公开(公告)号：US09769917B2

公开(公告)日：2017-09-19

申请号：US14330110

申请日：2014-07-14

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Norio Sakai ,  Yoshihito Otsubo

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/46

CPC classification number: H05K1/0278 ,  H01L2224/16227 ,  H01L2924/15313 ,  H01L2924/19105 ,  H05K1/0271 ,  H05K1/0298 ,  H05K1/183 ,  H05K1/186 ,  H05K3/4691 ,  H05K3/4697

Abstract: A resin multilayer substrate includes a resin structure formed by laminating a plurality of resin layers and disposed components. Built-in components are embedded within the resin structure and a mounted component mounted on a surface of the resin structure. The resin structure includes a flexible part in which a first lamination number of the resin layers are laminated and a rigid part in which a second lamination number of the resin layers is laminated. The second lamination number is larger than the first lamination number. When viewed in a plan view, the flexible part has a shape which is not a rectangle, and a disposed component which is closest to a boundary line between the flexible part and the rigid part is disposed such that a side thereof which is closest to the boundary line is parallel to the boundary line.

公开(公告)号：US20170231085A1

公开(公告)日：2017-08-10

申请号：US15464851

申请日：2017-03-21

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito Otsubo ,  Norio Sakai ,  Tetsuya Kanagawa

IPC: H05K1/02 ,  H05K1/18 ,  H01F27/255 ,  H05K1/16 ,  H01F27/28

CPC classification number: H05K1/0243 ,  H01F17/04 ,  H01F27/255 ,  H01F27/2823 ,  H01F27/40 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/15173 ,  H05K1/113 ,  H05K1/165 ,  H05K1/181 ,  H05K3/3452 ,  H05K2201/049 ,  H05K2201/0979 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10378 ,  H01L2924/00

Abstract: A high-frequency component includes a resin layer and a high-frequency circuit provided in and on the resin layer and includes an inductor and an electronic component. The electronic component is arranged on an upper surface of the resin layer. The inductor includes first and second metal pins provided such that upper end surfaces thereof are exposed from the upper surface of the resin layer and lower end surfaces thereof are exposed from a lower surface of the resin layer. The electronic component has a first outer electrode provided at a position superposed with the upper end surface of the first metal pin in plan view and is connected to the first metal pin, and a second outer electrode provided at a position superposed with the upper end surface of the second metal pin in plan view and is connected to the second metal pin.

公开(公告)号：US20170186528A1

公开(公告)日：2017-06-29

申请号：US15461981

申请日：2017-03-17

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito Otsubo ,  Shinichiro Banba ,  Norio Sakai

IPC: H01F27/28 ,  H01F41/04

CPC classification number: H01F27/2804 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/292 ,  H01F41/041 ,  H01F41/043

Abstract: A technique capable of reducing the resistance of an inductor electrode is provided. A second conductor 6 is constituted by an undercoating layer 11 formed of a conductive paste, and a plating layer 12 formed to cover the undercoating layer 11. Therefore, the second conductor 6 constituting part of the inductor electrode 7 can be formed at a lower cost. Respective first end surfaces 8a and 9a of first and second metal pins 8 and 9 are connected to each other by the plating layer 12 of the second conductor 6 without interposition of the undercoating layer 11 thereof between them. Hence the resistance of the inductor electrode 7 can be reduced at a lower cost.

公开(公告)号：US20140321076A1

公开(公告)日：2014-10-30

申请号：US14330110

申请日：2014-07-14

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Norio Sakai ,  Yoshihito Otsubo

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0278 ,  H01L2224/16227 ,  H01L2924/15313 ,  H01L2924/19105 ,  H05K1/0271 ,  H05K1/0298 ,  H05K1/183 ,  H05K1/186 ,  H05K3/4691 ,  H05K3/4697

Abstract: A resin multilayer substrate includes a resin structure formed by laminating a plurality of resin layers and disposed components. Built-in components are embedded within the resin structure and a mounted component mounted on a surface of the resin structure. The resin structure includes a flexible part in which a first lamination number of the resin layers are laminated and a rigid part in which a second lamination number of the resin layers is laminated. The second lamination number is larger than the first lamination number. When viewed in a plan view, the flexible part has a shape which is not a rectangle, and a disposed component which is closest to a boundary line between the flexible part and the rigid part is disposed such that a side thereof which is closest to the boundary line is parallel to the boundary line.

Abstract translation: 树脂多层基板包括通过层叠多个树脂层和设置的部件而形成的树脂结构。 内置组件嵌入在树脂结构内，安装在树脂结构表面上的组件。 该树脂结构包括层压第一层叠数量的树脂层的柔性部分和层压第二层压数量的树脂层的刚性部分。 第二层压数大于第一层压数。 当在平面图中观察时，柔性部分具有不是矩形的形状，并且最靠近柔性部分和刚性部分之间的边界线的设置部件设置成使得其最靠近 边界线平行于边界线。

公开(公告)号：US20140218884A1

公开(公告)日：2014-08-07

申请号：US14246682

申请日：2014-04-07

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Norio Sakai ,  Yoshihito Otsubo

IPC: H05K1/18

CPC classification number: H05K1/183 ,  H01L23/49822 ,  H01L23/50 ,  H01L24/95 ,  H01L2224/16225 ,  H01L2924/12042 ,  H01L2924/19105 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/186 ,  H05K3/4614 ,  H05K3/4697 ,  H05K2201/0195 ,  H05K2201/09027 ,  H05K2201/10507 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

Abstract: A component-embedded resin substrate includes a resin structure including a plurality of laminated resin layers and having an end surface surrounding an outer periphery of the resin layers and a plurality of embedded components arranged as embedded in the resin structure. The plurality of embedded components include a first embedded component and a second embedded component. When viewed in a planar view, the first embedded component has a first outer side extending along a portion of an end surface 5 closest to the first embedded component. When viewed in a planar view, the second embedded component has a second outer side extending along a portion of the end surface closest to the second embedded component. When viewed in a planar view, the outer side is oblique to the second outer side.

Abstract translation: 嵌入树脂组件的树脂基板包括树脂结构体，该树脂结构体包括多个层压树脂层，并且具有围绕树脂层的外周的端面和嵌入树脂结构体中的多个嵌入部件。 多个嵌入式组件包括第一嵌入组件和第二嵌入组件。 当在平面视图中观察时，第一嵌入部件具有沿最靠近第一嵌入部件的端面5的一部分延伸的第一外侧。 当在平面视图中观察时，第二嵌入部件具有沿最靠近第二嵌入部件的端表面的一部分延伸的第二外侧。 当在平面图中观察时，外侧与第二外侧倾斜。