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31.发明申请公开(公告)号：US20150311575A1
公开(公告)日：2015-10-29
申请号：US14675147
申请日：2015-03-31
Applicant: Microfabrica Inc.
Inventor： Elliott R. Brown , John D. Evans , Christopher A. Bang , Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley , Morton Grosser
Abstract: RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, hybrid couplers, antenna arrays and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).
Abstract translation: 提供RF和微波辐射引导或控制部件，其可以是单片的，其可以由多个电沉积操作和/或从多个沉积的材料层形成，其可以包括开关，电感器，天线，传输线，滤波器 ，混合耦合器，天线阵列和/或其他主动或无源部件。 部件可以包括用于将牺牲材料与结构材料分离的非辐射入口和非辐射出口通道。 优选的形成方法使用电化学制造技术（例如包括选择性沉积，体积沉积，蚀刻操作和平坦化操作）和后沉积工艺（例如选择性蚀刻操作和/或反向填充操作）。
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32.发明申请Methods and Apparatus for Forming Multi-Layer Structures Including Use of A Sacrificial Patternable Mold Material 审中-公开形成多层结构的方法和装置，包括使用可牺牲图案的模具材料公开(公告)号：US20150308006A1
公开(公告)日：2015-10-29
申请号：US14676716
申请日：2015-04-01
Applicant: Microfabrica Inc.
Inventor： Adam L. Cohen , Jill R. Thomassian , Michael S. Lockard , Marvin M. Kilgo, III , Uri Frodis , Dennis R. Smalley
CPC classification number: C25D1/003 , C25D1/00 , C25D1/20 , C25D5/02 , C25D5/022 , C25D5/10 , C25D5/14 , C25D5/48 , C25D5/50
Abstract: Numerous electrochemical fabrication methods and apparatus are provided for producing multi-layer structures (e.g. having meso-scale or micro-scale features) from a plurality of layers of deposited materials using adhered masks (e.g. formed from liquid photoresist or dry film), where two or more materials may be provided per layer where at least one of the materials is a structural material and one or more of any other materials may be a sacrificial material which will be removed after formation of the structure. Materials may comprise conductive materials that are electrodeposited or deposited in an electroless manner. In some embodiments special care is undertaken to ensure alignment between patterns formed on successive layers.
Abstract translation: 提供了多种电化学制造方法和装置，用于使用粘附的掩模（例如由液体光致抗蚀剂或干膜形成）从多层沉积材料制备多层结构（例如具有中尺度或微尺度特征），其中两个 或者可以在每层中提供更多的材料，其中至少一种材料是结构材料，并且任何其它材料中的一种或多种可以是在形成结构之后被去除的牺牲材料。 材料可以包括以无电解方式电沉积或沉积的导电材料。 在一些实施例中，特别注意确保在连续层上形成的图案之间的对准。
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33.发明申请Methods of Forming Three-Dimensional Structures Having Reduced Stress and/or Curvature 有权形成具有减小的应力和/或曲率的三维结构的方法公开(公告)号：US20140238865A1
公开(公告)日：2014-08-28
申请号：US14194564
申请日：2014-02-28
Applicant: Microfabrica Inc.
Inventor： Ananda H. Kumar , Jorge S. Alberron , Adam L. Cohen , Kieun Kim , Michael S. Lockard , Uri Frodis , Dennis R. Smalley
CPC classification number: B81C1/00666 , C25D5/022
Abstract: Electrochemical fabrication processes and apparatus for producing single layer or multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers includes operations for reducing stress and/or curvature distortion when the structure is released from a sacrificial material which surrounded it during formation and possibly when released from a substrate on which it was formed. Six primary groups of embodiments are presented which are divide into eleven primary embodiments. Some embodiments attempt to remove stress to minimize distortion while others attempt to balance stress to minimize distortion.
Abstract translation: 用于生产单层或多层结构的电化学制造方法和装置，其中每个层包括至少两种材料的沉积，并且其中形成至少一些层包括当结构被释放时减少应力和/或曲率失真的操作 牺牲材料，其在形成期间包围它，并且可能当从其形成的基底释放时。 呈现了六个主要实施例的组，它们分为十一个主要实施例。 一些实施例尝试去除应力以最小化失真，而另一些实施例试图平衡应力以最小化失真。
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34.发明申请Method for Fabricating Miniature Structures or Devices such as RF and Microwave Components 有权用于制造微型结构或诸如RF和微波组件的设备的方法公开(公告)号：US20140197904A1
公开(公告)日：2014-07-17
申请号：US14194592
申请日：2014-02-28
Applicant: Microfabrica Inc.
Inventor： Elliott R. Brown , John D. Evans , Christopher A. Bang , Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley , Morton Grosser
CPC classification number: H01P1/202 , B33Y10/00 , B33Y70/00 , B81B2201/042 , C25D1/003 , G01P15/0802 , G01P15/125 , H01P3/06 , H01P5/183 , H01P11/00 , H01P11/005 , H01P11/007 , H05K3/4647 , Y10T29/49002 , Y10T29/49016 , Y10T29/49018
Abstract: Multi-layer, multi-material fabrication methods include depositing at least one structural material and at least one sacrificial material during the formation of each of a plurality of layers wherein deposited materials for each layer are planarized to set a boundary level for the respective layer and wherein during formation of at least one layer at least three materials are deposited with a planarization operation occurring before deposition of the last material to set a planarization level above the layer boundary level and wherein a planarization occurs after deposition of the last material level above the layer boundary level and wherein a planarization occurs after deposition of the last material whereby the boundary level for the layer is set. Some formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).
Abstract translation: 多层多材料制造方法包括在形成多个层期间沉积至少一种结构材料和至少一种牺牲材料，其中每层的沉积材料被平坦化以设定各层的边界水平， 其中在形成至少一个层期间，沉积至少三种材料，其中在沉积最终材料之前发生的平坦化操作，以将平坦化水平设置在层边界水平之上，并且其中在沉积层上方的最后材料层之后发生平坦化 并且其中在沉积最后的材料之后发生平坦化，由此设置该层的边界水平。 一些形成方法使用电化学制造技术（例如包括选择性沉积，体积沉积，蚀刻操作和平面化操作）和后沉积工艺（例如选择性蚀刻操作和/或反向填充操作）。
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公开(公告)号：US20140197145A1
公开(公告)日：2014-07-17
申请号：US14156437
申请日：2014-01-15
Applicant: Microfabrica Inc.
Inventor： Arun S. Veeramani , Heath A. Jensen , Uri Frodis , Christopher G. Wiita , Michael S. Lockard , Irina Boguslavsky , Pavel Lembrikov , Dennis R. Smalley , Richard T. Chen
IPC: B23K26/38
CPC classification number: B23K26/38 , B23K26/0624 , B23K26/18 , B23K26/40 , B23K2101/40 , B23K2103/50 , G01R1/06738 , G01R1/06744 , G01R3/00
Abstract: Embodiments are directed to the formation micro-scale or millimeter scale structures or method of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).
Abstract translation: 实施例涉及形成微尺度或毫米级结构或制造这种结构的方法，其中结构由至少一个片状结构材料形成，并且可以包括附加的片状结构材料或沉积的结构材料，其中所有或部分图案化 的结构材料通过激光切割发生。 在一些实施例中，使用选择性沉积来提供图案化的一部分。 在一些实施例中，结构材料或结构材料由牺牲桥接材料（例如金属）从下方限定，并且可能由上面由牺牲性封盖材料（例如金属）限定。
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Patent Agency Ranking
公开(公告)号：US12255123B2
公开(公告)日：2025-03-18
申请号：US17699049
申请日：2022-03-18
Applicant: Microfabrica Inc.
Inventor： Onnik Yaglioglu , Richard T. Chen , Will J. Tan , Jia Li , Uri Frodis , Nina C. Levy , Dennis R. Smalley
IPC: H01L23/473 , F28F3/12 , F28F13/06 , H01L21/48 , H05K7/20
Abstract: Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices or other devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, multi-stage microjets, microchannels, fins, wells, wells with flow passages, well with stress relief or stress propagation inhibitors, and integrated microjets and fins.
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公开(公告)号：US20240094258A1
公开(公告)日：2024-03-21
申请号：US17968638
申请日：2022-10-18
Applicant: Microfabrica Inc.
Inventor： Arun S. Veeramani , Ming Ting Wu , Dennis R. Smalley
CPC classification number: G01R1/07314 , G01R1/06722 , G01R1/06738 , G01R3/00
Abstract: Probes for contacting electronic components include compliant modules stacked in a serial configuration, which are supported by a sheath, exoskeleton, or endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Alternatively, probes may be formed from single modules or back-to-back modules that may share a common base/standoff. Modules may allow for lateral and/or longitudinal alignment relative to array structures or other modules. Planar springs may be spirals, interlaced spirals having common or offset longitudinal levels, with similar or different rotational orientations that are functionally joined, and planar springs may transition into multiple thinner planar spring elements along their length. Compression of probe tips toward one another may cause portions of spring elements to move closer together or further apart.
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公开(公告)号：US20230243870A1
公开(公告)日：2023-08-03
申请号：US18295712
申请日：2023-04-04
Applicant: Microfabrica Inc.
Inventor： Arun S. Veeramani , Ming Ting Wu , Dennis R. Smalley
CPC classification number: G01R1/06722 , G01R1/07314 , G01R1/06733
Abstract: Probe array for contacting electronic components includes a plurality of probes for making contact between two electronic circuit elements and a dual array plate mounting and retention configuration. The probes may comprise lower retention features that protrudes from a probe body with a size and configuration that limits the longitudinal extent to which the probes can be inserted into plate probe holes in the lower array plate and an upper retention feature undergoing lateral displacement relative to the upper plate probe hole such that it can no longer longitudinally pass through the extension of the upper plate probe hole in the upper array plate.
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公开(公告)号：US10788512B2
公开(公告)日：2020-09-29
申请号：US16373500
申请日：2019-04-02
Applicant: Microfabrica Inc.
Inventor： Richard T. Chen , Ezekiel J. J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such probe or cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.
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公开(公告)号：US20200227805A1
公开(公告)日：2020-07-16
申请号：US16711116
申请日：2019-12-11
Applicant: Microfabrica Inc.
Inventor： Elliott R. Brown , John D. Evans , Christopher A. Bang , Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley , Morton Grosser
Abstract: RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, hybrid couplers, antenna arrays and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).
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