摘要:
A semiconductor chip in which a through hole penetrating through its surface and reverse surface is formed in a scribe line region in the vicinity of an active region where a functional device is formed, and a conductive member is arranged in the through portion. The through portion may be a groove opening sideward on a sidewall surface of the semiconductor chip. The through portion may be a through hole blocked from a side part of the semiconductor chip. The semiconductor chip further includes wiring for electrically connecting an internal circuit formed in the active region and the conductive member to each other.
摘要:
A method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chips. This method includes forming a groove with a pattern according to an outer contour of a desired semiconductor chip, holding the semiconductor wafer by a wafer holding mechanism, grinding a back surface of the semiconductor wafer held by the wafer holding mechanism, detecting opening of a bottom face of the groove during the back surface grinding process to determine timing for finishing the back surface grinding. The opening of the groove can be detected by means of a light sensor for detecting light passing through the groove or a microwave sensor for detecting a microwave passing through the groove. In addition, it is possible to suck air inside the groove so as to detect the opening of the groove by a pressure rise in the air inside the groove.
摘要:
A semiconductor device has a first semiconductor chip and a second semiconductor chip superposed on and bonded to the surface of the first semiconductor chip. In the region on the first semiconductor chip where the second semiconductor chip is bonded thereto, connection pads are arranged in positions that fit a plurality of predetermined types of semiconductor chips. On the second semiconductor chip, connection pads are arranged in positions that fit the connection pads arranged on the first semiconductor chip.
摘要:
A chip-on-chip-structure semiconductor device for a radio communication device, having a base band chip and a high-frequency chip piled up on and bonded to the surface thereof. The base band chip has a low-frequency signal processing unit for processing a signal in a first frequency band. The high-frequency chip has a high-frequency signal processing unit for processing a signal in a second frequency band of which frequency is higher than that of the first frequency band.
摘要:
Upon receiving an encipherment command, an enciphered authentication data generation circuit generates an enciphered authentication data based on a basic authentication data including a random number portion using an encipherment rule. The encipherment rule changes according to the number of supplied encipherment commands. A transmission circuit 7 transmits the enciphered authentication data. A reception circuit 9 receives the enciphered authentication data transmitted from a second device 300. A prohibition command output circuit 11 determines whether the enciphered authentication data transmitted from the second device 300 matches with an enciphered authentication data that would be generated if the same number of encipherment commands were supplied to an enciphered authentication data generation circuit of a first device 200, and outputs a prohibition command to prohibit a transmission of the data to be transmitted when the determination result is negative.
摘要:
An IC card 3 has an ID number ID0, for permitting itself to be identified, stored in memory provided therein. The IC card also has additional ID numbers ID1 to IDn stored in memory areas 17-1 to 17-n that are secured therein so as to be allocated to the individual providers that manage the reader/writers with which the IC card communicates. These additional ID numbers ID1 to IDn are used to prevent unauthorized use of the IC card, and are issued so as to be unique to the IC card by the individual providers that use the memory areas 17-1 to 17-n. Thus, the additional ID numbers ID1 to IDn differ from one IC card to another.
摘要:
A semiconductor chip having an internal circuit formed on a semiconductor substrate and a chip connection pad formed on the semiconductor substrate and used for interchip connection to another semiconductor chip. Further formed on the semiconductor substrate are an other-service-than-interchip-connection pad used for other service than interchip connection, and a switching circuit for selectively connecting, to the internal circuit, the chip connection pad or the other-service-than-interchip-connection pad.
摘要:
A semiconductor chip is bonded to the surface of another semiconductor chip with a predetermined gap secured in between. The semiconductor chip has a plurality of bumps formed on the surface thereof facing the other semiconductor chip. The bumps include functional bumps that contribute to electrical connection between the chips and dummy bumps that do not contribute thereto.
摘要:
A semiconductor device has a first semiconductor chip having a device formed thereon and a second semiconductor chip having a protection circuit for protecting the device formed thereon. The second semiconductor chip is superposed on and bonded to the surface of the first semiconductor chip.
摘要:
A semiconductor device having a chip-on-chip structure in which a semiconductor chip having a connecting pad formed on its surface and a surface movable element overlapped with and joined to the surface of the semiconductor chip are overlapped with each other. The surface movable element has a movable element and a connecting pad on its surface opposite to the semiconductor chip. The connecting pad on the surface of the semiconductor device and the connecting pad on the surface of the surface movable element are connected to each other through a pad joint. The pad joint ensures an operating space for allowing an operation of moving the movable element between the semiconductor chip and the surface movable element. The movable element may be a surface acoustic wave element.