公开(公告)号：US11212940B1

公开(公告)日：2021-12-28

申请号：US16915626

申请日：2020-06-29

Applicant: Google LLC

Inventor： Emil Rahim ,  Ihab A. Ali ,  Phanindraja Ancha ,  Neha Ravi Dixit

IPC: H05K7/20 ,  H04R1/02

Abstract: The present document describes a passive thermal-control structure for speakers and associated apparatuses and methods. The architecture of the passive thermal-control structure is such that heat is transferred from electronic subsystems of the electronic speaker device to the passive thermal-control structure, which acts as an internal, structural frame of the electronic speaker device and provides both thermal mitigation and structural stability. The passive thermal-control structure conducts heat from the electronic subsystems to a housing of the electronic speaker device. The housing of the electronic speaker device may dissipate the heat to the ambient environment to prevent thermal runaway of the electronic subsystems, and the internal frame mitigates the temperature of the housing from exceeding ergonomic temperature limits.

公开(公告)号：US20210111095A1

公开(公告)日：2021-04-15

申请号：US17065285

申请日：2020-10-07

Applicant: Google LLC

Inventor： Ihab A. Ali ,  Emil Rahim ,  Truong Ho Cong

IPC: H01L23/367 ,  H01L25/18 ,  H01L23/552 ,  H04R1/02

Abstract: This document describes a passive thermal-control system that can be integrated into an electronic speaker device and associated electronic speaker devices. The passive thermal-control system uses an architecture that combines heat spreaders and thermal interface materials to transfer heat from heat-generating electronic devices of the electronic speaker device to a housing component of the electronic speaker device. The housing component dissipates the heat to prevent a thermal runaway condition.

公开(公告)号：US12276413B2

公开(公告)日：2025-04-15

申请号：US18516220

申请日：2023-11-21

Applicant: Google LLC

Inventor： Ihab A. Ali ,  Duen Hsing Hsieh

IPC: F21V29/70 ,  F21V23/02 ,  F21V29/87 ,  F21V33/00 ,  H04N23/51 ,  H04N23/52 ,  H04N23/56 ,  H04N23/667 ,  H05B45/18 ,  H05B47/125 ,  F21Y113/00 ,  F21Y115/10

Abstract: This document describes techniques directed to active thermal-control of a floodlight and associated floodlights. As described, an example floodlight includes a first heat-transfer subsystem that uses a fully enclosed heat sink to transfer heat from an array of LEDs to a first housing component of the floodlight. The floodlight further includes a second heat-transfer subsystem to transfer heat from one or more PSUs to a second housing component of the floodlight. Described techniques include using thermistors located throughout the floodlight to actively monitor a temperature profile within the floodlight and, if one or more operating-temperature thresholds are violated, reducing power consumption within the floodlight.

公开(公告)号：US20240353361A1

公开(公告)日：2024-10-24

申请号：US18758223

申请日：2024-06-28

Applicant: Google LLC

Inventor： David Wang ,  Arun Raghupathy ,  James Robert Lim ,  Ihab A. Ali ,  Chang Hong Ye

IPC: G01N25/72 ,  G01R31/371 ,  G01R31/392 ,  H01M10/615 ,  H01M10/63

CPC classification number: G01N25/72 ,  G01R31/371 ,  G01R31/392 ,  H01M10/615 ,  H01M10/63

Abstract: A battery pack includes a battery, a first temperature sensor configured to provide a first temperature value associated with a temperature of the battery, a heat source disposed proximate to the battery and configured to heat the battery, a second temperature sensor configured to provide a second temperature value associated with a temperature of the heat source, and a control board coupled to the first temperature sensor and the second temperature sensor, wherein the control board is configured to receive the first temperature value and the second temperature value. The control board is configured to compare the first temperature value and the second temperature value to determine a temperature gradient between the battery and the heat source and transmit an alert if the temperature gradient exceeds a first temperature gradient threshold.

公开(公告)号：US11997781B2

公开(公告)日：2024-05-28

申请号：US17767683

申请日：2020-10-08

Applicant: Google LLC

Inventor： Ihab A. Ali ,  Frédéric Heckmann

IPC: H05K1/02 ,  H05K7/20 ,  H05K9/00

CPC classification number: H05K1/0203 ,  H05K7/202 ,  H05K7/20509 ,  H05K9/0024 ,  H05K7/20154 ,  H05K7/2039 ,  H05K2201/09027

Abstract: This document describes a thermal-control system that may be integrated into a mesh network device and associated mesh network devices. The thermal-control system, which may include a heat sink, multiple heat spreaders, and a heat shield, is such that heat originating from IC devices populating a printed circuit board of the mesh network device may be transferred to a housing component of the mesh network device for external dissipation to maintain a desired thermal profile of the mesh network device.

公开(公告)号：US11980010B2

公开(公告)日：2024-05-07

申请号：US17889727

申请日：2022-08-17

Applicant: Google LLC

Inventor： Frédéric Heckmann ,  Ihab A. Ali

IPC: H05K7/20 ,  H01L23/373 ,  H05K9/00

CPC classification number: H05K7/2039 ,  H01L23/3735 ,  H05K7/20472 ,  H05K9/0033 ,  H05K9/006 ,  H05K7/20445

Abstract: This document describes a thermal-control system that is integrated into a media-streaming device. The thermal-control system includes a combination of heat spreaders and materials with high thermal-conductivity. The thermal-control system may spread, transfer, and dissipate energy from a thermal-loading condition effectuated upon the media-streaming device to concurrently maintain temperatures of multiple thermal zones on or within the media-streaming device at or below multiple respective prescribed temperature thresholds.

公开(公告)号：US11832426B2

公开(公告)日：2023-11-28

申请号：US16899148

申请日：2020-06-11

Applicant: Google LLC

Inventor： Emil Rahim ,  Chintan Trehan ,  Ihab A. Ali ,  Wilson Tang

IPC: H05K7/20 ,  G01R31/28 ,  G06F3/16 ,  H05K1/02 ,  H04R9/02 ,  H04R1/02 ,  H04R3/00

CPC classification number: H05K7/20945 ,  G01R31/2877 ,  G06F3/165 ,  H04R9/022 ,  H05K1/0203 ,  H04R1/02 ,  H04R3/007 ,  H05K2201/10151

Abstract: The present disclosure describes thermal mitigation for an electronic speaker device and associated systems and methods. The thermal mitigation includes monitoring several thermal zones to determine or estimate thermal conditions in corresponding parts of the electronic speaker device. The thermal zones may include a System-on-Chip (SoC) integrated circuit (IC) component, audio components including power-dissipating IC components, and a temperature of an exterior surface of a housing component of the electronic speaker device. To mitigate thermal runaway, different throttling schemes may be triggered based on the thermal zones exceeding certain thermal limits. The throttling schemes may include reducing the amount of power supplied to the SoC, reducing audio power of the audio components to a lower wattage, or manipulating SoC cores such as by disabling one or more of the cores or adjusting utilization of the SoC cores.

公开(公告)号：US20220400576A1

公开(公告)日：2022-12-15

申请号：US17889727

申请日：2022-08-17

Applicant: Google LLC

Inventor： Frédéric Heckmann ,  Ihab A. Ali

IPC: H05K7/20 ,  H01L23/373 ,  H05K9/00

Abstract: This document describes a thermal-control system that is integrated into a media-streaming device. The thermal-control system includes a combination of heat spreaders and materials with high thermal-conductivity. The thermal-control system may spread, transfer, and dissipate energy from a thermal-loading condition effectuated upon the media-streaming device to concurrently maintain temperatures of multiple thermal zones on or within the media-streaming device at or below multiple respective prescribed temperature thresholds.

公开(公告)号：US11521909B2

公开(公告)日：2022-12-06

申请号：US17065285

申请日：2020-10-07

Applicant: Google LLC

Inventor： Ihab A. Ali ,  Emil Rahim ,  Truong Ho Cong

IPC: H01L23/367 ,  H01L23/552 ,  H04R1/02 ,  H05K7/20

Abstract: This document describes a passive thermal-control system that can be integrated into an electronic speaker device and associated electronic speaker devices. The passive thermal-control system uses an architecture that combines heat spreaders and thermal interface materials to transfer heat from heat-generating electronic devices of the electronic speaker device to a housing component of the electronic speaker device. The housing component dissipates the heat to prevent a thermal runaway condition.

公开(公告)号：US20220248562A1

公开(公告)日：2022-08-04

申请号：US17728351

申请日：2022-04-25

Applicant: Google LLC

Inventor： Ihab A. Ali ,  Duen Hsing Hsieh

IPC: H05K7/20

Abstract: This document describes a reinforced graphite heat-spreader for a surface of a housing component of an electronic device. The reinforced graphite heat-spreader includes a heat-spreader material stack having a layer of graphite material to spread heat. The reinforced graphite heat-spreader also includes an interface material stack that joins the heat-spreader material stack to the housing surface of an electronic device. The interface material stack, which may be formed using embossing techniques, includes protuberances that may be formed from an adhesive material.