公开(公告)号：US20100014254A1

公开(公告)日：2010-01-21

申请号：US12461867

申请日：2009-08-26

Applicant: Kenji Fukuzono ,  Hideaki Yoshimura

Inventor： Kenji Fukuzono ,  Hideaki Yoshimura

IPC: H05K7/20 ,  H01L23/48 ,  H01L23/36

CPC classification number: H01L23/4006 ,  H01L21/10 ,  H01L21/563 ,  H01L23/3675 ,  H01L23/433 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2224/0401

Abstract: A terminal bump set including the outermost bump row inscribed in a first prism standing upright on the front surface of a package substrate. A heat conductive member contacts with the surface of the semiconductor element. The heat conductive member extends outward beyond the contour of the semiconductor element. A reinforcing member is interposed between the heat conductive member and the package substrate outside the contour of the semiconductor element. The reinforcing member is bonded to the front surface of the package substrate at a predetermined bonding area. The predetermined bonding area extends inward from the outer periphery of the package substrate over the front surface of the package substrate. The second prism stands upright on the front surface of the package substrate inside the first prism so as to allow the outermost bump row to circumscribe the second prism.

Abstract translation: 一种端子凸块组，包括内嵌在封装基板前表面上的直立的第一棱镜中的最外凸块排。 导热构件与半导体元件的表面接触。 导热构件向外延伸超过半导体元件的轮廓。 在半导体元件的轮廓外部的导热构件和封装基板之间插入加强构件。 加强构件在预定的接合区域结合到封装基板的前表面。 预定的结合区域从封装基板的外周向内延伸超过封装基板的前表面。 第二棱镜直立在第一棱镜内部的封装基板的前表面上，以允许最外面的凸起行包围第二棱镜。

公开(公告)号：US20070289706A1

公开(公告)日：2007-12-20

申请号：US11649203

申请日：2007-01-04

Applicant: Takashi Nakagawa ,  Seiichi Sugano ,  Kenji Iida ,  Yasutomo Maehara ,  Hitoshi Suzuki ,  Kaoru Sugimoto ,  Kenji Fukuzono ,  Takashi Kanda ,  Hiroaki Date ,  Tomohisa Yagi

Inventor： Takashi Nakagawa ,  Seiichi Sugano ,  Kenji Iida ,  Yasutomo Maehara ,  Hitoshi Suzuki ,  Kaoru Sugimoto ,  Kenji Fukuzono ,  Takashi Kanda ,  Hiroaki Date ,  Tomohisa Yagi

IPC: C09J5/06

CPC classification number: H05K3/4614 ,  H05K3/321 ,  H05K3/361 ,  H05K3/4069 ,  H05K2201/0218 ,  H05K2203/0425 ,  H05K2203/0568 ,  H05K2203/063 ,  Y10T29/49117

Abstract: A process for producing a multilayer board includes the steps of applying a bonding ink to the terminal of the first substrate, the bonding ink including a thermosetting resin containing a filler and a curing agent, the filler being formed of metal particles plated with solder, the metal particles each having a first melting point, and the solder having a second melting point lower than the first melting point; bonding the second substrate to a bonding sheet composed of a thermosetting resin and having a through hole disposed in a portion corresponding to the terminal of the second substrate; and heating and pressurizing the first and second substrates with the bonding sheet in such a manner that the terminals are opposite each other to effect curing of the bonding sheet and the bonding ink and to form an integral structure.

Abstract translation: 一种制造多层板的方法包括以下步骤：将粘合油墨施加到第一基板的端子上，粘合油墨包括含有填料和固化剂的热固性树脂，填料由镀有焊料的金属颗粒形成， 金属颗粒各自具有第一熔点，并且焊料具有低于第一熔点的第二熔点; 将第二基板接合到由热固性树脂构成的接合片，并且具有设置在与第二基板的端子对应的部分中的通孔; 并且利用接合片以这样的方式对第一和第二基板进行加热和加压，使得端子彼此相对以实现粘合片和粘合油墨的固化并形成一体结构。

公开(公告)号：US20070222039A1

公开(公告)日：2007-09-27

申请号：US11526100

申请日：2006-09-25

Applicant: Takashi Kanda ,  Kenji Fukuzono

Inventor： Takashi Kanda ,  Kenji Fukuzono

IPC: H01L23/58

CPC classification number: H01L24/83 ,  H01L21/6835 ,  H01L23/36 ,  H01L24/29 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/16 ,  H01L2221/68345 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2224/81101 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83102 ,  H01L2224/838 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/1517 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19106 ,  H05K3/323 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/467 ,  H05K2201/10378 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2224/05599

Abstract: A semiconductor device includes a multi-layer substrate and a semiconductor element mounted on the multi-layer substrate. The multi-layer substrate contains a plurality of circuit-formation layers joined by a first resin material. The semiconductor element is mounted on the multi-layer substrate by being joined to the multi-layer substrate by a second resin material. The first resin material and the second resin material are curable in the same heating condition.

Abstract translation: 半导体器件包括多层基板和安装在多层基板上的半导体元件。 多层基板包含由第一树脂材料连接的多个电路形成层。 半导体元件通过第二树脂材料与多层基板接合而安装在多层基板上。 第一树脂材料和第二树脂材料在相同的加热条件下可固化。

公开(公告)号：US07053493B2

公开(公告)日：2006-05-30

申请号：US10992651

申请日：2004-11-22

Applicant: Takashi Kanda ,  Kenji Fukuzono

Inventor： Takashi Kanda ,  Kenji Fukuzono

IPC: H01L23/48 ,  H01L23/52

CPC classification number: H01L23/562 ,  H01L23/3128 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K3/303 ,  H05K3/305 ,  H05K2201/10568 ,  H05K2201/10734 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A semiconductor device including a substrate, a semiconductor element mounted on the substrate and a stiffener attached via an adhesive to a surface of the substrate opposite a surface thereof on which the semiconductor element is mounted. The adhesive has a coefficient of thermal expansion smaller than that of the substrate and that of the stiffener, and the modulus of longitudinal elasticity of the adhesive is equal to or larger than 10 GPa. Otherwise, the adhesive has a coefficient of thermal expansion larger than that of the substrate and that of the stiffener, and the modulus of longitudinal elasticity of the adhesive is equal to or smaller than 10 GPa. The height of the stiffener is less than that of the external terminals.

Abstract translation: 一种半导体器件，包括衬底，安装在衬底上的半导体元件和经由粘合剂附着到衬底的与安装半导体元件的表面相对的表面的加强件。 粘合剂的热膨胀系数小于基材和加强件的热膨胀系数，并且粘合剂的纵向弹性模量等于或大于10GPa。 否则，粘合剂的热膨胀系数大于基材和加强件的热膨胀系数，并且粘合剂的纵向弹性模量等于或小于10GPa。 加强件的高度小于外部端子的高度。

公开(公告)号：US20060036978A1

公开(公告)日：2006-02-16

申请号：US10986135

申请日：2004-11-12

Applicant: Kenji Fukuzono ,  Hideaki Yoshimura

Inventor： Kenji Fukuzono ,  Hideaki Yoshimura

IPC: G06F17/50 ,  G01R31/02

CPC classification number: G06F17/5068 ,  H05K3/0005 ,  H05K3/4602 ,  H05K2201/0191

Abstract: A board design aiding apparatus that simplifies a designed printed wiring board to predict a displacement quantity of the printed wiring board includes a layer thickness calculation section 21 for obtaining a mean thickness of an area of a board by a prescribed rule for an essential material forming a layer at each layer for constructing the printed wiring board, and a laminate model forming section 22 for forming a simple laminate model by laminating layers having layer thickness calculated by the layer thickness calculation section 21.

Abstract translation: 简化设计的印刷线路板以预测印刷线路板的位移量的板设计辅助装置包括：层厚度计算部21，用于通过规定的规​​则获得板的面积的平均厚度， 用于构成印刷电路板的每个层的层;以及层叠模型形成部22，用于通过层叠由层厚度计算部21计算的层厚度的层来形成简单的层叠模型。

公开(公告)号：US08168471B2

公开(公告)日：2012-05-01

申请号：US12712604

申请日：2010-02-25

Applicant: Takashi Kanda ,  Kenji Fukuzono

Inventor： Takashi Kanda ,  Kenji Fukuzono

IPC: H01L21/44 ,  H01L21/48

CPC classification number: H01L24/83 ,  H01L21/6835 ,  H01L23/36 ,  H01L24/29 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/16 ,  H01L2221/68345 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2224/81101 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83102 ,  H01L2224/838 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/1517 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19106 ,  H05K3/323 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/467 ,  H05K2201/10378 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2224/05599

Abstract: A semiconductor device includes a multi-layer substrate and a semiconductor element mounted on the multi-layer substrate. The multi-layer substrate contains a plurality of circuit-formation layers joined by a first resin material. The semiconductor element is mounted on the multi-layer substrate by being joined to the multi-layer substrate by a second resin material. The first resin material and the second resin material are curable in the same heating condition.

Abstract translation: 半导体器件包括多层基板和安装在多层基板上的半导体元件。 多层基板包含由第一树脂材料连接的多个电路形成层。 半导体元件通过第二树脂材料与多层基板接合而安装在多层基板上。 第一树脂材料和第二树脂材料在相同的加热条件下可固化。

公开(公告)号：US20080006915A1

公开(公告)日：2008-01-10

申请号：US11641718

申请日：2006-12-20

Applicant: Naoaki Nakamura ,  Hideaki Yoshimura ,  Kenji Fukuzono ,  Toshihisa Sato

Inventor： Naoaki Nakamura ,  Hideaki Yoshimura ,  Kenji Fukuzono ,  Toshihisa Sato

IPC: H01L23/495

CPC classification number: H01L21/563 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83104 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A semiconductor package provided with a heat radiator achieving a further improvement of reliability by reducing an influence of thermal stress. For this purpose, the heat radiator is formed by a heat radiator comprised of a heat radiation plate plus a box shaped part and comprised so that the entire semiconductor chip is enclosed in this box shaped part together with a board via a metallic bonding material.

Abstract translation: 具有散热器的半导体封装件通过减少热应力的影响而进一步提高可靠性。 为此，散热器由散热板和盒状部件构成的散热片形成，并且包含半导体芯片整体通过金属接合材料与基板一体地包封在该盒状部件中。

公开(公告)号：US20070228530A1

公开(公告)日：2007-10-04

申请号：US11544630

申请日：2006-10-10

Applicant: Toshihisa Sato ,  Kenji Fukuzono ,  Masateru Koide

Inventor： Toshihisa Sato ,  Kenji Fukuzono ,  Masateru Koide

IPC: H01L23/495

CPC classification number: H01L23/42 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00

Abstract: A heat conductive bonding material 6 has a first bonding region 7 transferring heat of a semiconductor chip 1 to a heat spreader 4, and a second bonding region 8 relaxing a thermal stress generated between the semiconductor chip 1 and the heat spreader 4.

Abstract translation: 导热接合材料6具有将半导体芯片1的热传递到散热器4的第一接合区域7和放松半导体芯片1和散热器4之间产生的热应力的第二接合区域8。

公开(公告)号：US07222316B2

公开(公告)日：2007-05-22

申请号：US10986135

申请日：2004-11-12

Applicant: Kenji Fukuzono ,  Hideaki Yoshimura

Inventor： Kenji Fukuzono ,  Hideaki Yoshimura

IPC: G06F17/50 ,  G01R31/02

CPC classification number: G06F17/5068 ,  H05K3/0005 ,  H05K3/4602 ,  H05K2201/0191

Abstract: A board design aiding apparatus that simplifies a designed printed wiring board to predict a displacement quantity of the printed wiring board includes a layer thickness calculation section 21 for obtaining a mean thickness of an area of a board by a prescribed rule for an essential material forming a layer at each layer for constructing the printed wiring board, and a laminate model forming section 22 for forming a simple laminate model by laminating layers having layer thickness calculated by the layer thickness calculation section 21.

Abstract translation: 简化设计的印刷线路板以预测印刷线路板的位移量的板设计辅助装置包括：层厚度计算部21，用于通过规定的规​​则获得板的面积的平均厚度， 用于构成印刷电路板的每个层的层;以及层叠模型形成部22，用于通过层叠由层厚度计算部21计算的层厚度的层来形成简单的层叠模型。

公开(公告)号：US08642896B2

公开(公告)日：2014-02-04

申请号：US12817562

申请日：2010-06-17

Applicant: Kenji Fukuzono

Inventor： Kenji Fukuzono

IPC: H05K1/16

CPC classification number: H05K1/0271 ,  H01L21/4857 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/5389 ,  H01L23/562 ,  H01L2224/73204 ,  H01L2924/01019 ,  H05K1/181 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/068 ,  H05K2201/09036 ,  H05K2201/10416 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/063 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49139

Abstract: A printed circuit board include: a printed circuit board main body having a mounting area on a first surface of the printed circuit board main body and a recess being provided at a recess area on a second surface that is a back side of the first surface of the printed circuit board main body, the electronic component being mounted on the mounting area, the recess area being provided to correspond to the mounting area; and a thermal expansion control element being placed in the recess and having a smaller thermal expansion coefficient than the printed circuit board main body.

Abstract translation: 印刷电路板包括：印刷电路板主体，其具有位于印刷电路板主体的第一表面上的安装区域;以及凹部，设置在作为第一表面的第一表面的第二表面的第二表面的凹部 所述印刷电路板主体，所述电子部件安装在所述安装区域上，所述凹部区域设置成对应于所述安装区域; 并且热膨胀控制元件放置在凹部中并且具有比印刷电路板主体更小的热膨胀系数。