公开(公告)号：US20210096157A1

公开(公告)日：2021-04-01

申请号：US16583494

申请日：2019-09-26

Applicant: International Business Machines Corporation

Inventor： Layne A. Berge ,  Matthew Doyle ,  Kyle Schoneck ,  Thomas W. Liang ,  Matthew A. Walther ,  Jason J. Bjorgaard ,  John R. Dangler

IPC: G01R1/04 ,  G01R19/252 ,  G01R31/28

Abstract: Electrical current flow in a ball grid array (BGA) package can be measured by an apparatus including an integrated circuit (IC) electrically connected to the BGA package. Solder balls connect the BGA package to a printed circuit board (PCB). A current sense mesh can be placed between adjacent solder balls and is attached to the upper surface of the PCB. The solder balls are electrically connected to supply current from the PCB through the BGA package to the IC. A MUX/Sequencer can sequentially connect wires of the current sense mesh to an amplifier. The amplifier can amplify a voltage induced on the current sense mesh by current flow into the BGA package. A sensing analog-to-digital converter (ADC) is electrically connected to convert a voltage at the output of the amplifier into digital output signals.

公开(公告)号：US20200257005A1

公开(公告)日：2020-08-13

申请号：US16270631

申请日：2019-02-08

Applicant: International Business Machines Corporation

Inventor： Gerald Bartley ,  Matthew Doyle ,  Mark J. Jeanson ,  Darryl Becker

IPC: G01T1/24 ,  H01L27/30 ,  H01L51/42 ,  H01G9/20 ,  H01L51/00

Abstract: Disclosed is a device for detecting non-intrusive inspections. The device includes an electrical component with a first end cap and a second end cap. Additionally, the device includes an x-ray sensitive material electrically coupling the first end cap and the second end cap. The x-ray sensitive material has a first state having a first conductivity and a second state having a second conductivity. The sensing material is configured to transform from the first state to the second state when exposed to an initiating voltage.

公开(公告)号：US20200175899A1

公开(公告)日：2020-06-04

申请号：US16206318

申请日：2018-11-30

Applicant: International Business Machines Corporation

Inventor： Layne A. Berge ,  Matthew Doyle ,  Kyle Schoneck ,  Jason J. Bjorgaard ,  Thomas W. Liang ,  John R. Dangler

IPC: G09G3/00 ,  G09G5/00 ,  G06F3/14

Abstract: A system and a method for universally projecting an image on a display device to an outside device. The system includes a housing, a screen capture device, a serializer, and a display interface. Further, the system includes a sound capture device, and a bracket to secure the display device to the system. The method includes receiving an image of a display device, converting the image to a digital signal, serializing the digital signal, and transmitting the serialized digital signal to an outside device.

公开(公告)号：US20200153089A1

公开(公告)日：2020-05-14

申请号：US16185763

申请日：2018-11-09

Applicant: International Business Machines Corporation

Inventor： Samuel Connor ,  Joseph Kuczynski ,  Matthew Doyle ,  Stuart B. Benefield

IPC: H01Q1/36 ,  H05K3/06 ,  H01Q1/38

Abstract: Embodiments herein describe a capillary containing a eutectic conductive liquid (e.g., EGaIn) and an electrolyte (e.g., NaOH) that is integrated into a printed circuit board (PCB). In one embodiment, the capillary is formed in a through-hole in the PCB and has negative and positive electrodes at its respective ends to seal the eutectic conductive liquid and the electrolyte. The capillary further includes one or more electrodes that extend through a side of the portion of the capillary containing the liquids. The wiper electrodes also make electrical contact with respective conductive layers in the PCB. Using a DC voltage between the negative and positive electrodes, the eutectic conductive liquid forms electrical connections between the wiper electrodes, which in turn, forms electrical connections between the conductive layers in the PCB.

公开(公告)号：US10481496B2

公开(公告)日：2019-11-19

申请号：US15635374

申请日：2017-06-28

Applicant: International Business Machines Corporation

Inventor： Gerald Bartley ,  Matthew Doyle ,  Darryl Becker ,  Mark Jeanson

IPC: G03F7/20 ,  G03F1/38 ,  G03F7/038 ,  G03F7/039 ,  G03F7/16 ,  G03F7/26 ,  G03F7/40 ,  H05K3/40

Abstract: The present invention provides a process and a structure of forming conductive vias using a light guide. In an exemplary embodiment, the process includes providing a via in a base material in a direction perpendicular to a plane of the base material, applying a photoresist layer to an interior surface of the via, inserting a light guide into the via, exposing, by the light guide, a portion of the photoresist layer to light, thereby resulting in an exposed portion of the photoresist layer and an unexposed portion of the photoresist layer, removing a portion of the photoresist layer, and plating an area of the via, where the photoresist has been removed, with a metal, thereby resulting in a portion of the via plated with metal and a portion of the via not plated with metal.

公开(公告)号：US20190021173A1

公开(公告)日：2019-01-17

申请号：US15796888

申请日：2017-10-30

Applicant: International Business Machines Corporation

Inventor： Joseph Kuczynski ,  Timothy Tofil ,  Jeffrey N. Judd ,  Matthew Doyle ,  Scott D. Strand

IPC: H05K3/38 ,  H01L21/02 ,  H05K3/42

CPC classification number: H05K3/386 ,  H01L21/02118 ,  H05K1/0251 ,  H05K1/0292 ,  H05K1/0298 ,  H05K3/4069 ,  H05K3/429 ,  H05K2201/0329 ,  Y10T29/49165

Abstract: A triggering condition is applied to a conductive polymer positioned in a drilled hole in a printed circuit board. The applied triggering condition causes the polymer to vertically expand within the drilled hole such that the expanded polymer creates an electrically conductive path between contact pads located in different layers of the printed circuit board.

公开(公告)号：US20190004428A1

公开(公告)日：2019-01-03

申请号：US15635374

申请日：2017-06-28

Applicant: International Business Machines Corporation

Inventor： Gerald Bartley ,  Matthew Doyle ,  Darryl Becker ,  Mark Jeanson

IPC: G03F7/20 ,  G03F7/038 ,  G03F7/039 ,  G03F7/16 ,  G03F7/26 ,  G03F7/40 ,  G03F1/38 ,  H05K3/40

Abstract: The present invention provides a process and a structure of forming conductive vias using a light guide. In an exemplary embodiment, the process includes providing a via in a base material in a direction perpendicular to a plane of the base material, applying a photoresist layer to an interior surface of the via, inserting a light guide into the via, exposing, by the light guide, a portion of the photoresist layer to light, thereby resulting in an exposed portion of the photoresist layer and an unexposed portion of the photoresist layer, removing a portion of the photoresist layer, and plating an area of the via, where the photoresist has been removed, with a metal, thereby resulting in a portion of the via plated with metal and a portion of the via not plated with metal.

公开(公告)号：US12284796B2

公开(公告)日：2025-04-22

申请号：US17447583

申请日：2021-09-14

Applicant: International Business Machines Corporation

Inventor： Samuel R. Connor ,  Eric J. Campbell ,  Stuart Brett Benefield ,  Matthew Doyle ,  Matteo Cocchini

IPC: H05K9/00 ,  B05B11/00 ,  B05B17/06 ,  C08J9/00 ,  C08K9/10

Abstract: A method, a device, and a composition are disclosed. The method includes providing a polyol blend that includes a polyol resin and an electromagnetic (EMA) additive, providing an isocyanate resin selected such that blending the isocyanate resin with the polyol blend results in an EMA spray foam. The device includes a first compartment containing an isocyanate resin and a second compartment containing a polyol blend, which includes a polyol resin and an EMA additive. The composition includes a polyurethane spray foam and an EMA additive blended into the polyurethane spray foam.

公开(公告)号：US20240097292A1

公开(公告)日：2024-03-21

申请号：US17932794

申请日：2022-09-16

Applicant: International Business Machines Corporation

Inventor： Mark K. Hoffmeyer ,  Matthew Doyle ,  Kyle Schoneck ,  Layne A. Berge ,  Matthew A. Walther ,  Thomas W. Liang ,  John R. Dangler ,  Jason J. Bjorgaard

IPC: H01M50/583 ,  H05K1/11

CPC classification number: H01M50/583 ,  H05K1/111 ,  H05K2201/10037 ,  H05K2201/10181

Abstract: A voltage source watchdog comprising a passive device is placed in series between a voltage source and a load. The passive device includes an electromigration (EM) joint of known materials that will create an electromigration void after a specified amount of current passes through the EM joint. After a known amount of current as passed through, a void is created and a voltage will no longer be sensed, thus providing a sure safety mode situation. When the voltage source is a battery, the battery life may be extended by selectively enabling voltage measurement operations for the proposed watchdog.

公开(公告)号：US11652034B2

公开(公告)日：2023-05-16

申请号：US17132041

申请日：2020-12-23

Applicant: International Business Machines Corporation

Inventor： Darryl Becker ,  Mark J. Jeanson ,  Gerald Bartley ,  Matthew Doyle

IPC: H05K1/18 ,  H01L23/498 ,  H01L23/58 ,  H05K1/02 ,  H05K3/34 ,  H01G4/30 ,  H01G4/232

CPC classification number: H01L23/49811 ,  H01L23/58 ,  H05K1/0243 ,  H05K1/181 ,  H05K3/3436 ,  H01G4/232 ,  H01G4/30 ,  H05K2201/10015 ,  H05K2201/1053 ,  H05K2201/10378 ,  H05K2201/10515

Abstract: A method of attaching an integrated circuit (IC) package to a printed circuit board (PCB) with a set of direct current (DC) blocking capacitors includes: applying a conductive attachment material to a first set of attachment pads located on a first planar surface of the IC package; aligning the set of DC blocking capacitors in accordance with corresponding positions of the first set of attachment pads; attaching the set of DC blocking capacitors to the IC package by: positioning the aligned set of DC blocking capacitors so that a first surface of a first DC blocking capacitor of the set of DC blocking capacitors is adjacent to a corresponding attachment pad of the first set of attachment pads; and connecting the conductive attachment material to the IC package and to the first surface of the first DC blocking capacitor to create an IC package assembly.