摘要:
An integrated circuit die stack including a first integrated circuit die mounted upon a substrate, the first die including pass-through vias (‘PTVs’) composed of conductive pathways through the first die with no connection to any circuitry on the first die; and a second integrated circuit die, identical to the first die, rotated with respect to the first die and mounted upon the first die, with the PTVs in the first die connecting signal lines from the substrate through the first die to through silicon vias (TSVs') in the second die composed of conductive pathways through the second die connected to electronic circuitry on the second die; with the TSVs and PTVs disposed upon each identical die so that the positions of the TSVs and PTVs on each identical die are rotationally symmetrical with respect to the TSVs and PTVs on the other identical die.
摘要:
Provided are a semiconductor integrated circuit including a power supply, a semiconductor system including the semiconductor integrated circuit, and a method of forming the semiconductor integrated circuit. The semiconductor integrated circuit includes: a semiconductor substrate on a surface of which a plurality of electrical circuits and a plurality of power pads are mounted; an insulation layer stacked on the semiconductor substrate; a first conductive layer connected to a first power pad by a first via and stacked on the insulation layer; a second conductive layer connected to a second power pad by a second via, stacked on the insulation layer, and separated from the first insulation layer; and a power generation layer stacked on the first conductive layer and the second conductive layer and that generates voltage.
摘要:
Provided are a semiconductor integrated circuit including a power supply, a semiconductor system including the semiconductor integrated circuit, and a method of forming the semiconductor integrated circuit. The semiconductor integrated circuit includes: a semiconductor substrate on a surface of which a plurality of electrical circuits and a plurality of power pads are mounted; an insulation layer stacked on the semiconductor substrate; a first conductive layer connected to a first power pad by a first via and stacked on the insulation layer; a second conductive layer connected to a second power pad by a second via, stacked on the insulation layer, and separated from the first insulation layer; and a power generation layer stacked on the first conductive layer and the second conductive layer and that generates voltage.
摘要:
A memory system having a memory element chip (DRAM) and a memory controller chips having a plurality of drivers and receivers and latches for transferred data. For writes clocks, write data and write for CRC (cyclic redundancy checks) is transferred to the DRAM from the memory controller and latched for error checking. The reads are clocked and the read data is received and transferred to a read data latch with also receives a clocked read strobe for verification of data integrity from DRAM. Each chip has a bi-functional pin that acts as a shared CRC pin during write and acts as a shared strobe pin during READ. Data transfers with the CRC signal and DQS signal are transferred across two paths CRC0/DQS and CRC1/DQS1. One could also transfer the CRC signal across one path with only the CRC0/DQS signal. Read operations have no CRC, and have no need for CRC because transfer errors during read can be detected by memory error correction coding (ECC). Write data provides source synchronous I/O data to said memory element chip needed for modem high speed memory communications.
摘要:
A data input and data output control device and method in which a plurality of write or read data composed of m (2n+k) bits (where m, n, and k are all integers) may be accessed within one clock of external input clock.
摘要:
A level shifting circuit and method that reduce leakage current are provided. The level shifting circuit includes: a logic circuit including a plurality of MOSFETs (metal-oxide-semiconductor field effect transistors) connected in series between an output terminal and a source, receiving an input signal having a first logic level and a second logic level, changing the input signal to a signal having a first logic level and a third logic level in response to a feedback signal supplied to one of the MOSFETs, and outputting the changed signal as an output signal; and a feedback circuit generating the feedback signal in response to the output signal.
摘要:
A phase locked loop circuit and method of locking a phase. The phased locked loop circuit may include a phase detector receiving an external clock signal and a feedback clock signal and outputting an up signal when a phase of the external clock signal leads a phase of the feedback clock signal and outputting a down signal when the phase of the external clock signal lags the phase of the feedback clock signal, a loop filter circuit increasing a control voltage in response to the up signal and decreasing the control voltage in response to the down signal, and a voltage controlled oscillator circuit receiving the control voltage and directly generating at least n (where n is an integer ≧4) internal clock signals. The phased locked loop circuit may also include a voltage controlled oscillator circuit, including at least four loops, receiving the control voltage and generating multiple internal clock signals.
摘要:
A memory system has first and second primary memories and first and second secondary memories coupled to the first and second primary memories, respectively, the coupling comprising at least one point-to-point connection. A memory module includes at least two of the first and second primary and first and second secondary memories. A first connection element, such as a connector or solder, connects the memory module to a mother board. A second connection element, such as a connector or solder, connects at least one other of the first and second primary and first and second secondary memories to the mother board. At least one of the memories on the first memory module is coupled to at least one of the other memories. The memory system also includes a memory controller which is connected to the primary memories by a point-to-two-point link.
摘要:
A differential amplifier includes an input stage, a biasing unit and a load unit. The input stage receives a first phase signal and at least two phase signals among odd-numbered phase signals, wherein an average of phases of the at least two phase signals has a phase difference of substantially 180 degrees from the first phase signal. The biasing unit is coupled between the input stage and a first power voltage. The load unit is coupled between the input stage and a second power voltage, and configured to output a differential output signal based on differentially amplifying of the first phase signal and the at least two phase signals. Therefore, a duty cycle distortion in an output signal of a duty cycle correction circuit can be prevented.
摘要:
A phase locked loop circuit and method of locking a phase. The phased locked loop circuit may include a phase detector receiving an external clock signal and a feedback clock signal and outputting an up signal when a phase of the external clock signal leads a phase of the feedback clock signal and outputting a down signal when the phase of the external clock signal lags the phase of the feedback clock signal, a loop filter circuit increasing a control voltage in response to the up signal and decreasing the control voltage in response to the down signal, and a voltage controlled oscillator circuit receiving the control voltage and directly generating at least n (where n is an integer ≧4) internal clock signals. The phased locked loop circuit may also include a voltage controlled oscillator circuit, including at least four loops, receiving the control voltage and generating multiple internal clock signals.