摘要:
A simplified manufacturing process and the resultant bifacial solar cell (BSC) are provided, the simplified manufacturing process reducing manufacturing costs. The BSC includes an active region located on the front surface of the substrate, formed for example by a phosphorous diffusion step. The back surface includes a doped region, the doped region having the same conductivity as the substrate but with a higher doping level. Contact grids are formed, for example by screen printing. Front junction isolation is accomplished using a laser scribe.
摘要:
The present invention relates to methods and apparatuses for providing a buried insulator isolation for solar cell contacts. According to certain aspects, the invention places a buried oxide under the emitter of a polysilicon emitter solar cell. The oxide provides an excellent passivation layer over most of the surface. Holes in the oxide provide contact areas, increasing the current density to enhance efficiency. The oxide isolates the contacts from the substrate, achieving the advantage of a selective emitter structure without requiring deep diffusions. The oxide further enables use of screen printing on advanced shallow emitter cells. Positioning of the grid lines close to the openings also enables use of a very thin emitter to maximize blue response.
摘要:
A method for forming front contacts on a silicon solar cell which includes texture etching the front surface of the solar cell, forming an antireflective layer over the face, diffusing a doping material into the face to form a heavily doped region in valleys formed during the texture-etching of the face, depositing an electrically conductive material on the heavily doped regions in the valleys and annealing the solar cell.
摘要:
Processing steps that are useful for forming interconnects in a photovoltaic module are described herein. According to one aspect, a method according to the invention includes processing steps that are similar to those performed in conventional integrated circuit fabrication. For example, the method can include etches to form a conductive step adjacent to the grooves that can be used to form interconnects between cells. According to another aspect the method for forming the conductive step can be self-aligned, such as by positioning a mirror above the module and exposing photoresist from underneath the substrate at an angle one or more times, and etching to expose the conductive step.
摘要:
Processing steps that are useful for forming interconnects in a photovoltaic module are described herein. According to one aspect, a method according to the invention includes processing steps that are similar to those performed in conventional integrated circuit fabrication. For example, the method can include etches to form a conductive step adjacent to the grooves that can be used to form interconnects between cells. According to another aspect the method for forming the conductive step can be self-aligned, such as by positioning a mirror above the module and exposing photoresist from underneath the substrate at an angle one or more times, and etching to expose the conductive step.
摘要:
Effect of tilt angle, at which ions are implanted into a semiconductor layer of a wafer, is evaluated by measuring reflectance of a region which has implanted ions in first areas that are interdigitated with a corresponding number of second areas lacking the implanted ions (or having the same specie ions in a background concentration). The second areas are protected during ion implantation either by being covered up or by being in shadows, of bars located over the semiconductor layer. Due to a shadow cast by a bar, only a portion of each opening between two adjacent bars is implanted with ions to form each first area, depending on the tilt angle. Hence, tilt angle is determined e.g. from a bar's shadow's width and the bar's thickness. The bar's shadow's width in turn is determined from the width of an opening and the width of an implanted first area.
摘要:
A patterned dielectric layer is evaluated by measuring reflectance of a region which has openings. A heating beam may be chosen for having reflectance from an underlying conductive layer that is several times greater than absorptance, to provide a heightened sensitivity to presence of residue and/or changes in dimension of the openings. Reflectance may be measured by illuminating the region with a heating beam modulated at a preset frequency, and measuring power of a probe beam that reflects from the region at the preset frequency. Openings of many embodiments have sub-wavelength dimensions (i.e. smaller than the wavelength of the heating beam). The underlying conductive layer may be patterned into links of length smaller than the diameter of heating beam, so that the links float to a temperature higher than a corresponding temperature attained by a continuous trace that transfers heat away from the illuminated region by conduction.
摘要:
A method of fabricating a wafer includes forming a portion of the wafer, making a first measurement in the wafer using a first process, making a second measurement in the wafer using a second process each time the first measurement is made, using one of the first measurement and the second measurement to calibrate the other of the first measurement and the second measurement, and changing a process control parameter used in forming the portion of the wafer depending on the first measurement and on the second measurement.
摘要:
A sidewall or other feature in a semiconductor wafer is evaluated by illuminating the wafer with at least one beam of electromagnetic radiation, and measuring intensity of a portion of the beam reflected by the wafer. Change in reflectance between measurements provides a measure of a property of the feature. The change may be either a decrease in reflectance or an increase in reflectance, depending on the embodiment. A single beam may be used if it is polarized in a direction substantially perpendicular to a longitudinal direction of the sidewall. A portion of the energy of the beam is absorbed by the sidewall, thereby to cause a decrease in reflectance when compared to reflectance by a flat region. Alternatively, two beams may be used, of which a first beam applies heat to the feature itself or to a region adjacent to the feature, and a second beam is used to measure an increase in reflectance caused by an elevation in temperature due to heat transfer through the feature. The elevation in temperature that is measured can be either of the feature itself, or of a region adjacent to the feature.
摘要:
An apparatus for monitoring particle fallout incorporates a particle flux monitor and a tubular structure. The tubular structure is positioned over an aperture in the housing of the monitor to provide a still air condition so that the particles that descend to the monitor and pass through the light net of the monitor are precluded from being carried back to the light net, which would result in an erroneous count.