公开(公告)号：US20160125841A1

公开(公告)日：2016-05-05

申请号：US14711657

申请日：2015-05-13

Applicant: Intel Corporation

Inventor： Wah Yiu Kwong ,  Hong W. Wong

IPC: G09G5/02

CPC classification number: G09G5/02 ,  G06F1/1616 ,  G09G3/2003 ,  G09G3/3413 ,  G09G5/00 ,  G09G2320/041 ,  G09G2320/0693 ,  G09G2360/144 ,  Y10S345/901

Abstract: Device, system, and method for display calibration. For example, an apparatus includes: one or more color sensors, embedded within a body of a mobile device, to measure one or more color attributes of a visual element displayed by a display unit of the mobile device when a lid of the mobile device is in a closed position; and a color calibrator to calibrate one or more parameters of the display unit based on the one or more color attributes measured by the one or more color sensors.

公开(公告)号：US12022688B2

公开(公告)日：2024-06-25

申请号：US17829036

申请日：2022-05-31

Applicant: Intel Corporation

Inventor： Praveen Vishakantaiah ,  Zhiming J. Zhuang ,  Hong W. Wong

IPC: H10K50/87 ,  F28D15/02 ,  H01K5/02 ,  H10K10/46 ,  H10K59/00 ,  H10K85/10

CPC classification number: H10K50/87 ,  F28D15/02 ,  H01K5/02 ,  H10K10/466 ,  H10K59/00 ,  H10K85/113

Abstract: An electronic device may include an organic light emitting display (OLED), a heat generating device, and a heat spreading device. The heat generating device may provide heat directly to the heat spreading device, and the heat spreading device is to dissipate the heat from the heat generating device and evenly heat the OLED and lower a driving voltage of the OLED to reduce power consumption of the OLED.

公开(公告)号：US10817102B2

公开(公告)日：2020-10-27

申请号：US16086475

申请日：2016-06-21

Applicant: INTEL CORPORATION

Inventor： Hong W. Wong ,  Wah Yiu Kwong ,  Xiaoguo Liang ,  Jiancheng Tao ,  Yanbing Sun

IPC: G06F3/041 ,  A61F4/00 ,  G06F3/01 ,  G06F1/16 ,  H03K19/173 ,  H04R1/04

Abstract: In one example a input device for an electronic device comprises a first panel comprising an array of pressure sensors, a second panel comprising an array of apertures in fluid communication with the pressure sensors, and a controller comprising logic, at least partly including hardware logic, to receive a plurality of output signals from the plurality of pressure sensors, determine, from the plurality of output signals, a location of an input on the second panel, and generate a data point on a bitmap corresponding to the location of the input on the second panel. Other examples may be described.

公开(公告)号：US10585464B2

公开(公告)日：2020-03-10

申请号：US16089029

申请日：2016-03-28

Applicant: Intel Corporation

Inventor： Hong W. Wong ,  Wah Yiu Kwong ,  Cheong W. Wong ,  Vivek M. Paranjape ,  Chia-Hung S. Kuo

IPC: G06F1/20 ,  H04M1/02 ,  H05K5/02 ,  G06F1/16 ,  H05K7/20

Abstract: Systems, apparatuses and methods may provide for a thermal protection apparatus comprising a substrate including surfaces defining one or more channels and an array of openings adjacent to the one or more channels and an outer layer coupled to the substrate. The outer layer may include a plurality of opaque elastic regions positioned adjacent to the array of openings. Additionally, a fluid may be positioned within the one or more channels. In one example, the plurality of opaque elastic regions are expandable to become protrusions including one or more of a rectangular shape, a donut shape or a dome shape.

公开(公告)号：US10528081B2

公开(公告)日：2020-01-07

申请号：US15531712

申请日：2014-12-26

Applicant: Hong W. Wong ,  Songnan Yang ,  Xiaoguo Liang ,  Wah Yiu Kwong ,  Cheong W. Wong ,  INTEL CORPORATION

Inventor： Hong W. Wong ,  Songnan Yang ,  Xiaoguo Liang ,  Wah Yiu Kwong ,  Cheong W Wong

IPC: G06F1/16 ,  G02B27/01 ,  G06F1/26 ,  H02J7/00 ,  H04B5/00 ,  H02J50/10 ,  A41B1/08 ,  A41D1/00 ,  A41D1/04 ,  A41D1/18 ,  A41D3/00 ,  A41D31/02 ,  A41F9/00 ,  A41D27/20 ,  A41B1/00 ,  A41D1/02 ,  A41D3/02

Abstract: One embodiment provides an apparatus. The apparatus includes a source conductive path to couple to a load conductive path and to a power source. The source conductive path is included in a garment and the load conductive path is related to a head mounted wearable device (HMWD).

公开(公告)号：US10353435B2

公开(公告)日：2019-07-16

申请号：US15026046

申请日：2013-11-14

Applicant: Intel Corporation ,  Shanjun Deng ,  Hong W. Wong ,  Xiaoguo Liang ,  Jiancheng Johnson Tao ,  Wah Yiu Kwong

Inventor： Shanjun Deng ,  Hong W. Wong ,  Xiaoguo Liang ,  Jiancheng Johnson Tao ,  Wah Yiu Kwong

IPC: G06F1/16 ,  H01R13/62

Abstract: Particular embodiments described herein provide for an electronic device, such as a notebook computer or laptop, that includes a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a keyboard portion that includes a plurality of keys; a display portion that includes a first display interconnect for operating the electronic device in a first configuration, and a second display interconnect for operating the electronic device in a second configuration; and a docking portion that includes a keyboard interconnect configured to be mated with at least one of the first display interconnect and the second display interconnect.

公开(公告)号：US10133332B2

公开(公告)日：2018-11-20

申请号：US15113780

申请日：2014-03-31

Applicant: Intel Corporation

Inventor： Hong W. Wong ,  Wah Yiu Kwong ,  Xiaoguo Liang ,  Jiancheng Tao ,  Jian Wang

IPC: G10L25/78 ,  G06F1/32 ,  H04W52/02 ,  G06F3/16 ,  G10L25/84 ,  H04M1/725 ,  G10L15/20

Abstract: Methods and apparatus relating to a location aware power management scheme for an always-on-always-listen voice recognition system are described. In an embodiment, logic performs ambient noise trigger level analysis for a location and causes storage of an ambient noise trigger level threshold value for the location based on the ambient noise trigger level analysis. Furthermore, logic determines whether to cause modification to a state of an audio processor in response to detection of the audio processor at the location and comparison of a detected sound level at the location and the stored ambient noise trigger level threshold value. Other embodiments are also disclosed and claimed.

公开(公告)号：US20180246546A1

公开(公告)日：2018-08-30

申请号：US15754444

申请日：2015-09-25

Applicant: Denica N. LARSEN ,  Prosenjit GHOSH ,  James M. OKULEY ,  Hong W. WONG ,  Intel Corporation

Inventor： Prosenjit Ghosh ,  Denica N. Larsen ,  James M. Okuley ,  Hong W. Wong

IPC: G06F1/16 ,  H01R35/02 ,  E05D3/06 ,  E05D11/00

CPC classification number: G06F1/1683 ,  E05D3/06 ,  E05D5/10 ,  E05D11/0081 ,  E05D11/08 ,  E05D2005/102 ,  E05Y2800/102 ,  E05Y2900/606 ,  G06F1/16 ,  G06F1/1615 ,  G06F1/1618 ,  G06F1/1643 ,  G06F1/1647 ,  G06F1/1681 ,  G06F9/46 ,  G06F13/00 ,  H01R35/02

Abstract: Particular embodiments described herein provide for device that includes a first housing that includes a first module, a second housing that includes a second module, and a hinge that rotatable couples the first housing to the second housing. The hinge can include a first axle, a second axle, and a plurality of hinge links. At least one of the hinge links includes an interconnect to provide a communication path between the first module and the second module.

公开(公告)号：US20180138387A1

公开(公告)日：2018-05-17

申请号：US15553372

申请日：2015-03-27

Applicant: INTEL CORPORATION

Inventor： Hong W. Wong ,  Wah Yiu Kwong ,  Shaorong Zhou ,  Xiaoguo Liang ,  Cheong W. Wong ,  Yanbing Sun

IPC: H01L37/02

CPC classification number: H01L37/02 ,  F28D15/02 ,  F28D20/02 ,  F28D20/028 ,  F28D2021/0028 ,  F28F2013/006 ,  H01L23/4275 ,  H01L35/32 ,  H05K3/284 ,  Y02E60/145

Abstract: Various embodiments are generally directed to an apparatus, method and other techniques to receive thermal energy from a source, convert phase change material (102) from an initial state to a secondary state in response to absorption of the thermal energy, and transfer the thermal energy from the phase change material (102) to a thermoelectric component (106). In addition, various embodiments may include collecting, conducting and converting the thermal energy into electrical energy for use in powering one or more electronic components.

公开(公告)号：US20170201116A1

公开(公告)日：2017-07-13

申请号：US15323903

申请日：2014-09-28

Applicant: Intel Corporation

Inventor： Xiaoguo Liang ,  Hong W. Wong ,  Songnan Yang ,  Jiancheng Tao ,  Jian Wang

IPC: H02J7/02 ,  H02J50/90 ,  H02J50/40

CPC classification number: H02J7/025 ,  H02J50/00 ,  H02J50/40 ,  H02J50/90 ,  H02J2007/0062

Abstract: In one example an electronic device comprises at least one sensor to detect a remote power source and a controller comprising logic, at least partly including hardware logic, to determine an input power parameter at a wireless charging device, generate a signal in response to the input power parameter, and forward the signal to an actuator device. Other examples may be described.