公开(公告)号：US06462420B2

公开(公告)日：2002-10-08

申请号：US09502433

申请日：2000-02-11

申请人： Junichi Hikita ,  Hiroo Mochida ,  Goro Nakatani ,  Kazutaka Shibata

发明人： Junichi Hikita ,  Hiroo Mochida ,  Goro Nakatani ,  Kazutaka Shibata

IPC分类号： H01L2348

CPC分类号： H01L24/10 ,  H01L23/49575 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05644 ,  H01L2224/05099

摘要： A semiconductor chip is bonded to the surface of another semiconductor chip with a predetermined gap secured in between. The semiconductor chip has a plurality of bumps formed on the surface thereof facing the other semiconductor chip. The bumps include functional bumps that contribute to electrical connection between the chips and dummy bumps that do not contribute thereto.

公开(公告)号：US06369407B1

公开(公告)日：2002-04-09

申请号：US09500462

申请日：2000-02-09

申请人： Junichi Hikita ,  Hiroo Mochida ,  Kazutaka Shibata

发明人： Junichi Hikita ,  Hiroo Mochida ,  Kazutaka Shibata

IPC分类号： H01L2941

CPC分类号： H01L22/32 ,  H01L2224/05554

摘要： A semiconductor device has a semiconductor substrate, an internal circuit formed on the semiconductor substrate, a connection pad formed on the semiconductor substrate and connected to the internal circuit, and a test pad formed on the semiconductor substrate so as to be connected to the connection pad and used for functional testing of the internal circuit. The semiconductor substrate has a bonding region provided on the surface thereof so as to allow another semiconductor substrate to be superposed thereon by being bonded thereto, with the connection pad formed inside the bonding region and the test pad formed outside the bonding region.

摘要翻译： 半导体器件具有半导体衬底，形成在半导体衬底上的内部电路，形成在半导体衬底上并连接到内部电路的连接焊盘和形成在半导体衬底上的测试焊盘，以便连接到连接焊盘 并用于内部电路的功能测试。 半导体衬底具有设置在其表面上的接合区域，以便通过将其它半导体衬底与其结合在一起，其中连接焊盘形成在接合区域内部，并且测试焊盘形成在接合区域外部。

公开(公告)号：US07045900B2

公开(公告)日：2006-05-16

申请号：US10797018

申请日：2004-03-11

申请人： Junichi Hikita ,  Goro Nakatani ,  Nobuhisa Kumamoto ,  Katsumi Sameshima ,  Kazutaka Shibata ,  Shigeyuki Ueda

发明人： Junichi Hikita ,  Goro Nakatani ,  Nobuhisa Kumamoto ,  Katsumi Sameshima ,  Kazutaka Shibata ,  Shigeyuki Ueda

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L24/81 ,  H01L23/49575 ,  H01L23/552 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/28 ,  H01L24/31 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05599 ,  H01L2224/05644 ,  H01L2224/05669 ,  H01L2224/10135 ,  H01L2224/10165 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73207 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/85399 ,  H01L2225/06513 ,  H01L2225/06593 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/01031 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/013

摘要： A semiconductor chip having a functional bump provided on a surface of a semiconductor substrate thereof for electrical connection between an internal circuit thereof and a solid device, and a dummy bump not serving for the electrical connection between the internal circuit and the solid device. The dummy bump may be a stress relieving bump for relieving stresses exerted thereon. The dummy bump may be connected to a low impedance portion. The functional bump and the dummy bump may be provided on a surface protective film. In this case, the dummy bump is provided on a recess formed in the surface protective film.

摘要翻译： 具有设置在其半导体衬底的表面上的用于在其内部电路和固体器件之间进行电连接的功能性凸块的半导体芯片和不用于内部电路和固体器件之间的电连接的虚拟凸起。 虚拟凸块可以是用于减轻施加在其上的应力的应力消除凸块。 虚拟凸块可以连接到低阻抗部分。 可以在表面保护膜上设置功能性凸块和虚设凸块。 在这种情况下，在形成在表面保护膜上的凹部上设置虚拟凸块。

公开(公告)号：US06724084B1

公开(公告)日：2004-04-20

申请号：US09499384

申请日：2000-02-07

申请人： Junichi Hikita ,  Goro Nakatani ,  Nobuhisa Kumamoto ,  Katsumi Sameshima ,  Kazutaka Shibata ,  Shigeyuki Ueda

发明人： Junichi Hikita ,  Goro Nakatani ,  Nobuhisa Kumamoto ,  Katsumi Sameshima ,  Kazutaka Shibata ,  Shigeyuki Ueda

IPC分类号： H01L2348

CPC分类号： H01L24/81 ,  H01L23/49575 ,  H01L23/552 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/28 ,  H01L24/31 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05599 ,  H01L2224/05644 ,  H01L2224/05669 ,  H01L2224/10135 ,  H01L2224/10165 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73207 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/85399 ,  H01L2225/06513 ,  H01L2225/06593 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/01031 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/013

摘要： A semiconductor chip having a functional bump provided on a surface of a semiconductor substrate thereof for electrical connection between an internal circuit thereof and a solid device, and a dummy bump not serving for the electrical connection between the internal circuit and the solid device. The dummy bump may be a stress relieving bump for relieving stresses exerted thereon. The dummy bump may be connected to a low impedance portion. The functional bump and the dummy bump may be provided on a surface protective film. In this case, the dummy bump is provided on a recess formed in the surface protective film.

公开(公告)号：US06534847B2

公开(公告)日：2003-03-18

申请号：US09496963

申请日：2000-02-03

申请人： Junichi Hikita ,  Hiroo Mochida

发明人： Junichi Hikita ,  Hiroo Mochida

IPC分类号： H01L2348

CPC分类号： H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A semiconductor device is built by combining together a plurality of semiconductor chips, but nevertheless allows easy functional checking of the individual semiconductor chips before they are assembled together without provision of extra pads for such checking.

公开(公告)号：US06617693B2

公开(公告)日：2003-09-09

申请号：US09496183

申请日：2000-02-02

申请人： Junichi Hikita ,  Hiroo Mochida

发明人： Junichi Hikita ,  Hiroo Mochida

IPC分类号： H01L2348

CPC分类号： H01L24/06 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A semiconductor device has a first semiconductor chip and a second semiconductor chip superposed on and bonded to the surface of the first semiconductor chip. In the region on the first semiconductor chip where the second semiconductor chip is bonded thereto, connection pads are arranged in positions that fit a plurality of predetermined types of semiconductor chips. On the second semiconductor chip, connection pads are arranged in positions that fit the connection pads arranged on the first semiconductor chip.

公开(公告)号：US07045386B2

公开(公告)日：2006-05-16

申请号：US10224336

申请日：2002-08-21

申请人： Junichi Hikita ,  Hiroo Mochida

发明人： Junichi Hikita ,  Hiroo Mochida

IPC分类号： H01L21/44

CPC分类号： H01L24/06 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A semiconductor device has a first semiconductor chip and a second semiconductor chip superposed on and bonded to the surface of the first semiconductor chip. In the region on the first semiconductor chip where the second semiconductor chip is bonded thereto, connection pads are arranged in positions that fit a plurality of predetermined types of semiconductor chips. On the second semiconductor chip, connection pads are arranged in positions that fit the connection pads arranged on the first semiconductor chip.

公开(公告)号：US07126226B2

公开(公告)日：2006-10-24

申请号：US10615876

申请日：2003-07-10

申请人： Junichi Hikita ,  Hiroo Mochida

发明人： Junichi Hikita ,  Hiroo Mochida

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/06 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A semiconductor device has a first semiconductor chip and a second semiconductor chip superposed on and bonded to the surface of the first semiconductor chip. In the region on the first semiconductor chip where the second semiconductor chip is bonded thereto, connection pads are arranged in positions that fit a plurality of predetermined types of semiconductor chips. On the second semiconductor chip, connection pads are arranged in positions that fit the connection pads arranged on the first semiconductor chip.

公开(公告)号：US07088983B2

公开(公告)日：2006-08-08

申请号：US10654919

申请日：2003-09-05

申请人： Junichi Hikita ,  Hiroo Mochida ,  Katsutoshi Nagi

发明人： Junichi Hikita ,  Hiroo Mochida ,  Katsutoshi Nagi

IPC分类号： H04B1/28

CPC分类号： H04B1/3833 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/19107 ,  H01L2224/05599

摘要： A chip-on-chip-structure semiconductor device for a radio communication device, having a base band chip and a high-frequency chip piled up on and bonded to the surface thereof. The base band chip has a low-frequency signal processing unit for processing a signal in a first frequency band. The high-frequency chip has a high-frequency signal processing unit for processing a signal in a second frequency band of which frequency is higher than that of the first frequency band.

摘要翻译： 一种用于无线电通信装置的片上芯片结构半导体器件，具有堆叠在其表面上并结合到其上的基带芯片和高频芯片。 基带芯片具有用于处理第一频带中的信号的低频信号处理单元。 高频芯片具有用于处理频率高于第一频带频率的第二频带中的信号的高频信号处理单元。

公开(公告)号：US06507117B1

公开(公告)日：2003-01-14

申请号：US09493249

申请日：2000-01-28

申请人： Junichi Hikita ,  Hiroo Mochida

发明人： Junichi Hikita ,  Hiroo Mochida

IPC分类号： H01L2348

CPC分类号： H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/16145 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A semiconductor chip having an internal circuit formed on a semiconductor substrate and a chip connection pad formed on the semiconductor substrate and used for interchip connection to another semiconductor chip. Further formed on the semiconductor substrate are an other-service-than-interchip-connection pad used for other service than interchip connection, and a switching circuit for selectively connecting, to the internal circuit, the chip connection pad or the other-service-than-interchip-connection pad.

摘要翻译： 具有形成在半导体衬底上的内部电路的半导体芯片和形成在半导体衬底上的芯片连接焊盘，用于与另一个半导体芯片的芯片间连接。 另外形成在半导体基板上的是比芯片间连接用于其他服务的其它服务的中间芯片连接焊盘，以及用于选择性地将内部电路连接到芯片连接焊盘或其他服务的切换电路 单片机连接板