公开(公告)号：US07791195B2

公开(公告)日：2010-09-07

申请号：US11431703

申请日：2006-05-11

申请人： Shin Kim

发明人： Shin Kim

IPC分类号： H01L23/48 ,  H01L23/12

CPC分类号： H05K3/3436 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/4824 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/1815 ,  H05K2201/09745 ,  H05K2201/10977 ,  H05K2203/0465 ,  Y02P70/613 ,  H01L2224/05599

摘要： A board structure, a ball grid array (BGA) package and method thereof and a solder ball and method thereof. The example solder ball may include a solder portion and a grooved connection portion, formed through a partitioning process, configured to fit a corresponding protruding portion on a board. The example BGA package may include a plurality of the example solder balls. The example board structure may include the example BGA package connected to the board via the grooved connection portions and the protruding portions.

摘要翻译： 板结构，球栅阵列（BGA）封装及其方法和焊球及其方法。 示例性焊球可以包括通过分隔工艺形成的焊接部分和带槽的连接部分，其被配置为将相应的突出部分装配在电路板上。 示例性BGA封装可以包括多个示例性焊球。 示例板结构可以包括通过带槽连接部分和突出部分连接到板的示例性BGA封装。

公开(公告)号：US20070158843A1

公开(公告)日：2007-07-12

申请号：US11621042

申请日：2007-01-08

申请人： Shin Kim ,  Se-Yong OH

发明人： Shin Kim ,  Se-Yong OH

IPC分类号： H01L23/48

CPC分类号： H01L23/49816 ,  H01L23/3677 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K3/3436 ,  H05K2201/09572 ,  H05K2201/10666 ,  H05K2203/1394 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package with improved solder joint reliability, and a method of fabricating the same are provided. The semiconductor package comprises a printed circuit board (PCB) having a plurality of interconnection layers formed on its surface, and having a plurality of through holes connected to the interconnection layers. An adhesive member is attached to an upper surface of the PCB, and a semiconductor chip is electrically connected to the interconnection layers and mounted on an upper surface of the adhesive member. A solder connecting part fills each through hole so as to form a mechanically strong connection that is resistant to breakage during thermal transients and physical impacts.

摘要翻译： 提供了具有改进的焊点可靠性的半导体封装及其制造方法。 半导体封装包括印刷电路板（PCB），其具有在其表面上形成的多个互连层，并且具有连接到互连层的多个通孔。 粘合剂部件附着到PCB的上表面，并且半导体芯片电连接到互连层并且安装在粘合部件的上表面上。 焊接连接部分填充每个通孔，以便形成机械强连接，其在热瞬变和物理冲击期间耐断裂。

公开(公告)号：US20070096338A1

公开(公告)日：2007-05-03

申请号：US11518257

申请日：2006-09-11

申请人： Shin Kim ,  Se-Yong Oh

发明人： Shin Kim ,  Se-Yong Oh

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H05K3/3452 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/02 ,  H01L24/17 ,  H01L2224/0401 ,  H01L2224/10126 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/3436 ,  H05K2201/094 ,  H05K2201/097 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/09909 ,  Y02P70/613 ,  H01L2924/00

摘要： A semiconductor package may include a semiconductor chip and a substrate. The substrate may include a plurality of bonding pads for interfacing the semiconductor chip with a printed circuit board through conductive bumps that may be electrically connected to the bonding pads, respectively. The bonding pads may include non-solder mask defined (NSMD) bonding pads and solder mask defined (SMD) bonding pads that may be alternately arranged on the substrate. The SMD bonding pads may have sufficient reliability with respect to a drop test and the NSMD bonding pads may have sufficient reliability with respect to the board-level temperature cycle.

摘要翻译： 半导体封装可以包括半导体芯片和衬底。 衬底可以包括多个接合焊盘，用于通过可以分别电连接到接合焊盘的导电凸块来将半导体芯片与印刷电路板接口。 接合焊盘可以包括可以交替布置在衬底上的非阻焊掩模限定（NSMD）接合焊盘和焊接掩模限定（SMD）焊盘。 SMD接合焊盘相对于跌落测试可能具有足够的可靠性，并且NSMD焊盘可以相对于板级温度循环具有足够的可靠性。

公开(公告)号：US20050077166A1

公开(公告)日：2005-04-14

申请号：US10926401

申请日：2004-08-26

申请人： Shin Kim ,  Bong Lee

发明人： Shin Kim ,  Bong Lee

IPC分类号： H01H19/02 ,  H01H19/04 ,  H01H7/08

CPC分类号： H01H19/04 ,  H01H19/025

摘要： Disclosed is a rotary knob assembly for a home appliance. The assembly includes a rotary switch having an encoder and a shaft rotatably installed at the encoder, a knob coupled to the shaft of the rotary switch, and a support member provided around the rotary switch to support the rotary switch.

摘要翻译： 公开了一种用于家用电器的旋钮组件。 组件包括具有编码器和可旋转地安装在编码器上的轴的旋转开关，连接到旋转开关的轴的旋钮和设置在旋转开关周围以支撑旋转开关的支撑构件。