R1/0491 ,  G01R31/3025

Abstract: Wafer cassette systems and methods of using wafer cassette systems. A wafer cassette system can include a base and a probe card assembly. The base and the probe card assembly can each include complementary interlocking alignment elements. The alignment elements can constrain relative movement of the base and probe card assembly in directions parallel to a wafer receiving surface of the base, while permitting relative movement in a direction perpendicular to the receiving surface.

Abstract translation: 晶圆盒系统和使用晶片盒系统的方法。 晶片盒系统可以包括基座和探针卡组件。 基座和探针卡组件可以各自包括互补的互锁对准元件。 对准元件可以约束基部和探针卡组件在平行于基部的晶片接收表面的方向上的相对运动，同时允许在垂直于接收表面的方向上的相对运动。

公开(公告)号：US20110156734A1

公开(公告)日：2011-06-30

申请号：US12979159

申请日：2010-12-27

Applicant: Tommie E. Berry ,  Keith J. Breinlinger ,  Eric D. Hobbs ,  Marc Loranger ,  Alexander H. Slocum ,  Adrian S. Wilson

Inventor： Tommie E. Berry ,  Keith J. Breinlinger ,  Eric D. Hobbs ,  Marc Loranger ,  Alexander H. Slocum ,  Adrian S. Wilson

IPC: G01R31/00

CPC classification number: G01R31/2891

Abstract: Devices under test (DUTs) can be tested in a test system that includes an aligner and test cells. A DUT can be moved into and clamped in an aligned position on a carrier in the aligner. In the align position, electrically conductive terminals of the DUT can be in a predetermined position with respect to carrier alignment features of the carrier. The DUT/carrier combination can then be moved from the aligner into one of the test cells, where alignment features of the carrier are mechanically coupled with alignment features of a contactor in the test cell. The mechanical coupling automatically aligns terminals of the DUT with probes of the contactor. The probes thus contact and make electrical connections with the terminals of the DUT. The DUT is then tested. The aligner and each of the test cells can be separate and independent devices so that a DUT can be aligned in the aligner while other DUTs, having previously been aligned to a carrier in the aligner, are tested in a test cell.

Abstract translation: 被测设备（DUT）可以在包括对准器和测试单元的测试系统中进行测试。 DUT可以被移动并被夹持在对准器中的载体上的对准位置。 在对准位置，DUT的导电端子可以相对于载体的载体对准特征处于预定位置。 然后可以将DUT /载体组合从对准器移动到测试单元之一中，其中载体的对准特征与测试单元中的接触器的对准特征机械耦合。 机械联轴器将DUT的端子自动对准接触器的探头。 探头因此与DUT的端子接触并进行电气连接。 然后测试DUT。 对准器和每个测试单元可以是分离和独立的器件，使得DUT可以在对准器中对准，而在测试单元中测试已经与对准器中的载体对准的其它DUT。

公开(公告)号：US07960989B2

公开(公告)日：2011-06-14

申请号：US12478117

申请日：2009-06-04

Applicant: Keith J. Breinlinger ,  Eric D. Hobbs

Inventor： Keith J. Breinlinger ,  Eric D. Hobbs

IPC: G01R31/20 ,  G01R31/02

CPC classification number: G01R31/2889

Abstract: A stiffener structure, a wiring substrate, and a frame having a major surface disposed in a stack can be part of a probe card assembly. The wiring substrate can be disposed between the frame and the stiffener structure, and probe substrates can be coupled to the frame by one or more non-adjustably fixed coupling mechanisms. Each of the probe substrates can have probes that are electrically connected through the probe card assembly to an electrical interface on the wiring substrate to a test controller. The non-adjustably fixed coupling mechanisms can be simultaneously stiff in a first direction perpendicular to the major surface and flexible in a second direction generally parallel to the major surface.

Abstract translation: 加强结构，布线基板和具有设置在堆叠中的主表面的框架可以是探针卡组件的一部分。 布线基板可以设置在框架和加强件结构之间，并且探针基板可以通过一个或多个不可调节地固定的联接机构联接到框架。 每个探针基板可以具有通过探针卡组件电连接到布线基板上的电接口到测试控制器的探针。 不可调节固定的联接机构可以在垂直于主表面的第一方向上同时刚性，并且在大致平行于主表面的第二方向上是柔性的。

公开(公告)号：US07956635B2

公开(公告)日：2011-06-07

申请号：US12345740

申请日：2008-12-30

Applicant: Eric D. Hobbs ,  Andrew W. McFarland

Inventor： Eric D. Hobbs ,  Andrew W. McFarland

IPC: G01R31/20 ,  G01R31/02

CPC classification number: G01R1/07378

Abstract: A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener for use with testing devices includes an inner member; an outer member disposed in a predominantly spaced apart relation to the inner member; and a plurality of alignment mechanisms for orienting the inner and outer members with respect to each other, wherein the alignment mechanisms transfer forces applied to a lower surface of the inner member to the outer member and provide the predominant conductive heat transfer passageway between the inner and outer members.

Abstract translation: 本文提供了一种与测试装置一起使用的加强装置。 在一些实施例中，用于与测试装置一起使用的加强件包括内部构件; 与所述内部构件以主要间隔开的关系设置的外部构件; 以及用于使内部和外部构件相对于彼此定向的多个对准机构，其中对准机构将施加到内部构件的下表面的力传递到外部构件，并且在内部构件和内部构件之间提供主要的导电传热通道 外部成员。