公开(公告)号：US09353560B2

公开(公告)日：2016-05-31

申请号：US14318288

申请日：2014-06-27

Applicant: Intel Corporation

Inventor： Mark E. Sprenger ,  Russell S. Aoki ,  Paul J. Gwin ,  Ralph V. Miele ,  Shawn McEuen ,  Mark MacDonald ,  David Pidwerbecki

IPC: E05D11/08 ,  E05D3/02 ,  G06F1/16 ,  H05K5/02

CPC classification number: G06F3/033 ,  E05D3/02 ,  E05D11/08 ,  E05D11/082 ,  E05D2011/085 ,  E05D2011/088 ,  G06F1/1616 ,  G06F1/1679 ,  G06F1/1681 ,  G06F1/1683 ,  H05K5/0226

Abstract: In one example an electronic device comprises a controller, a chassis comprising a first section and a second section, and a hinge assembly to connect the first section of the chassis to the second section of the chassis comprising a shaft rotatable about a first axis, a brake selectively engageable with a portion of the shaft, and an electroactive polymer (EAP) actuator coupled to the brake, wherein the EAP actuator selectively engages the brake with a portion of the shaft in response to a signal from the controller. Other examples may be described.

Abstract translation: 在一个示例中，电子设备包括控制器，包括第一部分和第二部分的底盘以及将底盘的第一部分连接到底架的第二部分的铰链组件，包括可围绕第一轴线旋转的轴， 制动器可选择性地与轴的一部分接合，以及耦合到制动器的电活性聚合物（EAP）致动器，其中响应于来自控制器的信号，EAP致动器选择性地将制动器与轴的一部分接合。 可以描述其他示例。

公开(公告)号：US20240260228A1

公开(公告)日：2024-08-01

申请号：US18565916

申请日：2022-04-01

Applicant: Intel Corporation

Inventor： Jimmy Chuang ,  Jin Yang ,  Yuan-Liang Li ,  David Shia ,  Yuehong Fan ,  Hao Zhou ,  Sandeep Ahuja ,  Peng Wei ,  Ming Zhang ,  Je-Young Chang ,  Paul J. Gwin ,  Ra'anan Sover ,  Lianchang Du ,  Eric D. McAfee ,  Timothy Glen Hanna ,  Liguang Du ,  Qing Jiang ,  Xicai Jing ,  Liu Yu ,  Guoliang Ying ,  Cong Zhou ,  Yinglei Ren ,  Xinfeng Wang

IPC: H05K7/20

CPC classification number: H05K7/20236 ,  H05K7/20254 ,  H05K7/20263 ,  H05K7/20463

Abstract: Immersion cooling systems, apparatus, and related methods for cooling electronic computing platforms and/or associated electronic components are disclosed herein. An example apparatus includes a first chamber including a first coolant disposed therein, the first coolant having a first boiling point. The example apparatus further includes a second chamber disposed in the first chamber, the second chamber to receive an electronic component therein. The second chamber includes a second coolant having a second boiling point different that the first boiling point. The second chamber is to separate the electronic component and the second coolant from the first coolant.

公开(公告)号：US11737707B2

公开(公告)日：2023-08-29

申请号：US16576045

申请日：2019-09-19

Applicant: Intel Corporation

Inventor： Mark E. Sprenger ,  Paul J. Gwin ,  Aaron P. Anderson ,  Christian Amoah-Kusi

IPC: A61B5/022 ,  A61B5/00 ,  A61B5/026 ,  A61B7/04 ,  A61B5/0265

CPC classification number: A61B5/6804 ,  A61B5/0004 ,  A61B5/0261 ,  A61B5/02208 ,  A61B5/02225 ,  A61B5/681 ,  A61B7/04 ,  A61B7/045 ,  A61B5/0265

Abstract: Example blood pressure apparatus using active materials and related methods are described herein. An example apparatus includes a band to be worn around a limb of a user, an active material carried by the band and a controller to: (1) apply an activation signal to the active material to constrict blood flow in the limb, and (2) reduce the activation signal to allow blood flow in the limb.

公开(公告)号：US11182100B2

公开(公告)日：2021-11-23

申请号：US16183654

申请日：2018-11-07

Applicant: Intel Corporation

Inventor： Paul J. Gwin

IPC: G06F3/06

Abstract: An apparatus is described. The apparatus includes a solid state drive (SSD) controller that includes logic circuitry to perform an event based hottest non volatile memory die identification process in which one or more different hottest non volatile memory die within the SSD are able to be identified over an operational time period of the SSD in response to different respective events that arise during the operational time period.

公开(公告)号：US10409998B2

公开(公告)日：2019-09-10

申请号：US15977081

申请日：2018-05-11

Applicant: Intel Corporation

Inventor： Mark E. Sprenger ,  Paul J. Gwin

IPC: G06F21/60 ,  G06F11/30 ,  G06F21/50 ,  G06F21/70 ,  G06F21/84 ,  G06F21/55

Abstract: In an embodiment, a system includes a processor with at least one core to execute an application to provide intrusion detection and protection, a radar sensor to detect presence of one or more persons within a detection zone about the system and to output a detection notification responsive to the presence detection, and a peripheral controller coupled to the radar sensor to receive the detection notification and to provide the detection notification to the application, where the application is to cause a protection measure to be performed responsive to the detection notification. Other embodiments are described and claimed.

公开(公告)号：US20190114212A1

公开(公告)日：2019-04-18

申请号：US15783543

申请日：2017-10-13

Applicant: Intel Corporation

Inventor： Paul J. Gwin

IPC: G06F9/50 ,  G06F11/34 ,  G06F11/30

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to receive a plurality of thermal parameters for a device, identify one or more of the plurality of thermal parameters that affect a thermal response of the device, and create a thermal vector for the device using the one or more of the plurality of thermal parameters that affect the thermal response of the device, where the thermal vector can be used to predict a new thermal response of the device. In an example, the thermal vector includes weighted thermal parameters.

公开(公告)号：US20180348941A1

公开(公告)日：2018-12-06

申请号：US15778755

申请日：2015-12-22

Applicant: Intel Corporation

Inventor： Kenan Huseyin Arik ,  Mark E. Sprenger ,  Aleksander Magi ,  Paul J. Gwin

IPC: G06F3/041 ,  G06F1/16

Abstract: Particular embodiments described herein provide for an electronic device, that includes a display and a bounce reduction mechanism configured to provide an active counterforce to a force on the display. In an example, a proximity sensor can detect when a device is going to create the force on the display. In another example, a screen bounce detection engine to detect oscillations of the display and the bounce reduction mechanism is configured to provide an active counterforce to dampen oscillation of the display.

公开(公告)号：US20180322293A1

公开(公告)日：2018-11-08

申请号：US15977081

申请日：2018-05-11

Applicant: Intel Corporation

Inventor： Mark E. Sprenger ,  Paul J. Gwin

IPC: G06F21/60 ,  G06F21/70 ,  G06F21/50 ,  G06F11/30 ,  G06F21/55 ,  G06F21/84

CPC classification number: G06F21/60 ,  G06F11/30 ,  G06F21/50 ,  G06F21/55 ,  G06F21/70 ,  G06F21/84 ,  G06F2221/032

Abstract: In an embodiment, a system includes a processor with at least one core to execute an application to provide intrusion detection and protection, a radar sensor to detect presence of one or more persons within a detection zone about the system and to output a detection notification responsive to the presence detection, and a peripheral controller coupled to the radar sensor to receive the detection notification and to provide the detection notification to the application, where the application is to cause a protection measure to be performed responsive to the detection notification. Other embodiments are described and claimed.

公开(公告)号：US10061357B2

公开(公告)日：2018-08-28

申请号：US14735566

申请日：2015-06-10

Applicant: INTEL CORPORATION

Inventor： Tomer Rider ,  Dor Levy ,  Ramon C. Cancel Olmo ,  Paul J. Gwin

IPC: G06F1/00 ,  G06F1/16

CPC classification number: G06F1/1652

Abstract: Techniques related to a method, apparatus, and system for flexible displays are described herein. For example, an apparatus may include a flexible display and an electroactive layer. Shape changes in the electroactive layer generate shape changes in the flexible display. The shape changes include one or more coil turns configured to coil the flexible display.

公开(公告)号：US10056308B2

公开(公告)日：2018-08-21

申请号：US15431296

申请日：2017-02-13

Applicant: Intel Corporation

Inventor： Paul J. Gwin

IPC: H01L23/12 ,  H01L23/053 ,  H01L23/04 ,  H01L23/06 ,  G06F1/18 ,  H01L21/48 ,  H01L21/50 ,  H01L21/56 ,  H01L23/08 ,  H01L23/31 ,  H01L23/00 ,  H01L23/10

CPC classification number: H01L23/053 ,  G06F1/18 ,  H01L21/4803 ,  H01L21/481 ,  H01L21/4817 ,  H01L21/50 ,  H01L21/565 ,  H01L23/04 ,  H01L23/06 ,  H01L23/08 ,  H01L23/10 ,  H01L23/3142 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/16113 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/0133 ,  H01L2924/06 ,  H01L2924/0615 ,  H01L2924/0635 ,  H01L2924/065 ,  H01L2924/068 ,  H01L2924/069 ,  H01L2924/0695 ,  H01L2924/0705 ,  H01L2924/10253 ,  H01L2924/1438 ,  H01L2924/1443 ,  H01L2924/15153 ,  H01L2924/16152 ,  H01L2924/16176 ,  H01L2924/1619 ,  H01L2924/19105 ,  H01L2924/00

Abstract: Embodiments of the present disclosure are directed toward a molded composite enclosure for an integrated circuit (IC) assembly. In one embodiment, an enclosure for an integrated circuit (IC) assembly may include a molded lid structure having a body portion, and a side portion that extends from the body portion and forms a cavity configured to house the IC assembly, wherein the body portion and the side portion share a contiguous interior material comprising a polymer and share a contiguous exterior material comprising a metal, the contiguous interior material having an opening formed in the body portion such that the IC assembly can be thermally coupled with the contiguous exterior material through the opening. Other embodiments may be described and/or claimed.