公开(公告)号：US09892853B2

公开(公告)日：2018-02-13

申请号：US15301737

申请日：2015-06-12

Applicant: Ferro Corporation

Inventor： Walter J. Symes, Jr. ,  Gregory R. Prinzbach ,  John J. Maloney ,  James E. Henry ,  Orville W. Brown ,  Srinivasan Sridharan ,  Yie-Shein Her ,  Stanley Wang ,  George E. Graddy, Jr. ,  George E. Sakoske

IPC: C04B35/465 ,  H01G4/12 ,  C04B35/626 ,  C04B35/478 ,  C04B35/475 ,  C04B35/468 ,  C04B35/453 ,  C04B35/22 ,  C04B35/16 ,  C04B35/195 ,  C04B35/18 ,  C04B35/622 ,  C04B35/64 ,  C03C8/18 ,  C09D5/24

CPC classification number: H01G4/129 ,  C03C8/18 ,  C04B35/16 ,  C04B35/18 ,  C04B35/195 ,  C04B35/22 ,  C04B35/453 ,  C04B35/465 ,  C04B35/468 ,  C04B35/4682 ,  C04B35/475 ,  C04B35/478 ,  C04B35/62218 ,  C04B35/6263 ,  C04B35/64 ,  C04B2235/3203 ,  C04B2235/3208 ,  C04B2235/3215 ,  C04B2235/3217 ,  C04B2235/3222 ,  C04B2235/3224 ,  C04B2235/3236 ,  C04B2235/3281 ,  C04B2235/3284 ,  C04B2235/3298 ,  C04B2235/3409 ,  C04B2235/3418 ,  C04B2235/3436 ,  C04B2235/445 ,  C04B2235/6025 ,  C04B2235/608 ,  C04B2235/72 ,  C04B2235/725 ,  C04B2235/77 ,  C09D5/24 ,  H01G4/105 ,  H01G4/12 ,  H01G4/1209 ,  H01G4/1227

Abstract: LTCC devices are produced from dielectric compositions comprising a mixture of precursor materials that, upon firing, forms a dielectric material comprising a matrix of titanates of alkaline earth metals, the matrix doped with at least one selected from rare-earth element, aluminum oxide, silicon oxide and bismuth oxide.

公开(公告)号：US09545682B2

公开(公告)日：2017-01-17

申请号：US14931957

申请日：2015-11-04

Applicant: Ferro Corporation

Inventor： Srinivasan Sridharan ,  Robert P. Blonski ,  Chandrashekhar S. Khadilkar ,  John J. Maloney

IPC: B23K31/02 ,  B23K1/00 ,  H01L23/10 ,  B23K1/19 ,  H01L31/048 ,  H01L31/18 ,  H05K13/00 ,  B23K1/002 ,  B23K1/005 ,  B23K1/06 ,  B23K35/26 ,  C03C27/08 ,  H01G9/20 ,  H01L51/52

CPC classification number: B23K1/0008 ,  B23K1/0016 ,  B23K1/002 ,  B23K1/005 ,  B23K1/0053 ,  B23K1/0056 ,  B23K1/06 ,  B23K1/19 ,  B23K31/02 ,  B23K35/262 ,  C03C27/08 ,  H01G9/2077 ,  H01L23/10 ,  H01L31/048 ,  H01L31/0488 ,  H01L31/18 ,  H01L51/5246 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K13/00 ,  Y02E10/50 ,  Y10T156/10 ,  Y10T156/1062 ,  H01L2924/00

Abstract: Solder can be used to wet and bind glass substrates together to ensure a hermetic seal that superior (less penetrable) than conventional polymeric (thermoplastic or thermoplastic elastomer) seals in electric and electronic applications.

Abstract translation: 焊接可用于将玻璃基板湿润并粘合在一起，以确保在电气和电子应用中比常规聚合物（热塑性或热塑性弹性体）密封件更好（更不易穿透）的气密密封。