公开(公告)号：US06432746B1

公开(公告)日：2002-08-13

申请号：US09840725

申请日：2001-04-23

申请人： Shin Kim ,  Hee-Guk Choi ,  Se Ill Kim ,  Se Yong Oh

发明人： Shin Kim ,  Hee-Guk Choi ,  Se Ill Kim ,  Se Yong Oh

IPC分类号： H01L2144

摘要： A method for manufacturing a chip scale package (CSP) including a semiconductor chip and conductive bumps is disclosed. In the present invention, a flexible substrate is provided with a conductive pattern formed thereon. The substrate has a top surface and a bottom surface. Then, a first photosensitive resin pattern is formed over the top surface of the substrate. Next, the first photosensitive resin pattern is cured. Subsequently, a second photosensitive resin pattern is formed over the cured first photosensitive resin pattern. The second photosensitive resin pattern includes a slit comprising a bottom of the first photosensitive resin pattern and side walls of the second photosensitive resin pattern. With the present invention, the problem of burning of neighboring patterns as well as the problem of the overflow of the encapsulant can be overcome.

公开(公告)号：US20070158843A1

公开(公告)日：2007-07-12

申请号：US11621042

申请日：2007-01-08

申请人： Shin Kim ,  Se-Yong OH

发明人： Shin Kim ,  Se-Yong OH

IPC分类号： H01L23/48

CPC分类号： H01L23/49816 ,  H01L23/3677 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K3/3436 ,  H05K2201/09572 ,  H05K2201/10666 ,  H05K2203/1394 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package with improved solder joint reliability, and a method of fabricating the same are provided. The semiconductor package comprises a printed circuit board (PCB) having a plurality of interconnection layers formed on its surface, and having a plurality of through holes connected to the interconnection layers. An adhesive member is attached to an upper surface of the PCB, and a semiconductor chip is electrically connected to the interconnection layers and mounted on an upper surface of the adhesive member. A solder connecting part fills each through hole so as to form a mechanically strong connection that is resistant to breakage during thermal transients and physical impacts.

摘要翻译： 提供了具有改进的焊点可靠性的半导体封装及其制造方法。 半导体封装包括印刷电路板（PCB），其具有在其表面上形成的多个互连层，并且具有连接到互连层的多个通孔。 粘合剂部件附着到PCB的上表面，并且半导体芯片电连接到互连层并且安装在粘合部件的上表面上。 焊接连接部分填充每个通孔，以便形成机械强连接，其在热瞬变和物理冲击期间耐断裂。

公开(公告)号：US20070096338A1

公开(公告)日：2007-05-03

申请号：US11518257

申请日：2006-09-11

申请人： Shin Kim ,  Se-Yong Oh

发明人： Shin Kim ,  Se-Yong Oh

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H05K3/3452 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/02 ,  H01L24/17 ,  H01L2224/0401 ,  H01L2224/10126 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/3436 ,  H05K2201/094 ,  H05K2201/097 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/09909 ,  Y02P70/613 ,  H01L2924/00

摘要： A semiconductor package may include a semiconductor chip and a substrate. The substrate may include a plurality of bonding pads for interfacing the semiconductor chip with a printed circuit board through conductive bumps that may be electrically connected to the bonding pads, respectively. The bonding pads may include non-solder mask defined (NSMD) bonding pads and solder mask defined (SMD) bonding pads that may be alternately arranged on the substrate. The SMD bonding pads may have sufficient reliability with respect to a drop test and the NSMD bonding pads may have sufficient reliability with respect to the board-level temperature cycle.

摘要翻译： 半导体封装可以包括半导体芯片和衬底。 衬底可以包括多个接合焊盘，用于通过可以分别电连接到接合焊盘的导电凸块来将半导体芯片与印刷电路板接口。 接合焊盘可以包括可以交替布置在衬底上的非阻焊掩模限定（NSMD）接合焊盘和焊接掩模限定（SMD）焊盘。 SMD接合焊盘相对于跌落测试可能具有足够的可靠性，并且NSMD焊盘可以相对于板级温度循环具有足够的可靠性。

公开(公告)号：US09136446B2

公开(公告)日：2015-09-15

申请号：US13361555

申请日：2012-01-30

申请人： Shin Kim

发明人： Shin Kim

IPC分类号： H01L33/00 ,  H01L33/58 ,  H01L33/62 ,  H01L33/38 ,  H01L33/46 ,  H01L33/42

CPC分类号： H01L33/58 ,  H01L33/38 ,  H01L33/42 ,  H01L33/44 ,  H01L33/46 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2924/3025 ,  H01L2933/0083 ,  H01L2924/00014 ,  H01L2924/00

摘要： Embodiments provide a light emitting device including a light emitting structure having a first conduction type semiconductor layer, an active layer, and a second conduction type semiconductor layer, a metal filter of an irregular pattern on the light emitting structure, and openings between the irregular patterns in the metal filter.

摘要翻译： 实施例提供一种发光器件，其包括具有第一导电类型半导体层，有源层和第二导电类型半导体层的发光结构，发光结构上的不规则图案的金属滤光器，以及不规则图案之间的开口 在金属过滤器中。

公开(公告)号：US08049325B2

公开(公告)日：2011-11-01

申请号：US12472725

申请日：2009-05-27

申请人： Shin Mu-Seob ,  Tae-Hun Kim ,  Min-Gi Hong ,  Shin Kim ,  Tae-Hun Yoon

发明人： Shin Mu-Seob ,  Tae-Hun Kim ,  Min-Gi Hong ,  Shin Kim ,  Tae-Hun Yoon

IPC分类号： H01L23/538

CPC分类号： H01L23/13 ,  H01L23/49816 ,  H01L24/28 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/04042 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/16145 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/05099

摘要： An integrated circuit substrate includes an integrated circuit chip having a plurality of electrically conductive pads on a surface thereof and a printed circuit board mounted to the integrated circuit chip. The printed circuit board includes an alternating arrangement of first and second electrically conductive bond fingers. These first and second bond fingers are elevated at first and second different heights, respectively, relative to the plurality of electrically conductive pads. The printed circuit board also includes a first plurality of electrically insulating pedestals supporting respective ones of the first electrically conductive bond fingers at elevated heights relative to the second electrically conductive bond fingers. First and second pluralities of electrical interconnects (e.g., wires, beam leads) are also provided. The first plurality of electrical interconnects operate to electrically connect first ones of the plurality of electrically conductive pads to respective ones of the first electrically conductive bond fingers. The second plurality of electrical interconnects electrically connect second ones of the plurality of electrically conductive pads to respective ones of the second electrically conductive bond fingers.

摘要翻译： 集成电路基板包括在其表面上具有多个导电焊盘的集成电路芯片和安装到集成电路芯片的印刷电路板。 印刷电路板包括第一和第二导电键合指状物的交替布置。 这些第一和第二粘结指相对于多个导电垫分别在第一和第二不同的高度处升高。 印刷电路板还包括第一多个电绝缘基座，其相对于第二导电粘合指状件在升高的高度处支撑相应的第一导电键合指状物。 还提供了第一和第二多个电互连（例如，电线，光束引线）。 第一多个电互连操作以将多个导电焊盘中的第一个导电焊盘电连接到相应的第一导电焊接指状物。 所述第二多个电互连将所述多个导电焊盘中的第二导电焊盘电连接到所述第二导电焊接指中的相应导电焊盘。

公开(公告)号：US20110171882A1

公开(公告)日：2011-07-14

申请号：US12985048

申请日：2011-01-05

申请人： Jong-sun Ahn ,  In-seak Hwang ,  Soo-young Tak ,  Shin Kim ,  One-moon Chang

发明人： Jong-sun Ahn ,  In-seak Hwang ,  Soo-young Tak ,  Shin Kim ,  One-moon Chang

IPC分类号： B24B41/06 ,  B24B49/00

CPC分类号： B24B37/10 ,  B24B49/12

摘要： A chemical-mechanical polishing (CMP) apparatus for manufacturing a semiconductor device. The apparatus includes: a spin chuck for supporting and rotating a semiconductor wafer; a polisher comprising a polishing pad for planarizing a surface of the semiconductor wafer, the polisher moving along the surface of the semiconductor wafer by a polishing arm; and a polisher supporting device for supporting the polisher and maintaining the polisher in a horizontal state, while polishing an edge part of the surface of the semiconductor wafer, in order to improve polishing uniformity of a center part and the edge part of the semiconductor wafer. Accordingly, polishing uniformity of the center part and edge part of the semiconductor wafer may be improved, and a height of the polisher supporting device may be optimized according to a polishing degree. Also, the polisher may be easily supported, wear and tear of the support head may be minimized, and the support head may function as a conditioner.

摘要翻译： 一种用于制造半导体器件的化学机械抛光（CMP）装置。 该装置包括：用于支撑和旋转半导体晶片的旋转卡盘; 抛光机，包括用于平坦化半导体晶片的表面的抛光垫，抛光机通过抛光臂沿着半导体晶片的表面移动; 以及用于在抛光半导体晶片的表面的边缘部分的同时在支撑抛光机并将抛光机保持在水平状态的抛光机支撑装置，以便改善半导体晶片的中心部分和边缘部分的抛光均匀性。 因此，可以提高半导体晶片的中心部分和边缘部分的抛光均匀性，并且可以根据抛光度来优化抛光机支撑装置的高度。 此外，可以容易地支撑抛光机，可以使支撑头的磨损和撕裂最小化，并且支撑头可用作调节器。

公开(公告)号：US20100127381A1

公开(公告)日：2010-05-27

申请号：US12472725

申请日：2009-05-27

申请人： Mu-Seob Shin ,  Tae-Hun Kim ,  Min-Gi Hong ,  Shin Kim ,  Tae-Sung Yoon

发明人： Mu-Seob Shin ,  Tae-Hun Kim ,  Min-Gi Hong ,  Shin Kim ,  Tae-Sung Yoon

IPC分类号： H01L23/538 ,  H01L23/50 ,  H01L23/482

CPC分类号： H01L23/13 ,  H01L23/49816 ,  H01L24/28 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/04042 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/16145 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/05099

摘要： An integrated circuit substrate includes an integrated circuit chip having a plurality of electrically conductive pads on a surface thereof and a printed circuit board mounted to the integrated circuit chip. The printed circuit board includes an alternating arrangement of first and second electrically conductive bond fingers. These first and second bond fingers are elevated at first and second different heights, respectively, relative to the plurality of electrically conductive pads. The printed circuit board also includes a first plurality of electrically insulating pedestals supporting respective ones of the first electrically conductive bond fingers at elevated heights relative to the second electrically conductive bond fingers. First and second pluralities of electrical interconnects (e.g., wires, beam leads) are also provided. The first plurality of electrical interconnects operate to electrically connect first ones of the plurality of electrically conductive pads to respective ones of the first electrically conductive bond fingers. The second plurality of electrical interconnects electrically connect second ones of the plurality of electrically conductive pads to respective ones of the second electrically conductive bond fingers.

摘要翻译： 集成电路基板包括在其表面上具有多个导电焊盘的集成电路芯片和安装到集成电路芯片的印刷电路板。 印刷电路板包括第一和第二导电键合指状物的交替布置。 这些第一和第二粘结指相对于多个导电垫分别在第一和第二不同的高度处升高。 印刷电路板还包括第一多个电绝缘基座，其相对于第二导电粘合指状件在升高的高度处支撑相应的第一导电键合指状物。 还提供了第一和第二多个电互连（例如，电线，光束引线）。 第一多个电互连操作以将多个导电焊盘中的第一个导电焊盘电连接到相应的第一导电焊接指状物。 所述第二多个电互连将所述多个导电焊盘中的第二导电焊盘电连接到所述第二导电焊接指中的相应导电焊盘。

公开(公告)号：US20070102816A1

公开(公告)日：2007-05-10

申请号：US11431703

申请日：2006-05-11

申请人： Shin Kim

发明人： Shin Kim

IPC分类号： H01L23/48

CPC分类号： H05K3/3436 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/4824 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/1815 ,  H05K2201/09745 ,  H05K2201/10977 ,  H05K2203/0465 ,  Y02P70/613 ,  H01L2224/05599

摘要： A board structure, a ball grid array (BGA) package and method thereof and a solder ball and method thereof. The example solder ball may include a solder portion and a grooved connection portion, formed through a partitioning process, configured to fit a corresponding protruding portion on a board. The example BGA package may include a plurality of the example solder balls. The example board structure may include the example BGA package connected to the board via the grooved connection portions and the protruding portions.

摘要翻译： 板结构，球栅阵列（BGA）封装及其方法和焊球及其方法。 示例性焊球可以包括通过分隔工艺形成的焊接部分和带槽的连接部分，其被配置为将相应的突出部分装配在电路板上。 示例性BGA封装可以包括多个示例性焊球。 示例板结构可以包括通过带槽连接部分和突出部分连接到板的示例性BGA封装。

公开(公告)号：US20050249560A1

公开(公告)日：2005-11-10

申请号：US11118165

申请日：2005-04-28

申请人： Hwan Lee ,  Seo Pyun ,  Sang Lee ,  Byung Jin ,  Sang Lee ,  Tae Um ,  Yong Shim ,  Shin Kim

发明人： Hwan Lee ,  Seo Pyun ,  Sang Lee ,  Byung Jin ,  Sang Lee ,  Tae Um ,  Yong Shim ,  Shin Kim

IPC分类号： B23D61/00 ,  B23D61/04 ,  B28D1/12

CPC分类号： B23D61/04 ,  B28D1/121 ,  Y10T407/26

摘要： Disclosed is a diamond tool having a metal plate inserted therein. Between abrasive layers containing diamond particles is inserted a ferrous or non-ferrous metal plate having a wear resistance lower than that of the abrasive layers such that a concave groove is spontaneously formed during a cutting process, thereby reducing the contact load with a workpiece to thereby avoid vibration (wobbling) of a shank, and providing a discharge path for smoothly removing cutting chips and the cooling water. In addition, the content of abrasives and the wear resistance of bonding material are uniformly constituted so that the shrinkage rate does not need to be considered during sintering and the manufacturing process can be simplified, thereby reducing the manufacturing cost and improving the productivity therefor. Furthermore, the area of the metal plate can be controlled, thereby enabling an easy design conforming to the working conditions with a workpiece.

摘要翻译： 公开了一种金刚石工具，其中插入有金属板。 在含有金刚石颗粒的研磨层之间插入耐磨性低于研磨层的耐磨性的铁或非铁金属板，使得在切割过程中自发形成凹槽，从而减少与工件的接触载荷 避免柄的振动（摆动），并且提供用于平滑地去除切屑和冷却水的排出路径。 此外，研磨剂的含量和接合材料的耐磨性均匀地构成，使得在烧结期间不需要考虑收缩率，并且可以简化制造过程，从而降低制造成本并提高其生产率。 此外，可以控制金属板的面积，从而能够使与工件的工作条件相一致的简单设计。

公开(公告)号：US09239389B2

公开(公告)日：2016-01-19

申请号：US13616137

申请日：2012-09-14

申请人： Yeon Kyu Jeong ,  Shin Kim ,  Jeong Hun Kim ,  Jong Owan Kim ,  Sang Sik Yoon ,  Dong Hun Lee ,  Jea Yun So

发明人： Yeon Kyu Jeong ,  Shin Kim ,  Jeong Hun Kim ,  Jong Owan Kim ,  Sang Sik Yoon ,  Dong Hun Lee ,  Jea Yun So

IPC分类号： G02B17/08 ,  G01S17/00 ,  G05D1/02 ,  G01S17/88 ,  G01S17/93 ,  G01S7/481

CPC分类号： G01S17/00 ,  G01S7/4813 ,  G01S7/4814 ,  G01S7/4816 ,  G01S17/88 ,  G01S17/936 ,  G02B17/0808 ,  G05D1/0238 ,  G05D1/0248 ,  G05D2201/0203

摘要： An obstacle sensor includes a line light irradiating unit including a light-emitting unit, a light-emitting driving unit to drive the light-emitting unit, and a first conical mirror, an apex of which is disposed towards the light-emitting unit in a light irradiation direction of the light-emitting unit and which converts light emitted from the light-emitting unit into line light irradiated in all directions, and a reflected light receiving unit including a second conical mirror to condense light, that is irradiated from the first conical mirror and is then reflected from an obstacle, a lens, that is spaced from the apex of the second conical mirror by a predetermined distance and transmits the reflected light, an imaging unit to image the reflected light that passes through the lens, an image processing unit, and an obstacle sensing control unit.

摘要翻译： 障碍传感器包括：行光照射单元，包括发光单元，驱动发光单元的发光驱动单元;以及第一锥形反射镜，其顶点设置在发光单元中 发光单元的光照射方向，并将从发光单元发射的光转换为沿所有方向照射的线光;以及反射光接收单元，包括第二锥形镜以使光从第一锥形 然后从与第二锥形反射镜的顶点隔开预定距离的障碍物，透镜反射并透射反射光，成像单元对通过透镜的反射光进行成像，图像处理 单元和障碍物感测控制单元。