公开(公告)号：US20190355882A1

公开(公告)日：2019-11-21

申请号：US16478996

申请日：2018-01-24

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Martin Brandl ,  Markus Pindl

IPC: H01L33/54 ,  H01L33/48 ,  H01L33/20

Abstract: An optoelectronic component includes a housing including a first cavity bounded by a first wall, wherein a circumferentially extending first step is formed at an inner side of the first wall, the first step circumferentially extends around the first cavity obliquely with respect to a bottom of the first cavity, a first optoelectronic semiconductor chip is arranged at the bottom of the first cavity, the first optoelectronic semiconductor chip is embedded into a first potting material arranged in the first cavity and extending from the bottom of the first cavity as far as the first step, and a first potting surface of the first potting material is formed at the first step.

公开(公告)号：US20190157514A1

公开(公告)日：2019-05-23

申请号：US15779310

申请日：2016-11-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Pindl ,  Matthias Sperl

IPC: H01L33/48 ,  H01L33/52 ,  H01L33/50

Abstract: A method of producing an optoelectronic component includes providing a carrier; securing a sheet including a wavelength-converting material on a top side of the carrier; arranging a grid structure on a top side of the sheet; arranging an optoelectronic semiconductor chip in an opening of the grid structure on the top side of the sheet; arranging a potting material on the top side of the sheet, wherein the grid structure and the optoelectronic semiconductor chip are at least partly embedded into the potting material, and a composite body including the potting material, the sheet, the grid structure and the optoelectronic semiconductor chip is formed; and detaching the composite body from the carrier.

公开(公告)号：US10026710B2

公开(公告)日：2018-07-17

申请号：US15589427

申请日：2017-05-08

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Thomas Bemmerl ,  Simon Jerebic ,  Markus Pindl

IPC: H05K7/00 ,  H01L23/00 ,  H01L33/62 ,  H01L33/54 ,  H01L33/60 ,  H01L33/50 ,  H01L33/56 ,  H01L33/32 ,  H01L33/06 ,  H01L23/31 ,  H01L21/56 ,  H01L25/16

CPC classification number: H01L24/32 ,  H01L21/56 ,  H01L23/3142 ,  H01L24/83 ,  H01L25/167 ,  H01L33/06 ,  H01L33/32 ,  H01L33/44 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/29101 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83951 ,  H01L2924/12041 ,  H01L2924/1434 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2933/0091 ,  H05K7/02 ,  H01L2924/00 ,  H01L2924/014

Abstract: An electronic arrangement comprising: a carrier; at least one connecting area on the carrier; at least one electronic component, which is fixed at least on the connecting area by a contact material; a covering area, which surrounds the connecting area on the carrier; and at least one covered region covered by a covering material; wherein the covering area is highly reflective with a reflectivity of greater than 70%, exposed regions on the connecting area and on the contact material are covered with the covering material, and the covering material is colored by titanium dioxide particles in such a way that the titanium dioxide particles are provided in the covering material in a proportion between 25 percent and 70 percent by weight, such that the covering material is highly reflective with a reflectivity of greater than 70% to minimize optical contrast between the covering area and the covered region.

公开(公告)号：US20160233200A1

公开(公告)日：2016-08-11

申请号：US15025759

申请日：2014-10-15

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Pindl ,  Simon Jerebic ,  Tobias Geltl

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/50 ,  H01L33/60 ,  H01L21/66 ,  H01L33/54

Abstract: A method for producing an optoelectronic component is disclosed. In various embodiments, the method includes arranging a plurality of optoelectronic semiconductor chips on a carrier and commonly compressing separate molding compounds in areas of the optoelectronic semiconductor chips, wherein separate molded bodies are formed in the areas of the optoelectronic semiconductor chips.

Abstract translation: 公开了一种用于制造光电子部件的方法。 在各种实施例中，该方法包括在载体上布置多个光电子半导体芯片，并且通常在光电子半导体芯片的区域中压缩单独的模制化合物，其中在光电子半导体芯片的区域中形成分开的模制体。