公开(公告)号：US08423175B2

公开(公告)日：2013-04-16

申请号：US12548873

申请日：2009-08-27

申请人： Yo Abe ,  Kiichi Takahashi ,  Junya Sato ,  Yoshinobu Motodate

发明人： Yo Abe ,  Kiichi Takahashi ,  Junya Sato ,  Yoshinobu Motodate

IPC分类号： G06F7/00

CPC分类号： H01L21/67098 ,  H01L21/67109 ,  H01L21/67766 ,  H01L21/67781

摘要： When a substrate is transferred by a holding arm to a multiple tier wafer boat, contact between the holding arm and the substrate is prevented. When the wafer boat is not subjected to a thermal effect, a normal height position of a ring member is obtained by relatively elevating and lowering a transfer base member with respect to the wafer boat. Before a wafer, which is not yet thermally processed, is transferred to the wafer boat, a height position of the corresponding ring member is obtained. By comparing a difference between the normal height position of the ring member and the height position of the ring member before the wafer is transported, with a threshold value, whether to transfer the wafer by the wafer transfer mechanism to the wafer boat can be judged.

公开(公告)号：US08345951B2

公开(公告)日：2013-01-01

申请号：US12227301

申请日：2007-05-16

申请人： Junya Sato

发明人： Junya Sato

IPC分类号： G06K9/00

CPC分类号： G06T7/11 ,  G06T7/136 ,  G06T2207/30141 ,  G06T2207/30148

摘要： A binarizing method for binarizing an original image of an electrode pad on a substrate. The method includes the steps of processing an electrode image to generate a binary image of the electrode by binarzing the original image with a first threshold value, calculating a contact trace area to calculate the contact trace area including a portion that is predicted to be a trace of an object that contacted the electrode from the binary image of the electrode, processing a contact trace image to generate the contact trace area binary image by binarizing the original image of the area extracted by the contact trace area extracting unit with a second threshold value different from the first threshold value, and synthesizing the images to synthesize the binary image of the electrode and the contact trace area binary image by taking a logical sum on a corresponding pixel to pixel basis.

摘要翻译： 一种用于将基板上的电极焊盘的原始图像二值化的二值化方法。 该方法包括以下步骤：通过利用第一阈值二值化原始图像来处理电极图像以产生电极的二值图像，计算接触迹线区域以计算包括预测为迹线的部分的接触迹线区域 从所述电极的二值图像接触所述电极的物体，通过将由所述接触迹线区域提取单元提取的区域的原始图像二值化为具有不同的第二阈值的值来处理接触迹线图像以生成所述接触迹线区域二值图像 并且通过以相应的像素为基础获取逻辑和来合成图像以合成电极和接触迹线区二进制图像的二值图像。

公开(公告)号：US08144482B2

公开(公告)日：2012-03-27

申请号：US12227803

申请日：2007-05-14

申请人： Junya Sato ,  Toru Taura ,  Nobuhiro Mikami ,  Shinji Watanabe ,  Atsumasa Sawada ,  Nozomu Nishimura

发明人： Junya Sato ,  Toru Taura ,  Nobuhiro Mikami ,  Shinji Watanabe ,  Atsumasa Sawada ,  Nozomu Nishimura

IPC分类号： H05K1/11 ,  H05K1/14

CPC分类号： H05K1/144 ,  H01R12/52 ,  H05K1/0218 ,  H05K3/325 ,  H05K2201/10378 ,  H05K2201/2018 ,  Y10T29/49126

摘要： A circuit board device includes: plurality of wiring boards (101 and 102) in which terminals are provided on the front and back surfaces and vias are provided for connecting the terminals together, an anisotropic conductive member (103) arranged between wiring boards (101 and 102) for connecting the electrodes of one wiring board to the electrodes of another wiring board, a functional block (104) composed of a metal material and arranged between the wiring boards (101 and 102) to enclose anisotropic conductive member (103), and a pair of holding blocks (105 and 106) composed of a metal material arranged to clamp the plurality of wiring boards (101 and 102), wherein the plurality of wiring boards (101 and 102), while in a state of being clamped between the pair of holding blocks (105 and 106), is connected together by the anisotropic conductive member (103) and the terminals provided on each of the wiring boards (101 and 102), the functional block (104), and the holding blocks (105 and 106) are electrically connected.

摘要翻译： 电路板装置包括：多个在前表面和后表面上设置有端子的布线板（101和102），并且设有用于将端子连接在一起的通孔;布置在布线板（101和102）之间的各向异性导电构件 102），用于将一个布线板的电极连接到另一个布线板的电极;功能块（104），由金属材料构成并布置在布线板（101和102）之间以封闭各向异性导电构件（103）;以及 一对夹持多个布线板（101和102）的金属材料构成的保持块（105和106），其中所述多个布线板（101和102）处于夹在所述多个布线板 一对保持块（105和106）通过各向异性导电构件（103）和设置在每个布线板（101和102）上的端子，功能块（104）和保持块（105）连接在一起 和 106）电连接。

公开(公告)号：US08119918B2

公开(公告)日：2012-02-21

申请号：US12066474

申请日：2006-09-01

申请人： Junya Sato ,  Shinji Watanabe ,  Nobuhiro Mikami ,  Atsumasa Sawada

发明人： Junya Sato ,  Shinji Watanabe ,  Nobuhiro Mikami ,  Atsumasa Sawada

IPC分类号： H05K1/11

CPC分类号： H01L23/49827 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H05K1/0271 ,  H05K1/115 ,  H05K3/108 ,  H05K3/403 ,  H05K3/421 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/09645 ,  H05K2201/09745 ,  H05K2201/09909 ,  H01L2924/00014 ,  H01L2924/00

摘要： An object of the present invention is to prevent occurrence of an electrical fault such as signal disconnection due to exfoliation between a via and a printed circuit board, via crack, or the like, caused by various stresses that may arise when the printed circuit board is curved. The printed circuit board includes a first wiring layer 11, an electrical insulating base material 12 formed on the first wiring layer 11 and including a via base hole 12a that leads to the first wiring layer 11, and a second wiring layer 16 that is formed on the electrical insulating base material 12 and is electrically connected to the first wiring layer 11 through the via base hole 12a. In a region of the second wiring layer 16 disposed at least in the vicinity of the via base hole 12a, a stress relieving portion 17 is formed which relieves bending stress, tensile stress, compressive stress, and shear stress that may arise when the electrical insulating base material 12 is curved.

摘要翻译： 本发明的目的在于防止电路故障的发生，例如由于印刷电路板是由印刷电路板所产生的各种应力引起的通孔和印刷电路板之间的剥离引起的信号断开等。 弯曲。 印刷电路板包括第一布线层11，形成在第一布线层11上的电绝缘基材12，并且包括通向第一布线层11的通孔基底孔12a和形成在第一布线层11上的第二布线层16 电绝缘基材12，并且通过通孔基底孔12a与第一布线层11电连接。 在至少设置在通孔基底孔12a附近的第二布线层16的区域中，形成有减轻应力消除部分17，该部分减轻了当电绝缘材料时可能产生的弯曲应力，拉伸应力，压缩应力和剪切应力 基材12弯曲。

公开(公告)号：US20100315789A1

公开(公告)日：2010-12-16

申请号：US12446337

申请日：2007-10-05

申请人： Junya Sato

发明人： Junya Sato

IPC分类号： H05K7/00 ,  H05K1/00

CPC分类号： H05K3/368 ,  H01R12/52 ,  H01R12/613 ,  H01R13/2414 ,  H05K2201/0314 ,  H05K2201/09018 ,  H05K2201/10378 ,  H05K2201/2009

摘要： Provided is a circuit board device in which printed wiring boards 11, 12 are connected to each other electrically using a anisotropic conductive member 15 disposed between the printed wiring boards 11, 12. The anisotropic conductive member 15 comprises: an insulating elastic resin material 16; fine metal wires 17 having a middle portion embedded within the insulating elastic resin material 16 so as to connect corresponding connecting terminals of the printed wiring boards 11, 12; and resin layers 18 exhibiting a flexural rigidity greater than that of the insulating elastic resin material. An assembly composed of the printed wiring boards 11, 12 and anisotropic conductive member 15 is curved. The resin layers are shape-retaining resins for maintaining the curvature of respective ones of principal surfaces of the anisotropic conductive member 15 made to conform to curvature of the printed wiring boards 11, 12.

摘要翻译： 提供了一种电路板装置，其中印刷线路板11,12使用布置在印刷线路板11,12之间的各向异性导电构件15彼此电连接。各向异性导电构件15包括：绝缘弹性树脂材料16; 精细金属线17，其具有嵌入在绝缘弹性树脂材料16内的中间部分，以连接印刷电路板11,12的相应的连接端子; 树脂层18的弯曲刚度大于绝缘弹性树脂材料的弯曲刚度。 由印刷电路板11,12和各向异性导电构件15组成的组件是弯曲的。 树脂层是形状保持树脂，用于保持使各向异性导电构件15的各个主表面的曲率相应于印刷线路板11,12的曲率。

公开(公告)号：US07847389B2

公开(公告)日：2010-12-07

申请号：US12093896

申请日：2006-11-13

申请人： Nobuhiro Mikami ,  Shinji Watanabe ,  Junya Sato ,  Atsumasa Sawada

发明人： Nobuhiro Mikami ,  Shinji Watanabe ,  Junya Sato ,  Atsumasa Sawada

IPC分类号： H01L23/48

CPC分类号： H01L23/4985 ,  H01L23/49816 ,  H01L24/50 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3511

摘要： Even when a substrate on which a semiconductor package has been mounted is made curved, stress upon electrical connections is mitigated, thereby eliminating faulty connections and improving connection reliability. A semiconductor chip has electrodes on a second face thereof. Support blocks, capable of bending and flexing, are placed at two locations on a peripheral edge of a first face of the semiconductor chip. An interposer is placed so as to span the support blocks with the support blocks interposed between itself and the semiconductor chip, and has a wiring pattern in a flexible resin film. Two end portions of the interposer are folded back onto the side of the second face of the semiconductor chip, and the wiring pattern thereof is electrically connected to the electrodes of the semiconductor chip.

摘要翻译： 即使当安装了半导体封装的衬底弯曲时，电气连接上的应力减轻，从而消除了连接错误并提高了连接的可靠性。 半导体芯片在其第二面具有电极。 能够弯曲和弯曲的支撑块被放置在半导体芯片的第一面的外围边缘上的两个位置处。 放置插入件以跨越支撑块，其中插入其自身和半导体芯片之间的支撑块，并且在柔性树脂膜中具有布线图案。 插入器的两端部被折回到半导体芯片的第二面的一侧，并且其布线图案电连接到半导体芯片的电极。

公开(公告)号：US20100147566A1

公开(公告)日：2010-06-17

申请号：US12600677

申请日：2008-04-02

申请人： Junya Sato

发明人： Junya Sato

IPC分类号： H05K1/14 ,  H05K1/03

CPC分类号： H05K1/0271 ,  H05K1/036 ,  H05K3/4626 ,  H05K2203/0271

摘要： Electronic components on a printed wiring board can be protected from the impact force of a fall, whereby the electrical and mechanical reliability of the electronic apparatus components can be greatly improved, and moreover, smaller size, lighter weight, higher functionality, and greater multifunctionality can be achieved. The composite multilayer wiring board of the present invention includes a plurality of intermediate layers each interposed between a plurality of printed wiring boards, at least one of the plurality of intermediate layers being composed of a resin material having a dilatancy characteristic.

摘要翻译： 可以防止印刷电路板上的电子元件免受坠落的冲击力，从而可以大大提高电子设备部件的电气和机械可靠性，而且，更小的尺寸，更轻的重量，更高的功能性和更多的多功能性可以 实现。 本发明的复合多层布线基板包括多个中间层，其分别插入在多个印刷线路板之间，所述多个中间层中的至少一个由具有膨胀特性的树脂材料构成。

公开(公告)号：US20090135573A1

公开(公告)日：2009-05-28

申请号：US12227803

申请日：2007-05-14

申请人： Junya Sato ,  Toru Taura ,  Nobuhiro Mikami ,  Shinji Watanabe ,  Atsumasa Sawada ,  Nozomu Nishimura

发明人： Junya Sato ,  Toru Taura ,  Nobuhiro Mikami ,  Shinji Watanabe ,  Atsumasa Sawada ,  Nozomu Nishimura

IPC分类号： H05K1/14 ,  H05K3/36

CPC分类号： H05K1/144 ,  H01R12/52 ,  H05K1/0218 ,  H05K3/325 ,  H05K2201/10378 ,  H05K2201/2018 ,  Y10T29/49126

摘要： A circuit board device includes: plurality of wiring boards (101 and 102) in which terminals are provided on the front and back surfaces and vias are provided for connecting the terminals together, an anisotropic conductive member (103) arranged between wiring boards (101 and 102) for connecting the electrodes of one wiring board to the electrodes of another wiring board, a functional block (104) composed of a metal material and arranged between the wiring boards (101 and 102) to enclose anisotropic conductive member (103), and a pair of holding blocks (105 and 106) composed of a metal material arranged to clamp the plurality of wiring boards (101 and 102), wherein the plurality of wiring boards (101 and 102), while in a state of being clamped between the pair of holding blocks (105 and 106), is connected together by the anisotropic conductive member (103) and the terminals provided on each of the wiring boards (101 and 102), the functional block (104), and the holding blocks (105 and 106) are electrically connected.

摘要翻译： 电路板装置包括：多个在前表面和后表面上设置有端子的布线板（101和102），并且设有用于将端子连接在一起的通孔;布置在布线板（101和102）之间的各向异性导电构件 102），用于将一个布线板的电极连接到另一个布线板的电极;功能块（104），由金属材料构成并布置在布线板（101和102）之间以封闭各向异性导电构件（103）;以及 一对夹持多个布线板（101和102）的金属材料构成的保持块（105和106），其中所述多个布线板（101和102）处于夹在所述多个布线板 一对保持块（105和106）通过各向异性导电构件（103）和设置在每个布线板（101和102）上的端子，功能块（104）和保持块（105）连接在一起 和 106）电连接。

公开(公告)号：US20090096080A1

公开(公告)日：2009-04-16

申请号：US12093896

申请日：2006-11-13

申请人： Nobuhiro Mikami ,  Shinji Watanabe ,  Junya Sato ,  Atsumasa Sawada

发明人： Nobuhiro Mikami ,  Shinji Watanabe ,  Junya Sato ,  Atsumasa Sawada

IPC分类号： H01L23/48

CPC分类号： H01L23/4985 ,  H01L23/49816 ,  H01L24/50 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3511

摘要： Even when a substrate on which a semiconductor package has been mounted is made curved, stress upon electrical connections is mitigated, thereby eliminating faulty connections and improving connection reliability. A semiconductor chip has electrodes on a second face thereof. Support blocks, capable of bending and flexing, are placed at two locations on a peripheral edge of a first face of the semiconductor chip. An interposer is placed so as to span the support blocks with the support blocks interposed between itself and the semiconductor chip, and has a wiring pattern in a flexible resin film. Two end portions of the interposer are folded back onto the side of the second face of the semiconductor chip, and the wiring pattern thereof is electrically connected to the electrodes of the semiconductor chip.

摘要翻译： 即使当安装了半导体封装的衬底弯曲时，电气连接上的应力减轻，从而消除了连接错误并提高了连接的可靠性。 半导体芯片在其第二面具有电极。 能够弯曲和弯曲的支撑块被放置在半导体芯片的第一面的外围边缘上的两个位置处。 放置插入件以跨越支撑块，其中插入其自身和半导体芯片之间的支撑块，并且在柔性树脂膜中具有布线图案。 插入器的两端部被折回到半导体芯片的第二面的一侧，并且其布线图案电连接到半导体芯片的电极。

公开(公告)号：US07501584B2

公开(公告)日：2009-03-10

申请号：US10519002

申请日：2003-06-24

申请人： Yoshiyuki Hashimoto ,  Junya Sato

发明人： Yoshiyuki Hashimoto ,  Junya Sato

IPC分类号： H05K1/02

CPC分类号： H05K3/368 ,  H05K3/305 ,  H05K3/325 ,  H05K2201/0314 ,  H05K2201/09481 ,  H05K2201/10393 ,  Y10T29/49126

摘要： A structure for connecting substrates to each other, which is capable of thinning an electronic device on which a plurality of circuit boards is mounted, saving a space of the electronic device, and detaching a circuit board from the electronic device. The circuit board unit includes a first substrate including, on a surface thereof, a first group of electrode terminals arranged in a matrix, a second substrate including, on a surface thereof, a second group of electrode terminals arranged in a matrix in alignment with the first group of electrode terminals, and an anisotropic electrical conductor sandwiched between the first and second substrates. The first and second substrates and the anisotropic electrical conductor are pressurized by means of a pressurizer to electrically connect the electrode terminals to each other through the anisotropic electrical conductor.

摘要翻译： 用于连接基板的结构，其能够使其上安装有多个电路板的电子设备变薄，从而节省了电子设备的空间，并且将电路板与电子设备分离。 电路板单元包括第一基板，其表面上包括以矩阵形式布置的第一组电极端子，第二基板在其表面上包括布置成矩阵的第二组电极端子， 第一组电极端子和夹在第一和第二基板之间的各向异性电导体。 第一和第二基板和各向异性电导体通过加压器加压，以通过各向异性导电体将电极端子彼此电连接。