Abstract:
Provided is an on-press development type lithographic printing plate precursor having a support, an image-recording layer, and an outermost layer in this order, in which the outermost layer has a sea-island structure consisting of a discontinuous phase that contains a hydrophobic polymer and a continuous phase that contains a water-soluble polymer. Also provided are a method of preparing a lithographic printing plate and a lithographic printing method in which the on-press development type lithographic printing plate precursor is used.
Abstract:
Provided is a photocurable ink composition including a resin which has an amine structure having an α-hydrogen atom and contains at least one selected from the group consisting of an alkylthio group, an alkylenethioalkylene group, and a mercapto group and at least one selected from the group consisting of a fluorinated hydrocarbon group, a polysiloxane group, and a hydrocarbon group having 12 or more carbon atoms; at least one of a monofunctional radically polymerizable monomer or a bifunctional radically polymerizable monomer; and a photopolymerization initiator.
Abstract:
Provided are a photocurable ink composition including a resin which contains an amino group having one or more hydrogen atoms on a carbon atom at an ca-position and having an amine value of 3.5 mmol/g to 12 mmol/g, and a radically polymerizable monomer, in which the radically polymerizable monomer contains at least one of a monofunctional radically polymerizable monomer or a bifunctional radically polymerizable monomer, a total content of the monofunctional radically polymerizable monomer and the bifunctional radically polymerizable monomer is 50% by mass or greater with respect to a total mass of the photocurable ink composition, and a content of a radically polymerizable monomer containing an acid group in the radically polymerizable monomers is 1.5 mmol or less per 100 g of the photocurable ink composition; and an image forming method performed by using the photocurable ink composition.
Abstract:
An ink composition including water, particles that include a polymer having at least one of a urethane bond or a urea bond and have a polymerizable group, and a hydrophobic compound that has an alkyl group having 8 or more carbon atoms and has a molecular weight of 5000 or less, a method for producing the ink composition, and an image-forming method.
Abstract:
An aqueous dispersion is provided, the aqueous dispersion including: a microcapsule including a core and a shell that has a three-dimensionally crosslinked structure including (a) at least one selected from the group consisting of a urethane bond and a urea bond and (b) an anionic group and a nonionic group as hydrophilic groups, in which at least one of the shell or the core has a thermal-polymerizable group; and water, in which the nonionic group is a group (W) represented by Formula (W) below, *RW1—OnwRW2 Formula (W) in which, in Formula (W), RW1 represents an alkylene group that has 1 to 6 carbon atoms and that may be branched, RW2 represents an alkyl group that has 1 to 6 carbon atoms and that may be branched, nw represents an integer of 2 to 200, and * represents a linkage position.
Abstract:
Provided are an aqueous dispersion including a microcapsule and water, the microcapsule including: a shell having a three-dimensional cross-linked structure containing: at least one bond selected from a urethane bond or a urea bond; and an anionic group and a nonionic group as hydrophilic groups; and a core, at least one of the shell having a photopolymerization initiating group or the core containing a photopolymerization initiator being satisfied, and at least one of the shell having a polymerizable group or the core containing a polymerizable compound being satisfied; a method for manufacturing the same; and an image forming method using the aqueous dispersion.
Abstract:
Provided are a composition which has good elastomer solubility, is thus capable of increasing a concentration of solid contents, and is capable of forming a film having excellent drying properties, surface morphology, and heat resistance, a process for producing a sheet, a sheet, a laminate, and a laminate with a device wafer.This composition includes an elastomer having a 5% thermal mass reduction temperature of 375° C. or higher when heated at an elevation rate of 20° C./min from 25° C., a solvent represented by the following General Formula (1) and having a boiling point of 160° C. or higher, and a solvent having a boiling point of lower than 120° C. In General Formula (1), R1 to R6 each independently represent a hydrogen atom or an aliphatic hydrocarbon group.
Abstract:
Provided are a laminate which is capable of forming an excellent organic semiconductor pattern, a kit for manufacturing an organic semiconductor, which is used to manufacture such a laminate, and a resist composition for manufacturing an organic semiconductor, which is used for the kit for manufacturing an organic semiconductor.The laminate includes an organic semiconductor film, a protective film on the organic semiconductor film, and a resist film on the protective film, in which the resist film is formed of a photosensitive resin composition that contains a photoacid generator (A) which generates an organic acid of which a pKa of the generated acid is −1 or less and a resin (B) which reacts with an acid generated by the photoacid generator so that the rate of dissolution in a developer containing an organic solvent is decreased.
Abstract:
By a temporary adhesive for production of semiconductor device containing (A) a radical polymerizable monomer or oligomer containing a fluorine atom or a silicon atom, (B) a polymer compound, and (C) a radical polymerization initiator, a temporary adhesive for production of semiconductor device, which is excellent in coating property, which reduces a problem of generation of gas therefrom in the temporary support even under high temperature condition when the member to be processed (for example, a semiconductor wafer) is subjected to a mechanical or chemical processing, and further which can easily release the temporary support for the member processed without imparting damage to the member processed even after being subjected to a process at a high temperature, and an adhesive support and a production method of semiconductor device using the same are provided.
Abstract:
The invention is directed to a temporary adhesive containing (A) a polymer compound having a radical polymerizable group in its side chain, (B) a radical polymerizable monomer, and (C) a heat radical polymerization initiator, and a production method of semiconductor device having a member processed including: adhering a first surface of a member to be processed to a substrate through an adhesive layer formed from the temporary adhesive; conducting a mechanical or chemical processing on a second surface which is different from the first surface of the member to be processed to obtain the member processed; and releasing the first surface of the member processed from the adhesive layer.