Spin-polarization of carriers in semiconductor materials for spin-based microelectronic devices
    35.
    发明授权
    Spin-polarization of carriers in semiconductor materials for spin-based microelectronic devices 有权
    用于自旋基微电子器件的半导体材料中载流子的自旋极化

    公开(公告)号:US06956269B1

    公开(公告)日:2005-10-18

    申请号:US10744252

    申请日:2003-12-22

    CPC classification number: H01L29/66984

    Abstract: Spin-based microelectronic devices can be realized by utilizing spin-polarized ferromagnetic materials positioned near, or embedded in, a semiconductor channel of a microelectronic device. Applying an electric field across the channel can cause carriers flowing through the channel to deviate toward one of the ferromagnetic materials, such that the spin of the carriers tends to align with the spin polarization of the respective material. Such a process allows for the controlled spin-polarization of carriers in a semiconductor channel, and hence the development of spin-based microelectronics, without having to inject spin-polarized carriers from a ferromagnet into a semiconductor channel. Such a process avoids the Schottky barrier problem plaguing existing approaches to spin-based microelectronics, while allowing the devices to be based on silicon substrates that are well-known and used in the industry.

    Abstract translation: 旋转微电子器件可以通过利用位于微电子器件的半导体通道附近或嵌入其中的自旋极化铁磁材料来实现。 通过通道施加电场可以使流过通道的载流子偏向铁磁材料之一,使得载流子的自旋倾向于与相应材料的自旋极化对准。 这种方法允许半导体通道中载流子的受控自旋极化,从而允许自旋基微电子学的发展,而不必将自旋极化载流子从铁磁体注入到半导体通道中。 这种过程避免了肖特基势垒问题困扰着现有的基于旋转微电子学的方法,同时允许器件基于业界众所周知和使用的硅衬底。

    High holding voltage LVTSCR
    39.
    发明授权
    High holding voltage LVTSCR 有权
    高保持电压LVTSCR

    公开(公告)号:US06822294B1

    公开(公告)日:2004-11-23

    申请号:US09896681

    申请日:2001-06-29

    CPC classification number: H01L27/0262 H01L29/87

    Abstract: In an ESD protection device using a LVTSCR-like structure, the holding voltage is increased by placing the p+ emitter outside the drain of the device, thereby retarding the injection of holes from the p+ emitter. The p+ emitter may be implemented in one or more emitter regions formed outside the drain. The drain is split between a n+ drain and a floating n+ region near the gate to avoid excessive avalanche injection and resultant local overheating.

    Abstract translation: 在使用类似LVTSCR的结构的ESD保护器件中,通过将p +发射极放置在器件的漏极之外,从而延长了p +发射极的空穴注入,从而提高了保持电压。 p +发射极可以在形成在漏极外部的一个或多个发射极区域中实现。 漏极在栅极附近的n +漏极和浮动n +区域之间分开,以避免过度的雪崩注入和局部过热。

    Memory cell with a capacitive structure as a control gate and method of forming the memory cell
    40.
    发明授权
    Memory cell with a capacitive structure as a control gate and method of forming the memory cell 有权
    具有电容结构的存储单元作为控制栅极和形成存储单元的方法

    公开(公告)号:US06806529B1

    公开(公告)日:2004-10-19

    申请号:US10356422

    申请日:2003-01-30

    CPC classification number: H01L29/66825 H01L21/28273 H01L29/42324

    Abstract: In an electrically programmable non-volatile memory cell, the first terminal of a high density capacitive structure is electrically connected to a conductive structure to form a floating gate/first electrode, while the second terminal of the capacitive structure is used as a control gate, providing a cell with a high overall capacitive coupling ratio, a relatively small area, and a high voltage tolerance.

    Abstract translation: 在电可编程非易失性存储单元中,高密度电容结构的第一端子电连接到导电结构以形成浮置栅极/第一电极,而电容结构的第二端子用作控制栅极, 提供具有高总体电容耦合比,相对小的面积和高电压容限的电池。

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