Optical lapping guide for use in the manufacture of perpendicular magnetic write heads
    32.
    发明授权
    Optical lapping guide for use in the manufacture of perpendicular magnetic write heads 失效
    用于制造垂直磁性写入头的光学研磨导轨

    公开(公告)号:US07603762B2

    公开(公告)日:2009-10-20

    申请号:US11611829

    申请日:2006-12-15

    IPC分类号: B24B49/00 B24B49/10

    摘要: An optical lapping guide for determining an amount of lapping performed on a row of sliders in a process for manufacturing sliders for magnetic data recording. The optical lapping guide is constructed with a front edge that is at an angle with respect to an air bearing surface plane ABS plane, such that a portion of the lapping guides is in front of the ABS and portion of the lapping guide is behind the ABS. As lapping progresses, an increasing amount of the lapping guide will be exposed at the ABS and visible for inspection. Therefore, after a lapping process has been performed, the optical lapping guide can be inspected to determine the amount of material removed by lapping. The greater the amount of the lapping guide that is exposed and visible, the greater the amount of material removed by lapping.

    摘要翻译: 光学研磨引导件,用于确定在用于制造用于磁数据记录的滑块的过程中对一排滑块执行的研磨量。 光学研磨引导件的前边缘相对于空气轴承表面平面ABS平面成一定角度,使得研磨导轨的一部分在ABS的前面,研磨导轨的一部分在ABS后面 。 随着研磨的进行,越来越多的研磨导轨将暴露在ABS处并可见以供检查。 因此,在进行研磨处理之后,可以检查光学研磨导向件以确定通过研磨去除的材料的量。 暴露和可见的研磨导轨的量越大,通过研磨去除的材料量就越大。

    System and method for a sacrificial anode in a kerf for corrosion protection during slider fabrication
    36.
    发明授权
    System and method for a sacrificial anode in a kerf for corrosion protection during slider fabrication 失效
    在滑块制造过程中用于腐蚀保护的切口中的牺牲阳极的系统和方法

    公开(公告)号:US06667457B1

    公开(公告)日:2003-12-23

    申请号:US10245051

    申请日:2002-09-17

    IPC分类号: B23K2638

    摘要: A slider fabrication assembly and method for making the same are provided. A slider is formed on a substrate. A corrodible component of the slider is exposed to an environment in contact with the slider. A kerf region of the substrate is positioned adjacent to the slider. The kerf region is removable from the slider. A sacrificial anode is embedded in the kerf region and exposed to the environment. The sacrificial anode is electrically coupled to the corrodible component of the slider thereby forming an electrochemical cell. The sacrificial anode is less noble, i.e., more corrodible, than the corrodible slider component, and thus corrodes first. When the kerf region is removed, the corroded sacrificial anode is removed as well.

    摘要翻译: 提供了一种滑块制造组件及其制造方法。 滑块形成在基板上。 滑块的可腐蚀部件暴露于与滑块接触的环境中。 衬底的切口区域邻近滑块定位。 切口区域可从滑块移除。 牺牲阳极嵌入切口区域并暴露于环境中。 牺牲阳极电耦合到滑块的可腐蚀部件,从而形成电化学电池。 牺牲阳极比可腐蚀的滑块部件更不贵,即更可腐蚀,因此首先腐蚀。 当切除切口区域时,腐蚀的牺牲阳极也被去除。

    Method of making TiC MR-head magnetic shield dummy shield spark gap
    37.
    发明授权
    Method of making TiC MR-head magnetic shield dummy shield spark gap 失效
    制造TiC MR磁头屏蔽虚拟屏蔽火花间隙的方法

    公开(公告)号:US06288880B1

    公开(公告)日:2001-09-11

    申请号:US09433900

    申请日:1999-11-04

    IPC分类号: G11B5127

    摘要: A magneto-resistive read head having a “parasitic shield” provides an alternative path for currents associated with sparkovers, thus preventing such currents from damaging the read head. The parasitic shield is provided in close proximity to a conventional magnetic shield. The electrical potential of parasitic shield is held essentially equal to the electrical potential of the sensor element. If charges accumulate on the conventional shield, current will flow to the parasitic shield at a lower potential than would be required for current to flow between the conventional shield and the sensor element. Alternatively, conductive spark gap devices are electrically coupled to sensor element leads and to each magnetic shield. Each spark gap device is brought within very close proximity of the substrate to provide an alternative path for charge that builds up between the sensor element and the substrate to be discharged. The ends of the spark gaps that are brought into close proximity of the substrate are preferably configured with high electric field density inducing structures which reduce the voltage required to cause a sparkover between the spark gap device and the substrate.

    摘要翻译: 具有“寄生屏蔽”的磁阻式读取头提供了与火花放电相关的电流的替代路径,从而防止这种电流损坏读取头。 寄生屏蔽件靠近传统的磁屏蔽设置。 寄生屏蔽的电位基本上等于传感器元件的电位。 如果电容积累在常规屏蔽上,则电流将以比传统屏蔽和传感器元件之间的电流流动所需的电位更低的电流流向寄生屏蔽。 或者,导电火花隙装置电耦合到传感器元件引线和每个磁屏蔽。 每个火花隙装置被带到非常靠近基板的位置,以提供在传感器元件和待排出的基板之间建立的用于充电的替代路径。 靠近基板的火花隙的端部优选地配置有高电场密度诱导结构,其降低在火花隙装置和基板之间引起火花放电所需的电压。

    Tantalum adhesion layer and reactive-ion-etch process for providing a
thin film metallization area
    38.
    发明授权
    Tantalum adhesion layer and reactive-ion-etch process for providing a thin film metallization area 失效
    钽粘附层和用于提供薄膜金属化区域的反应离子蚀刻工艺

    公开(公告)号:US5885750A

    公开(公告)日:1999-03-23

    申请号:US942777

    申请日:1997-10-02

    摘要: A method for providing a thin film metallization area on a substrate is disclosed comprising the steps of: depositing a Ta adhesion layer on the surface of the substrate seed layer, conducting a photo resist process on the Ta adhesion layer to define the thin film metallization area, including a remnant removal process to remove remnant photo resist process material in the thin film metallization area to the Ta adhesion layer, the Ta adhesion layer preventing the remnant removal from reaching the seed layer, conducting a Ta removal reactive-ion-etch process to remove the Ta adhesion layer in the thin film metallization area, so that the seed layer is exposed in the metallization area. A metal material may then be deposited in the metallization area.

    摘要翻译: 公开了一种在衬底上提供薄膜金属化区域的方法,包括以下步骤:在衬底晶种层的表面上沉积Ta粘附层,在Ta粘附层上进行光刻工艺以限定薄膜金属化区域 ,包括残留的去除工艺,以将薄膜金属化区域中残留的光致抗蚀剂处理材料去除到Ta粘附层,Ta粘附层防止残留物去除种子层,进行Ta去除反应离子蚀刻工艺 去除薄膜金属化区域中的Ta粘附层,使得种子层在金属化区域中暴露。 然后可以在金属化区域中沉积金属材料。

    Having parastic shield for electrostatic discharge protection
    39.
    发明授权
    Having parastic shield for electrostatic discharge protection 失效
    MR头具有用于静电放电保护的寄生屏蔽

    公开(公告)号:US5761009A

    公开(公告)日:1998-06-02

    申请号:US480069

    申请日:1995-06-07

    摘要: A magneto-resistive read head having a "parasitic shield" provides an alternative path for currents associated with sparkovers, thus preventing such currents from damaging the read head. The parasitic shield is provided in close proximity to a conventional magnetic shield. The electrical potential of parasitic shield is held essentially equal to the electrical potential of the sensor element. If charges accumulate on the conventional shield, current will flow to the parasitic shield at a lower potential than would be required for current to flow between the conventional shield and the sensor element. Alternatively, conductive spark gap devices are electrically coupled to sensor element leads and to each magnetic shield. Each spark gap device is brought within very close proximity of the substrate to provide an alternative path for charge that builds up between the sensor element and the substrate to be discharged. The ends of the spark gaps that are brought into close proximity of the substrate are preferably configured with high electric field density inducing structures which reduce the voltage required to cause a sparkover between the spark gap device and the substrate.

    摘要翻译: 具有“寄生屏蔽”的磁阻式读取头提供了与火花放电相关的电流的替代路径,从而防止这种电流损坏读取头。 寄生屏蔽件靠近传统的磁屏蔽设置。 寄生屏蔽的电位基本上等于传感器元件的电位。 如果电容积累在常规屏蔽上,则电流将以比传统屏蔽和传感器元件之间的电流流动所需的电位更低的电流流向寄生屏蔽。 或者,导电火花隙装置电耦合到传感器元件引线和每个磁屏蔽。 每个火花隙装置被带到非常靠近基板的位置,以提供在传感器元件和待排出的基板之间建立的用于充电的替代路径。 靠近基板的火花隙的端部优选地配置有高电场密度诱导结构,其降低在火花隙装置和基板之间引起火花放电所需的电压。

    WAFER-LEVEL METHOD FOR FABRICATING AN OPTICAL CHANNEL AND APERTURE STRUCTURE IN MAGNETIC RECORDING HEAD SLIDERS FOR USE IN THERMALLY-ASSISTED RECORDING (TAR)
    40.
    发明申请
    WAFER-LEVEL METHOD FOR FABRICATING AN OPTICAL CHANNEL AND APERTURE STRUCTURE IN MAGNETIC RECORDING HEAD SLIDERS FOR USE IN THERMALLY-ASSISTED RECORDING (TAR) 审中-公开
    用于制作用于热辅助记录(TAR)的磁记录头滑块中的光通道和光孔结构的波形方法

    公开(公告)号:US20090258186A1

    公开(公告)日:2009-10-15

    申请号:US12101066

    申请日:2008-04-10

    IPC分类号: G03F7/00 B32B3/10

    摘要: A process for forming a plurality of sliders for use in thermally-assisted recording (TAR) disk drives includes a wafer-level process for forming a plurality of aperture structures, and optionally abutting optical channels, on a wafer surface prior to cutting the wafer into individual sliders. The wafer has a generally planar surface arranged into a plurality of rectangularly-shaped regions. In each rectangular region a first metal layer is deposited on the wafer surface, followed by a layer of radiation-transmissive aperture material, which is then lithographically patterned to define the width of the aperture, the aperture width being parallel to the length of the rectangularly-shaped region. A second metal layer is deposited over the patterned layer of aperture material. The resulting structure is then lithographically patterned to define an aperture structure comprising aperture material surrounded by metal and having parallel radiation entrance and exit faces orthogonal to the wafer surface.

    摘要翻译: 用于形成用于热辅助记录(TAR)盘驱动器中的多个滑动件的方法包括在将晶片切割成晶片之前在晶片表面上形成多个孔结构和可选地邻接的光通道的晶片级工艺 个人滑块 晶片具有布置成多个矩形区域的大致平坦的表面。 在每个矩形区域中,第一金属层沉积在晶片表面上,随后是一层辐射透射的孔隙材料,然后将其光刻图案化以限定孔的宽度,孔的宽度平行于矩形的长度 形状区域。 在孔材料的图案化层上沉积第二金属层。 然后将所得结构光刻图案化以限定孔结构,该孔结构包括由金属包围并具有与晶片表面正交的平行辐射入射面和出射面的孔隙材料。