摘要:
An image forming apparatus includes an image forming device forming an image on a recording medium wound into a roll, and a roll sheet conveyance device unwinding and conveying the medium to the image forming device. The roll sheet conveyance device includes a roll sheet feed device, a torsion detector, and a control device. The roll sheet feed device includes a drive device including upstream and downstream shafts in a drive transmission direction to rotate the medium, and a feed device to feed the medium. The detection device includes a torsion coil spring provided between the upstream and downstream shafts, and a pair of an encoder and an encoder sensor detecting the torsion amount at the opposite ends of the torsion coil spring. The control device controls the torsion amount on the basis of a signal from the detection device, and applies a given back tension to the medium.
摘要:
An adenine compound represented by the formula (1): (1) [wherein A1 and A2 each independently represents an (un)substituted aromatic carbocycle or (un)substituted aromatic heterocycle; L1, L2, and L3 each independently represents alkylene or a single bond, provided that any methylene or methine group in L2 or L3 may be bonded to the nitrogen atom adjacent to L2 and L3 to form a 4- to 7-membered saturated nitrogenous heterocycle; L4 represents alkylene or a single bond; R1 represents (un)substituted alkyl, (un)substituted aryl, etc.; R2 represents hydrogen or (un)substituted alkyl; R3 represents (un)substituted alkyl, etc.; and X represents oxygen, etc.] or a pharmaceutically acceptable salt of the compound. The compound and salt are useful as a medicine.
摘要:
An insulating layer made of an insulator film or the like is prepared. Then, a thin metal film and a thin copper film are formed in sequence on the insulating layer. The thin copper film is subsequently laminated with a dry film or the like, and exposed and developed to form a plating resist thereon that have patterns opposite to conductor patterns which are formed in a subsequent step. This is followed by forming conductor patterns made of copper, by electrolytic plating using an electrolytic copper sulfate plating solution, on the surfaces of the thin copper film where the plating resist is not formed. The plating resist is then removed by, for example, stripping. After this, the thin copper film is held at a temperature of not less than 200° C. and not more than 300° C. for approximately an hour to be thermally treated. Then, the thin copper film and the thin metal film are removed by chemical etching except the portions under the conductor patterns.
摘要:
A switched capacitor type D/A converter receives m-bit (m represents an integer) input data, and outputs an analog signal that corresponds to the input data value. Switch circuits are provided to respective bits of the input data, and are classified into two groups: a first group configured to turn on when the corresponding input data bit is 1, and to turn off when the corresponding input data bit is 0; and a second group configured to turn on when the corresponding input data bit is 0, and to turn off when the corresponding input data bit is 1. Each switch of the first and second switch groups is configured as a P-channel MOSFET (Metal Oxide Semiconductor Field Effect Transistor). The ground voltage 0 V is applied to the lower power supply terminal of each of the first and second inverters configured to supply a gate signal to each switch.
摘要:
An insulating layer made of an insulator film or the like is prepared. Then, a thin metal film and a thin copper film are formed in sequence on the insulating layer. The thin copper film is subsequently laminated with a dry film or the like, and exposed and developed to form a plating resist thereon that have patterns opposite to conductor patterns which are formed in a subsequent step. This is followed by forming conductor patterns made of copper, by electrolytic plating using an electrolytic copper sulfate plating solution, on the surfaces of the thin copper film where the plating resist is not formed. The plating resist is then removed by, for example, stripping. After this, the thin copper film is held at a temperature of not less than 200° C. and not more than 300° C. for approximately an hour to be thermally treated. Then, the thin copper film and the thin metal film are removed by chemical etching except the portions under the conductor patterns.
摘要:
An image forming apparatus includes a fixing apparatus for fixing a toner image onto a recording medium by applying pressure and heat to toner provided on the surface of the recording medium. The fixing apparatus includes a fixing member, a pressing member for pressing against the fixing member, a temperature detecting part for detecting the temperature of the fixing member, and a heating member including a main heating member and an auxiliary heating member for heating the fixing member, the main heating member being heated by obtaining power from a main power supply, the auxiliary heating member being heated by obtaining power from an auxiliary power supply.
摘要:
A wired circuit board is provided having a high-reliability conductive pattern formed thereon and mounting an electronic component thereon with high accuracy, and a method is provided for manufacturing the wired circuit board and mounting the electronic component thereon. An insulating layer including a mounting portion is formed on a metal supporting layer having a specular gloss of 150 to 500% at an incidence angle of 45°. A conductive pattern is formed on the insulating layer. By a reflection-type optical sensor, a defective shape of the conductive pattern is inspected. Then, an opening is formed by etching the portion of the metal supporting layer which is overlapping the mounting portion such that the mounting portion of the insulating layer exposed by etching has a haze value of 20 to 50%, whereby a TAB tape carrier is obtained. Thereafter, an electronic component is aligned with the mounting portion by a reflection-type optical sensor such that the electronic component is mounted on the mounting portion.
摘要:
A wired circuit board is provided having a high-reliability conductive pattern formed thereon and mounting an electronic component thereon with high accuracy, and a method is provided for manufacturing the wired circuit board and mounting the electronic component thereon. An insulating layer including a mounting portion is formed on a metal supporting layer having a specular gloss of 150 to 500% at an incidence angle of 45°. A conductive pattern is formed on the insulating layer. By a reflection-type optical sensor, a defective shape of the conductive pattern is inspected. Then, an opening is formed by etching the portion of the metal supporting layer which is overlapping the mounting portion such that the mounting portion of the insulating layer exposed by etching has a haze value of 20 to 50%, whereby a TAB tape carrier is obtained. Thereafter, an electronic component is aligned with the mounting portion by a reflection-type optical sensor such that the electronic component is mounted on the mounting portion.
摘要:
A wired circuit board includes a conductive pattern, and an insulating layer covering the conductive pattern and having a transmittance of not more than 30% with respect to a wavelength in a range of 600 to 680 nm.
摘要:
The present invention provides compounds of formula (I) wherein R1, Y1, X1, Z1, X2, Y2, A, Y3, n, R and R2 are as defined in the specification, processes for their preparation, pharmaceutical compositions containing them and their use in therapy.