公开(公告)号：US20100127364A1

公开(公告)日：2010-05-27

申请号：US12696611

申请日：2010-01-29

Applicant: Kenji Fukuzono

Inventor： Kenji Fukuzono

IPC: H01L23/34

CPC classification number: H01L23/42 ,  H01L23/04 ,  H01L23/3675 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00012

Abstract: A semiconductor device includes a semiconductor element mounted on a substrate; at least one electronic part arranged around the semiconductor element; and a heat radiation member bonded to a backside of the semiconductor element by a bonding material. The heat radiation member has an isolation part extending between an outer circumference of the semiconductor element and the electronic part.

Abstract translation: 半导体器件包括安装在衬底上的半导体元件; 布置在所述半导体元件周围的至少一个电子部件; 以及通过接合材料接合到半导体元件的背面的散热构件。 散热构件具有在半导体元件的外周和电子部件之间延伸的隔离部。

公开(公告)号：US20090084590A1

公开(公告)日：2009-04-02

申请号：US12188257

申请日：2008-08-08

Applicant: Hideaki YOSHIMURA ,  Kenji Fukuzono ,  Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Takashi Nakagawa ,  Shin Hirano ,  Takashi Kanda

Inventor： Hideaki YOSHIMURA ,  Kenji Fukuzono ,  Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Takashi Nakagawa ,  Shin Hirano ,  Takashi Kanda

IPC: H05K1/00

CPC classification number: H05K1/0366 ,  H05K1/0271 ,  H05K1/056 ,  H05K3/4608 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K2201/09145 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: A circuit board has a low thermal expansion coefficient that suits the thermal expansion coefficient of an element to be mounted thereupon and can prevent the occurrence of delamination and cracking of a core layer when the circuit board is used in a low temperature environment. The circuit board is constructed by laminating a core layer and at least one wiring layer, where the at least one wiring layer has slightly smaller external dimensions in a planar direction than the core layer.

Abstract translation: 电路板具有适合要安装的元件的热膨胀系数的低热膨胀系数，并且可以防止当在低温环境中使用电路板时芯层的分层和破裂的发生。 电路板通过层叠芯层和至少一个布线层而构成，其中至少一个布线层在平面方向上具有比芯层稍小的外部尺寸。

公开(公告)号：US20080002374A1

公开(公告)日：2008-01-03

申请号：US11637911

申请日：2006-12-13

Applicant: Kenji Fukuzono ,  Toshihisa Sato ,  Yuki Samejima

Inventor： Kenji Fukuzono ,  Toshihisa Sato ,  Yuki Samejima

IPC: H05K1/00 ,  B29C65/00

CPC classification number: H01L23/49833 ,  H01L21/4857 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/0271 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/068 ,  Y10T156/10 ,  H01L2224/0401

Abstract: A manufacturing method for a substrate with a stiffener is disclosed, the substrate being capable of ensuring a good flatness of a printed board when heated to a high temperature and then cooled. The method comprises a first step of preparing a printed board and a stiffener, the printed board including a wiring part and an insulating part formed of an organic insulating material, and the stiffener being formed of a material with a smaller coefficient of thermal expansion than that of the material of the printed board, and a second step of bonding the printed board and the stiffener with a thermosetting adhesive. In the second step, a curing process temperature for curing the thermosetting adhesive is equal to or higher than the glass transition point of the organic insulating material.

Abstract translation: 公开了一种具有加强件的基板的制造方法，该基板能够确保当加热至高温然后冷却时印刷板的良好平整度。 该方法包括制备印刷板和加强件的第一步骤，印刷板包括布线部分和由有机绝缘材料形成的绝缘部分，加强件由热膨胀系数小的材料形成。 的印刷电路板的材料，以及用热固性粘合剂粘合印刷电路板和加强件的第二步骤。 在第二步骤中，用于固化热固性粘合剂的固化过程温度等于或高于有机绝缘材料的玻璃化转变点。

公开(公告)号：US20070194464A1

公开(公告)日：2007-08-23

申请号：US11488640

申请日：2006-07-19

Applicant: Kenji Fukuzono

Inventor： Kenji Fukuzono

IPC: H01L23/29

CPC classification number: H01L23/16 ,  H01L21/563 ,  H01L23/3121 ,  H01L23/49833 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83951 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A semiconductor device and a manufacturing method of the device are disclosed. The semiconductor device includes a substrate that mounts a semiconductor element, a first stiffener, a reinforcement resin member, and a second stiffener for reinforcing the reinforcement resin member.

Abstract translation: 公开了一种半导体器件及其制造方法。 该半导体器件包括安装半导体元件的基板，第一加强件，增强树脂部件和用于加强加强树脂部件的第二加强件。

公开(公告)号：US07260806B2

公开(公告)日：2007-08-21

申请号：US11167264

申请日：2005-06-28

Applicant: Kenji Fukuzono ,  Hideaki Yoshimura

Inventor： Kenji Fukuzono ,  Hideaki Yoshimura

IPC: G06F17/50 ,  G06F19/00

CPC classification number: H05K3/0005 ,  G06F17/5018 ,  G06F2217/80 ,  H05K1/0271 ,  H05K2201/068

Abstract: The present invention provides a printed wiring board design aiding apparatus, method, and program that can easily and inexpensively predict the displacement of a printed wiring board of complicated shape and configuration due to temperature change. The printed wiring board design aiding program makes a computer execute the steps including a mesh division step that divides an analytical model of a printed wiring board obtained as data into meshes, a mesh displacement calculation step that calculates displacements of respective meshes of a printed wiring board which is divided in the mesh division step, a mesh displacement connection step that connects mesh displacements calculated in the mesh displacement calculation step so that the inclination of borders of respective meshes become equal, and a displacement calculation step that calculates a displacement using an entire displacement of a printed wiring board which is obtained in the mesh displacement connection step.

Abstract translation: 本发明提供一种印刷线路板设计辅助装置，方法和程序，其可以容易且廉价地预测由于温度变化而导致的复杂形状和结构的印刷线路板的位移。 印刷线路板设计辅助程序使得计算机执行包括将作为数据获得的印刷线路板的分析模型划分成网格的网格分割步骤的步骤，网格位移计算步骤，其计算印刷线路板的各个网格的位移 其在网格划分步骤中被划分为网格位移连接步骤，其连接在网格位移计算步骤中计算的网格位移，使得各个网格的边界的倾斜度相等;以及位移计算步骤，其使用整个位移计算位移 在网格位移连接步骤中获得的印刷线路板。

公开(公告)号：US20060147684A1

公开(公告)日：2006-07-06

申请号：US11364056

申请日：2006-03-01

Applicant: Takashi Kanda ,  Kenji Fukuzono ,  Manabu Watanabe

Inventor： Takashi Kanda ,  Kenji Fukuzono ,  Manabu Watanabe

IPC: B32B3/00 ,  B32B18/00

CPC classification number: H05K3/4688 ,  B32B17/04 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4673 ,  H05K2201/068 ,  H05K2201/0959 ,  H05K2203/162 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: A manufacturing method of a layered board that includes a core layer that serves as a printed board, and a buildup layer that is electrically connected to said core layer, said buildup layer including an insulation-part and a wiring part includes the step of setting a coefficient of thermal expansion, a thickness and a modulus of longitudinal elasticity of each layer so that the layered board has a predetermined value of the coefficient of thermal expansion.

Abstract translation: 一种层叠板的制造方法，其包括用作印刷电路板的芯层和与所述芯层电连接的积层，所述积层层包括绝缘部分和布线部分，包括设置 热膨胀系数，各层的厚度和纵向弹性模量，使得层状板具有预定的热膨胀系数。

公开(公告)号：US20050266212A1

公开(公告)日：2005-12-01

申请号：US10997973

申请日：2004-11-29

Applicant: Takashi Kanda ,  Kenji Fukuzono ,  Manabu Watanabe

Inventor： Takashi Kanda ,  Kenji Fukuzono ,  Manabu Watanabe

IPC: B32B3/00 ,  B32B17/04 ,  H01L23/12 ,  H05K1/00 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4688 ,  B32B17/04 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4673 ,  H05K2201/068 ,  H05K2201/0959 ,  H05K2203/162 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: A manufacturing method of a layered board that includes a core layer that serves as a printed board, and a buildup layer that is electrically connected to said core layer, said buildup layer including an insulation part and a wiring part includes the step of setting a coefficient of thermal expansion, a thickness and a modulus of longitudinal elasticity of each layer so that the layered board has a predetermined value of the coefficient of thermal expansion.

Abstract translation: 一种分层板的制造方法，其包括用作印刷电路板的芯层和与所述芯层电连接的积层，所述积层层包括绝缘部分和布线部分，包括设定系数 的热膨胀，各层的厚度和纵向弹性模量，使得层状板具有预定的热膨胀系数值。

公开(公告)号：US20050110169A1

公开(公告)日：2005-05-26

申请号：US11019617

申请日：2004-12-23

Applicant: Tomohisa Yagi ,  Nobuhiro Imaizumi ,  Yasuhiro Usui ,  Kenji Fukuzono

Inventor： Tomohisa Yagi ,  Nobuhiro Imaizumi ,  Yasuhiro Usui ,  Kenji Fukuzono

IPC: H01L21/60 ,  H01L21/56 ,  H01L23/12 ,  H01L23/498 ,  H01L23/495

CPC classification number: H01L23/49816 ,  H01L21/563 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/3512

Abstract: According to a method of making a semiconductor device, a semiconductor chip is bonded to a substrate via bumps by flip-chip bonding. Then, a sealing adhesive composition is loaded between the semiconductor chip and the substrate to provide an adhesive sealing. The sealing adhesive composition, which is capable of hardening in two stages, contains at least a first main resin ingredient, a second main resin ingredient and a hardening agent. Then, the adhesive sealing is heated for primary hardening. Then, the substrate is placed on a mother board with a solder material interposed between the substrate and the mother board. Finally, the adhesive sealing is heated for secondary hardening while the solder material is reflowed for bonding the substrate to the mother board.

Abstract translation: 根据制造半导体器件的方法，通过倒装芯片接合，半导体芯片通过凸块接合到基板。 然后，在半导体芯片和基板之间加载密封粘合剂组合物以提供粘合剂密封。 能够两阶段硬化的密封粘合剂组合物至少含有第一主要树脂成分，第二主要树脂成分和硬化剂。 然后，加热粘合剂密封件进行一次硬化。 然后，将基板放置在母板上，其中焊料材料插入在基板和母板之间。 最后，将粘合剂密封加热以进行二次硬化，同时将焊料回流焊接到母板上。