公开(公告)号：US20240170288A1

公开(公告)日：2024-05-23

申请号：US18056393

申请日：2022-11-17

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Mukta Ghate Farooq ,  Qianwen Chen ,  Shahid Butt ,  Eric Perfecto ,  Michael P. Belyansky ,  Katsuyuki Sakuma ,  John Knickerbocker

IPC: H01L21/027 ,  H01L23/528 ,  H01L23/535

CPC classification number: H01L21/0275 ,  H01L23/5286 ,  H01L23/535

Abstract: A stack structure that includes: a device wafer, a handler wafer, and a bonding structure disposed between the device wafer and the handler wafer, wherein one or both of the device wafer and the handler wafer have a release layer that is configured to be substantially or completely vaporized by infrared ablation when exposed to an infrared laser energy. The device wafer includes at least two consecutive layers adjacent the bonding structure that together include a plurality of fill portions that substantially or completely disable entry of the infrared laser energy into a plurality of layers of the device wafer below the two consecutive layers adjacent the bonding structure.

公开(公告)号：US20240153894A1

公开(公告)日：2024-05-09

申请号：US18053774

申请日：2022-11-09

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： John Knickerbocker ,  Mukta Ghate Farooq ,  Keiji Matsumoto

IPC: H01L23/00 ,  H01L25/065

CPC classification number: H01L24/05 ,  H01L24/08 ,  H01L24/80 ,  H01L25/0657 ,  H01L2224/0231 ,  H01L2224/02372 ,  H01L2224/05548 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05576 ,  H01L2224/05647 ,  H01L2224/05687 ,  H01L2224/08055 ,  H01L2224/08056 ,  H01L2224/08145 ,  H01L2224/80203 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/351

Abstract: Embodiments of present invention provide a semiconductor structure. The semiconductor structure includes a first semiconductor wafer and a second semiconductor wafer; and a bonding structure between the first semiconductor wafer and the second semiconductor wafer, where the bonding structure includes a first coaxial pad embedded in a first dielectric layer and a second coaxial pad embedded in a second dielectric layer, and the first coaxial pad is substantially aligned with the second coaxial pad. In one embodiment, the first coaxial pad includes an inner pad of substantially rectangular shape and an outer pad of substantially rectangular ring shape surrounding the inner pad.

公开(公告)号：US11876233B2

公开(公告)日：2024-01-16

申请号：US16796636

申请日：2020-02-20

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John Knickerbocker ,  Qianwen Chen

IPC: H01M50/10 ,  H01M10/0585 ,  H01M50/502

CPC classification number: H01M50/10 ,  H01M10/0585 ,  H01M50/502

Abstract: Thin Film Batteries are made of battery layers. Each battery layer has a substrate with one or more battery structures on the substrate surface. The battery structures have a first electrode connection and a second electrode, a first electrode (e.g. a cathode or anode) is electrically connected to the first electrode connection and a second electrode (e.g. an anode or cathode) is electrically connected to the second electrode connection. An electrolyte is at least partial disposed between and electrically connected to the first and second electrodes. A first edge connection on one of the substrate edges is physically and electrically connected to the first electrode connection. A second edge connection on one of the substrate edges is physically and electrically connected to the second electrode connection. An electrically insulating lamination is disposed on the substrate and covers the components except for the first and second edge connections, connected to respective battery electrodes. A first stack external connection electrical connects two or more of the first edge connections and a second stack external connection electrical connects two or more of the second edge connections. A first and second battery pole are connected to the respective first and second stack external connections. The TFBs are hermetically sealed.

公开(公告)号：US20230178404A1

公开(公告)日：2023-06-08

申请号：US17541946

申请日：2021-12-03

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Akihiro Horibe ,  Qianwen Chen ,  RISA MIYAZAWA ,  Michael P. Belyansky ,  John Knickerbocker ,  Takashi Hisada

IPC: H01L21/68 ,  H01L21/683

CPC classification number: H01L21/681 ,  H01L21/6835 ,  H01L2221/68381 ,  H01L2221/6834

Abstract: Handler wafers and methods of handling a wafer include positioning a handler, which is attached to a wafer by a bonding layer that comprises a debonding layer, an optical enhancement layer, and an anti-reflection layer. The handler is debonded from the wafer using a laser that emits laser energy at a wavelength that is absorbed by the debonding layer and that is confined to the debonding layer by the optical enhancement layer, such that the material of the debonding layer ablates when exposed to the laser energy to release the wafer.

公开(公告)号：US20230163100A1

公开(公告)日：2023-05-25

申请号：US17535664

申请日：2021-11-25

Applicant: International Business Machines Corporation

Inventor： Katsuyuki Sakuma ,  Mukta Ghate Farooq ,  John Knickerbocker

IPC: H01L25/065 ,  H01L23/538 ,  H01L23/00 ,  H01L23/053 ,  H01L23/36 ,  H01L25/00 ,  H01L21/56

CPC classification number: H01L25/0655 ,  H01L23/5384 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/562 ,  H01L23/053 ,  H01L24/08 ,  H01L23/36 ,  H01L25/50 ,  H01L21/561 ,  H01L21/568 ,  H01L2224/08225

Abstract: A semiconductor die package that has a substrate with one or more substrate layers with one or more substrate connections. A substrate layer can include one or more redistribution layers (RDLs). One or more dies (e.g., multiple dies) are disposed on a top substrate layer. The dies have one or more die external connections. Some of the die external connections are electrically connected to one or more substrate connections. One or more metallic dam stiffeners form into a dam enclosure that is disposed on and physically connected to the top substrate layer. The dam enclosure encloses one or more of the dies. The metallic dam enclosure has one or more electrically connected regions where the metallic dam enclosure is electrically connected to one or more of the substrate horizontal connections and one or more electrically insulated regions where the metallic dam enclosure is electrically insulated from one or more of the substrate horizontal connections and the substrate via connections. In different embodiments, the dam enclosure stiffens the substrates/package during manufacture, assembly, and operation; provides confinement for underfill application; and provides a heat conduction path for heat removal. Methods of manufacturing and assembling the die package are disclosed.

公开(公告)号：US10833296B2

公开(公告)日：2020-11-10

申请号：US15715722

申请日：2017-09-26

Applicant: International Business Machines Corporation

Inventor： Qianwen Chen ,  Bing Dang ,  John Knickerbocker ,  Bo Wen

IPC: H01M2/02 ,  H01M10/0525 ,  H01M10/0565 ,  H01M10/0562 ,  H01M10/04 ,  H01M6/40 ,  H01M6/18 ,  H01M2/10 ,  H01M2/08

Abstract: Systems and/or techniques associated with a solid-state microbattery packaging system are provided. In one example, a device comprises a substrate layer and a tape substrate layer. The substrate layer is associated with a set of solid-state microbattery components. The tape substrate comprises a releasable adhesive material and a polymer sealing material. A conductive surface associated with the set of solid-state microbattery components is disposed on the releasable adhesive material of the tape substrate layer.

公开(公告)号：US20200274113A1

公开(公告)日：2020-08-27

申请号：US16283654

申请日：2019-02-22

Applicant: International Business Machines Corporation ,  FRONT EDGE TECHNOLOGY, INC.

Inventor： Bing Dang ,  Qianwen Chen ,  Yu Luo ,  John Knickerbocker ,  Jae-Woong Nah ,  Kai Liu ,  Po-wen Cheng ,  Tung-hsiu Shih ,  Mengnian Niu ,  Kai-wei Nieh

IPC: H01M2/06 ,  H01M10/052 ,  H01M10/0585 ,  H01M2/30

Abstract: Vertical via connections to a battery are hermetically sealed to prevent environmental factors (e.g. moisture, oxygen, and nitrogen) from entering the internals of the battery through porous conductive material filling the vias resulting in reduced battery performance and battery failure.

公开(公告)号：US20190288540A1

公开(公告)日：2019-09-19

申请号：US15920803

申请日：2018-03-14

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  Duixian Liu ,  Jean-Olivier Plouchart ,  John Knickerbocker

IPC: H02J7/02 ,  H04B1/3827 ,  H02J50/10 ,  H02J50/80 ,  H02J50/90 ,  A61L2/26 ,  A61L2/10 ,  A61L2/04 ,  A61L2/16

Abstract: Systems, devices, and techniques facilitating wirelessly charging and/or communicating with one or more electronic devices (e.g., electronic wearable devices) are provided. A device can comprise a memory and a storage component that can be operatively coupled to the memory. The storage component can comprise one or more recesses that can receive a second device that can be charged by the storage component. The storage component can comprise a charging circuit and an inductive circuit that can be coupled to the charging circuit. The storage component can harvest energy from one or more energy sources to charge the charging circuit. Based on the energy harvested, the inductive circuit can inductively couple to the second device having a second inductive circuit and positioned in at least one of the recesses and the inductive circuit can charge a power source of the second device.

公开(公告)号：US20190097183A1

公开(公告)日：2019-03-28

申请号：US15841720

申请日：2017-12-14

Applicant: International Business Machines Corporation

Inventor： Qianwen Chen ,  Bing Dang ,  John Knickerbocker ,  Bo Wen

IPC: H01M2/02 ,  H01M10/0525

Abstract: Systems and/or techniques associated with a solid-state microbattery packaging system are provided. In one example, a device comprises a substrate layer and a tape substrate layer. The substrate layer is associated with a set of solid-state microbattery components. The tape substrate comprises a releasable adhesive material and a polymer sealing material. A conductive surface associated with the set of solid-state microbattery components is disposed on the releasable adhesive material of the tape substrate layer.

公开(公告)号：US20190097182A1

公开(公告)日：2019-03-28

申请号：US15715722

申请日：2017-09-26

Applicant: International Business Machines Corporation

Inventor： Qianwen Chen ,  Bing Dang ,  John Knickerbocker ,  Bo Wen

IPC: H01M2/02 ,  H01M10/0525

Abstract: Systems and/or techniques associated with a solid-state microbattery packaging system are provided. In one example, a device comprises a substrate layer and a tape substrate layer. The substrate layer is associated with a set of solid-state microbattery components. The tape substrate comprises a releasable adhesive material and a polymer sealing material. A conductive surface associated with the set of solid-state microbattery components is disposed on the releasable adhesive material of the tape substrate layer.