摘要:
A semiconductor device having good electrical properties, and a method of manufacturing this semiconductor device by forming an insulation layer on a first wiring layer and then, in this insulation layer, simultaneously forming a second wiring layer and a contact layer for connecting the first wiring layer and the second wiring layer. A first mask having an opening over a wiring trench in which the second wiring layer will be formed is formed on the insulation layer. A second mask having an opening for a through-hole where the contact layer is to be formed is then formed over the insulation layer and first mask. The insulation layer is then etched using the second mask as a mask. Then the insulation layer is again etched using the first mask as a mask to form wiring trench and through-hole. The wiring trench and through-hole are then filled with a conductive material to form the second wiring layer and contact layer.
摘要:
Disclosed is a magnetic head apparatus, which comprises a pair of magnetic cores defining a magnetic gap for recording and reproducing information, and grooves in the lateral faces of the magnetic cores, extending at right angles to those faces of the cores which are opposed to a magnetic recording medium or which define the magnetic cores. The grooves determine the width of the magnetic gap. That face of at least one of the magnetic cores which is opposed to the recording medium, is recessed from the remaining portion of the core, so as to cover a width equivalent to the length of the grooves, at the maximum. In the magnetic head of the invention, moreover, a nonmagnetic portion is formed at least on an erase gap, so that the degree of magnetic coupling between the erase gap and the recording medium is lower than that between a read/write gap and the medium. Thus, magnetic induction, which is produced in the erase core when data is read from the medium, is reduced.
摘要:
In a power semiconductor device according to the present invention, a sheet, formed of a soft metal such as Ag, is provided on that portion of a pressing control electrode which is brought into contact with an Al gate electrode of a pellet. By means of this sheet, it is possible both to apply a strong pressing power to the Al gate electrode and to reduce the contact resistance between the two electrode. Since an excessive amount of heat is not produced on account of the contact resistance, the semiconductor device can be protected against being damaged.
摘要:
A magnetic disc apparatus obtained by housing in a cartridge case, a magnetic disc which is obtained by forming a metallic magnetic sheet on a polymer base and liner sheets. The liner sheet which is installed between the magnetic disc and the cartridge case has an outer diameter which is smaller than the diameter of the magnetic disc, and an inner diameter which is greater than the rotational diameter of an index hole that is prepared on the magnetic disc for detecting the rotational position of the disc. By arranging in this manner, a smooth rotation of the magnetic disc can be accomplished by avoiding the contact with liner sheet of the edges on the outer periphery of the disc that were bent at the time the disc was punched from the magnetic recording medium, and of the edges of the index hole that were bent at the time the index hole was punched.
摘要:
A bias circuit includes one or more first Zener diodes electrically coupled to a member provided in a replacement unit, the one or more first Zener diodes being coupled in series. When the replacement unit is removably attached to a main unit including a power supply that has one or more second Zener diodes coupled in series, the first Zener diodes are electrically coupled to the second Zener diodes in parallel to change a bias voltage to be applied to the member, the bias voltage being supplied by the power supply. A total absolute value of breakdown voltages across the first Zener diodes is lower than a total absolute value of breakdown voltages across the second Zener diodes.
摘要:
A service providing method for monitoring a mounting tact of a component mounting apparatus includes collecting, from the service receiver, mounting tact information including a mounting tact result value of the component mounting apparatus from the service receiver by use of a service provider via a communication system. The method additionally includes judging whether a mounting operation of the component mounting apparatus has a tact loss corresponding to an amount by which a mounting tact is greater than a standard mounting tact as a result of analysis of the collected mounting tact information and determining and feeding back, to the service receiver via the communication system, NC data for allowing the component mounting apparatus to be operated.
摘要:
A service receiving method for receiving a component library generated from mounted component data, including component size and mounting conditions, via a communication system that includes the Internet. The method includes the service provider receiving mounted component data having mounting conditions actually realized by a fabrication of non-defective products. The method also includes the service provider deriving a component library from a mounted component database.
摘要:
A service receiving method for receiving a component library including component size necessary for mount production, by inputting, via a service receiver, to a service provider, mounted component data having the results of fabrication of non-defective products, through the communication system that includes the Internet and deriving, by the service receiver, the component library from a mounted component database provided in the service provider, the mounted component database containing the input mounted component data accumulated for each type of component.
摘要:
A component data distribution method which is executed by a server device (10) and allows distribution of component data between a plurality of terminal devices (20) when a component is mounted on a board includes: a component data collecting step of collecting component data and evaluation data indicating a degree of an operation required to achieve actual production using the component data from a first terminal device; and a component data accumulating step of accumulating the collected component data with the collected evaluation data so as to provide the collected component data for a second terminal device different from the first terminal device.
摘要:
An object of the invention is to provide a semiconductor device which includes a barrier metal having high adhesiveness and diffusion barrier properties and a method of manufacturing the semiconductor device. The invention provides a semiconductor device manufacturing method including forming a first layer made of a material containing silicon on a base substance; forming a second layer containing metal and nitrogen on the first layer; and exposing the second layer to active species obtained from plasma in an atmosphere including reducing gas.