公开(公告)号：US06228183B1

公开(公告)日：2001-05-08

申请号：US09123791

申请日：1998-07-28

申请人： Narasimha-Rao V. Bangaru ,  Jayoung Koo ,  Michael J. Luton ,  Clifford W. Petersen ,  Hiroshi Tamehiro ,  Hitoshi Asahi ,  Takuya Hara ,  Yoshio Terada

发明人： Narasimha-Rao V. Bangaru ,  Jayoung Koo ,  Michael J. Luton ,  Clifford W. Petersen ,  Hiroshi Tamehiro ,  Hitoshi Asahi ,  Takuya Hara ,  Yoshio Terada

IPC分类号： C22C3814

CPC分类号： C22C38/06 ,  C21D1/19 ,  C21D8/00 ,  C21D2211/002 ,  C21D2211/008 ,  C22C38/04 ,  C22C38/12 ,  C22C38/14

摘要： An ultra-high strength boron-containing steel having a tensile strength of at least about 900 MPa (130 ksi), a toughness as measured by Charpy V-notch impact test at −40° C. (−40° F.) of at least about 120 joules (90 ft-lbs), and a microstructure comprising predominantly fine-grained lower bainite, fine-grained lath martensite, or mixtures thereof, transformed from substantially unrecrystallized austenite grains and comprising iron and specified weight percentages of the additives: carbon, silicon, manganese, copper, nickel, niobium, vanadium, molybdenum, chromium, titanium, aluminum, calcium, Rare Earth Metals, and magnesium, is prepared by heating a steel slab to a suitable temperature; reducing the slab to form plate in one or more hot rolling passes in a first temperature range in which austenite recrystallizes; further reducing said plate in one or more hot rolling passes in a second temperature range below said first temperature range and above the temperature at which austenite begins to transform to ferrite during cooling; quenching said plate to a suitable Quench Stop Temperature; and stopping said quenching and allowing said plate to air cool to ambient temperature.

摘要翻译： 具有至少约900MPa（130ksi）拉伸强度的超高强度含硼钢，在-40℃（-40°F）下通过夏比V-缺口冲击试验测得的韧性 至少约120焦耳（90ft-lbs），以及由基本上未再结晶的奥氏体晶粒转化并且包含铁和特定重量百分比的添加剂的主要包含细粒度的下贝氏体，细粒状板条马氏体或其混合物的微观结构：碳 通过将钢坯加热到合适的温度来制备硅，锰，铜，镍，铌，钒，钼，铬，钛，​​铝，钙，稀土金属和镁， 在奥氏体重结晶的第一温度范围内，在一个或多个热轧道中将板坯还原成板; 在低于所述第一温度范围的第二温度范围内并且高于在冷却期间奥氏体开始转变为铁素体的温度的一个或多个热轧道中进一步减少所述板; 将所述板淬火至合适的淬火停止温度; 并停止所述淬火并允许所述板空气冷却至环境温度。

公开(公告)号：US5723089A

公开(公告)日：1998-03-03

申请号：US824079

申请日：1997-03-24

申请人： Rikio Chijiiwa ,  Hiroyuki Ogawa ,  Koichi Shinada ,  Yoshinori Ogata ,  Hiroshi Tamehiro ,  Hajime Ishikawa ,  Isamu Kimoto ,  Yoshio Terada

发明人： Rikio Chijiiwa ,  Hiroyuki Ogawa ,  Koichi Shinada ,  Yoshinori Ogata ,  Hiroshi Tamehiro ,  Hajime Ishikawa ,  Isamu Kimoto ,  Yoshio Terada

IPC分类号： B23K35/02 ,  B23K35/30 ,  C22C38/28

CPC分类号： B23K35/3053 ,  B23K35/0261 ,  B23K35/3066 ,  B23K35/308 ,  Y10S148/909

摘要： A wire for gas metal arc welding containing 0.01 to 0.06 wt % of C, 0.10 to 0.60 wt % of Si, 0.9 to 3.1 wt % of Mn, 0.7 to 2.0 wt % of Cr, 0.005 to 0.06% of Ti, not greater than 0.08 wt % of Al and if necessary, 0.05 to 0.30 wt % of Cu, and the balance of Fe and unavoidable impurities. This wire improves the selective corrosion resistance and the low temperature toughness of the resulting weld metal, and is particularly suitable for circumferential welding of line pipes for transporting CO.sub.2 -containing petroleum, natural gases or CO.sub.2.

摘要翻译： 含有C：0.01〜0.06重量％，Si：0.10〜0.60重量％，Mn：0.9〜3.1重量％，Cr：0.7〜2.0重量％，Ti：0.005〜0.06重量％ 0.08重量％的Al，如果需要，为0.05〜0.30重量％的Cu，余量为Fe和不可避免的杂质。 该线材提高了所得到的焊接金属的选择性腐蚀性和低温韧性，特别适用于输送含CO 2的石油，天然气或二氧化碳的管线的周向焊接。

公开(公告)号：US08974610B2

公开(公告)日：2015-03-10

申请号：US13575051

申请日：2011-02-04

申请人： Taishi Fujishiro ,  Takuya Hara ,  Yoshio Terada ,  Shinya Sakamoto ,  Hitoshi Asahi

发明人： Taishi Fujishiro ,  Takuya Hara ,  Yoshio Terada ,  Shinya Sakamoto ,  Hitoshi Asahi

IPC分类号： C21D9/08 ,  C21D8/10 ,  C22C38/12 ,  C22C38/02 ,  C22C38/04 ,  F16L31/02 ,  B23K35/30 ,  B23K31/02 ,  C21D9/50 ,  C22C38/00 ,  C22C38/14

CPC分类号： B23K35/3053 ,  B23K31/027 ,  B23K2101/06 ,  B23K2103/04 ,  C21D8/105 ,  C21D9/08 ,  C21D9/50 ,  C21D2211/002 ,  C22C38/001 ,  C22C38/002 ,  C22C38/02 ,  C22C38/04 ,  C22C38/12 ,  C22C38/14 ,  Y10S148/909

摘要： A high-strength welded steel pipe is obtained by welding a seam weld portion of a steel plate that are formed in a pipe shape. In the high-strength welded steel pipe, a base metal of the steel plate includes, by mass %, C: 0.010% to 0.080%, Si: 0.01% to 0.50%, Mn: 0.50% to 2.00%, S: 0.0001% to 0.0050%, Ti: 0.003% to 0.030%, Mo: 0.05% to 1.00%, B: 0.0003% to 0.0100%, O: 0.0001% to 0.0080%, N: 0.006% to 0.0118%, P: limited to 0.050% or less, Al: limited to 0.008% or less, and the balance of Fe and inevitable impurities, Ceq is 0.30 to 0.53, Pcm is 0.10 to 0.20, [N]−[Ti]/3.4 is less than 0.003, the average grain size of the prior γ grains in heat affected zones in the steel plate is 250 μm or less, and the prior γ grains include bainite and intragranular bainite.

摘要翻译： 通过焊接形成管状的钢板的焊缝部分来获得高强度焊接钢管。 在高强度焊接钢管中，钢板的贱金属以质量％计含有C：0.010〜0.080％，Si：0.01〜0.50％，Mn：0.50〜2.00％，S：0.0001％ 至0.0050％，Ti：0.003％至0.030％，Mo：0.05％至1.00％，B：0.0003％至0.0100％，O：0.0001％至0.0080％，N：0.006％至0.0118％，P：限于0.050％ 以下，Al：0.008％以下，Fe和不可避免的杂质余量Ceq为0.30〜0.53，Pcm为0.10〜0.20，[N] - [Ti] /3.4小于0.003，平均粒径 钢板的热影响区域的现有γ晶粒的尺寸为250μm以下，原来的γ晶粒包括贝氏体和晶粒内贝氏体。

公开(公告)号：US20140004342A1

公开(公告)日：2014-01-02

申请号：US13983614

申请日：2012-01-31

申请人： Midori Tojo ,  Yusuke Nakayama ,  Yoshio Terada ,  Kenji Furuta

发明人： Midori Tojo ,  Yusuke Nakayama ,  Yoshio Terada ,  Kenji Furuta

IPC分类号： C08K3/22 ,  C09J7/02

CPC分类号： C08K3/22 ,  C08K3/016 ,  C09J7/385 ,  C09J133/04 ,  C09J2205/102 ,  Y10T428/2891

摘要： A flame-retardant thermally-conductive pressure-sensitive adhesive sheet includes a flame-retardant thermally-conductive pressure-sensitive adhesive layer containing at least: (a) an acrylic polymer prepared by copolymerizing a monomer component containing an alkyl(meth)acrylate as a main component, containing a polar group-containing monomer, and not substantially containing a carboxyl group-containing monomer and (b) a hydrated metal compound.

摘要翻译： 阻燃性导热性粘合片包括阻燃性导热性粘合剂层，其至少包含：（a）通过使包含（甲基）丙烯酸烷基酯的单体成分共聚而制备的丙烯酸类聚合物， 主要成分，含有含极性基团的单体，基本上不含有含羧基的单体，（b）水合金属化合物。

公开(公告)号：US20130068419A1

公开(公告)日：2013-03-21

申请号：US13699594

申请日：2011-03-25

申请人： Takuya Mase ,  Yoshio Terada ,  Midori Tojo

发明人： Takuya Mase ,  Yoshio Terada ,  Midori Tojo

IPC分类号： F28F21/08 ,  B32B37/06 ,  F28F9/00

CPC分类号： F28F21/084 ,  B32B37/06 ,  C09J7/10 ,  C09J9/00 ,  C09J109/00 ,  C09J115/00 ,  C09J2201/606 ,  C09J2409/00 ,  C09J2415/00 ,  F28F9/00 ,  Y10T156/10

摘要： A thermally conductive reinforcing sheet includes a reinforcing layer. After the thermally conductive reinforcing sheet is attached to an aluminum board having a thickness of 1.0 mm and is heated at 80° C. for 10 minutes, the bending strength at a displacement of 1 mm of the resulting sheet is 10 N or more and the thermal conductivity of the reinforcing layer is 0.25 W/m·K or more.

摘要翻译： 导热性增强片包括增强层。 在将导热性增强片粘贴在厚度为1.0mm的铝板上并在80℃加热10分钟后，得到的片材的位移1mm的弯曲强度为10N以上， 加强层的导热率为0.25W / m·K以上。

公开(公告)号：US20120291907A1

公开(公告)日：2012-11-22

申请号：US13575051

申请日：2011-02-04

申请人： Taishi Fujishiro ,  Takuya Hara ,  Yoshio Terada ,  Shinya Sakamoto ,  Hitoshi Asahi

发明人： Taishi Fujishiro ,  Takuya Hara ,  Yoshio Terada ,  Shinya Sakamoto ,  Hitoshi Asahi

IPC分类号： F16L9/00 ,  B23K31/02

CPC分类号： B23K35/3053 ,  B23K31/027 ,  B23K2101/06 ,  B23K2103/04 ,  C21D8/105 ,  C21D9/08 ,  C21D9/50 ,  C21D2211/002 ,  C22C38/001 ,  C22C38/002 ,  C22C38/02 ,  C22C38/04 ,  C22C38/12 ,  C22C38/14 ,  Y10S148/909

摘要： A high-strength welded steel pipe is obtained by welding a seam weld portion of a steel plate that are formed in a pipe shape. In the high-strength welded steel pipe, a base metal of the steel plate includes, by mass %, C: 0.010% to 0.080%, Si: 0.01% to 0.50%, Mn: 0.50% to 2.00%, S: 0.0001% to 0.0050%, Ti: 0.003% to 0.030%, Mo: 0.05% to 1.00%, B: 0.0003% to 0.0100%, O: 0.0001% to 0.0080%, N: 0.006% to 0.0118%, P: limited to 0.050% or less, Al: limited to 0.008% or less, and the balance of Fe and inevitable impurities, Ceq is 0.30 to 0.53, Pcm is 0.10 to 0.20, [N]—[Ti]/3.4 is less than 0.003, the average grain size of the prior γ grains in heat affected zones in the steel plate is 250 μm or less, and the prior γ grains include bainite and intragranular bainite.

摘要翻译： 通过焊接形成管状的钢板的焊缝部分来获得高强度焊接钢管。 在高强度焊接钢管中，钢板的贱金属以质量％计含有C：0.010〜0.080％，Si：0.01〜0.50％，Mn：0.50〜2.00％，S：0.0001％ 至0.0050％，Ti：0.003％至0.030％，Mo：0.05％至1.00％，B：0.0003％至0.0100％，O：0.0001％至0.0080％，N：0.006％至0.0118％，P：限于0.050％ 以下，Al：0.008％以下，Fe和不可避免的杂质余量Ceq为0.30〜0.53，Pcm为0.10〜0.20，[N] - [Ti] /3.4小于0.003，平均粒径 钢板的热影响区域的现有γ晶粒的尺寸为250μm以下，原来的γ晶粒包括贝氏体和晶粒内贝氏体。

公开(公告)号：US20110290468A1

公开(公告)日：2011-12-01

申请号：US13147124

申请日：2010-01-13

申请人： Junichi Nakayama ,  Yoshio Terada ,  Kenji Furuta ,  Takashi Wano

发明人： Junichi Nakayama ,  Yoshio Terada ,  Kenji Furuta ,  Takashi Wano

IPC分类号： F28F7/00 ,  C09K5/00

CPC分类号： C09J133/08 ,  C08K7/00 ,  C08K2003/382 ,  C09J9/00 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/00

摘要： An object is to provide a heat conductive adhesive composition containing boron nitride particles and an acrylic polymer, which is capable of forming a molding having a good heat conductivity, and a heat conductive adhesive sheet with the heat conductive adhesive composition therein, which has a good heat conductivity and bond strength. Provided is the heat conductive adhesive composition which contains boron nitride particles and an acrylic polymer component, and the above boron nitride particles contain boron nitride particles having a particle size of 3 μm or more and 300 μm or less, wherein the boron nitride particles contain 5 to 45% by volume of boron nitride particles having a particle size of 3 μm or more and 20 μm or less, 30 to 70% by volume of boron nitride particles having a particle size of more than 20 μm and 60 μm or less, 1.0 to 40% by volume of boron nitride particles having a particle size of more than 60 μm and 300 μm or less.

摘要翻译： 本发明的目的是提供一种能够形成具有良好导热性的成型体的氮化硼粒子和丙烯酸类聚合物的导热性粘合剂组合物，其中具有良好导热性的粘合剂组合物的导热性粘合剂片材 导热性和结合强度。 提供含有氮化硼颗粒和丙烯酸类聚合物组分的导热粘合剂组合物，并且上述氮化硼颗粒含有粒径为3μm以上至300μm以下的氮化硼颗粒，其中氮化硼颗粒含有5 至45体积％的粒径为3μm以上且20μm以下的氮化硼粒子，30〜70体积％的粒径为20μm以上且60μm以下的氮化硼粒子，1.0 至40体积％的粒径为60μm以上且300μm以下的氮化硼粒子。

公开(公告)号：US08048690B2

公开(公告)日：2011-11-01

申请号：US12513316

申请日：2008-10-09

申请人： Yoshio Terada ,  Fumiteru Asai ,  Hirokuni Hashimoto

发明人： Yoshio Terada ,  Fumiteru Asai ,  Hirokuni Hashimoto

IPC分类号： H01L21/00

CPC分类号： H01L21/6836 ,  C08K3/017 ,  C08K7/06 ,  C09J7/21 ,  C09J2205/102 ,  C09J2205/106 ,  C09J2400/263 ,  G01L1/20 ,  G01R31/026 ,  G01R31/2886 ,  H01L2221/68327 ,  H01L2224/27436 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/3511 ,  Y10T428/24331 ,  Y10T428/28 ,  Y10T428/2848

摘要： A pressure-sensitive adhesive sheet according to the present invention is a pressure-sensitive adhesive sheet in which a pressure-sensitive adhesive layer is provided on a base film, in which the base film contains conductive fibers, and in which an electrically conductive path is formed between the pressure-sensitive adhesive layer and the base film. With this structure, an electrical continuity test can be performed even in a condition where a semiconductor wafer or a semiconductor chip formed by dicing the semiconductor wafer is applied, and deformation (warping) and damage of the semiconductor wafer and generation of flaws and scratches on the backside can be prevented in the test.

摘要翻译： 根据本发明的压敏粘合片是在基膜上设置压敏粘合剂层的压敏粘合片，其中基膜含有导电纤维，其中导电路径为 形成在压敏粘合剂层和基膜之间。 利用这种结构，即使在通过切割半导体晶片形成的半导体晶片或半导体芯片被施加的状态下，也可以进行电连续性测试，并且半导体晶片的变形（翘曲）和损坏以及缺陷和划痕的产生 在测试中可以防止背面。

公开(公告)号：US20100313667A1

公开(公告)日：2010-12-16

申请号：US12513230

申请日：2008-10-09

申请人： Yoshio Terada ,  Fumiteru Asai ,  Hirokuni Hashimoto

发明人： Yoshio Terada ,  Fumiteru Asai ,  Hirokuni Hashimoto

IPC分类号： G01L9/00 ,  H01L21/66

CPC分类号： G01R1/0735 ,  B32B7/12 ,  B32B27/08 ,  B32B27/18 ,  B32B27/281 ,  B32B27/283 ,  B32B27/30 ,  B32B27/32 ,  B32B27/322 ,  B32B27/36 ,  B32B27/40 ,  B32B2255/205 ,  B32B2262/106 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2264/108 ,  B32B2307/202 ,  B32B2307/516 ,  B32B2307/518 ,  C09J7/38 ,  C09J9/02 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2203/326 ,  G01R31/2853 ,  H01L21/67132 ,  H01L21/67253

摘要： Disclosed is an adhesive sheet for inspection, which is obtained by arranging an adhesive layer on a base film. The base film and the adhesive layer are electrically conductive, and an electrically conductive path is formed between the base film and the adhesive layer. Consequently, an inspection for electrical conduction of a semiconductor wafer or a semiconductor chip obtained by dicing a semiconductor wafer can be performed while the semiconductor wafer or the semiconductor chip is bonded to the adhesive sheet. In addition, this adhesive sheet for inspection enables to prevent deformation (warping) or breakage of a semiconductor wafer or generation of cracks or scratches on the back surface of the semiconductor wafer during the inspection.

摘要翻译： 公开了一种用于检查的粘合片，其通过在基膜上布置粘合剂层而获得。 基膜和粘合剂层是导电的，并且在基膜和粘合剂层之间形成导电路径。 因此，可以在将半导体晶片或半导体芯片粘合到粘合片上的同时，进行通过切割半导体晶片获得的半导体晶片或半导体芯片的导电性的检查。 此外，该检查用粘合片能够防止半导体晶片的变形（翘曲）或断裂，或者在检查时在半导体晶片的背面产生裂纹或划痕。

公开(公告)号：US20100203323A1

公开(公告)日：2010-08-12

申请号：US12677405

申请日：2008-08-26

申请人： Yoshio Terada ,  Shozo Kawazoe ,  Yoshinori Yoshida

发明人： Yoshio Terada ,  Shozo Kawazoe ,  Yoshinori Yoshida

IPC分类号： B32B7/10 ,  B05D5/10

CPC分类号： B08B7/0028 ,  C09J7/00 ,  C09J2201/626 ,  H01L21/6836 ,  Y10T428/26

摘要： Provided are a pressure-sensitive adhesive tape, which has a needed pressure-sensitive adhesive force for an adherend, can remove even foreign matter at a submicron level without contaminating a cleaning site, is excellent in heat resistance, exerts a sufficient pressure-sensitive adhesive force and a sufficient cohesive force even at a high temperature, and can be easily peeled without generating any adhesive residue on the adherend upon peeling from the adherend after its use, and a method of producing the tape. The pressure-sensitive adhesive tape of the present invention includes, on a surface of a support, an assembly layer of oblique columnar structures each protruding at an elevation angle of less than 90° from the surface of the support, the oblique columnar structures each having an aspect ratio of 1 or more. The method of producing a pressure-sensitive adhesive tape of the present invention is a method of producing, on a surface of a support, a pressure-sensitive adhesive tape including an assembly layer of oblique columnar structures each protruding at an elevation angle of less than 90° from the surface of the support, the oblique columnar structures each having an aspect ratio of 1 or more, the method including forming the oblique columnar structures on the surface of the support by an oblique deposition process.

摘要翻译： 提供一种对被粘物具有必要的压敏粘合力的压敏粘合带，能够在不污染清洁部位的情况下除去亚微米级的异物，耐热性优异，施加足够的压敏粘合剂 并且即使在高温下也具有足够的内聚力，并且在使用后剥离被粘附体时，可以容易地剥离被粘物而不会在被粘物上产生粘合残留物，以及该带的制造方法。 本发明的压敏粘合带在支撑体的表面上包括倾斜柱状结构的组装层，每个倾斜柱状结构从支撑体的表面以低于90°的仰角突出，倾斜柱状结构各自具有 长宽比为1以上。 本发明的粘合带的制造方法是在支撑体的表面上制造压敏粘合带的方法，所述粘合带包括倾斜柱状结构的组装层，每个倾斜柱状结构以小于 从支撑体的表面90°，倾斜柱状结构各自具有1以上的纵横比，该方法包括通过倾斜沉积工艺在支撑体的表面上形成倾斜柱状结构。