公开(公告)号：US09472692B2

公开(公告)日：2016-10-18

申请号：US14834923

申请日：2015-08-25

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Marika Sorrieul ,  Karine Saxod

IPC: H01L27/00 ,  H01L31/0203 ,  H01L27/146 ,  H01L31/18 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L31/0203 ,  H01L23/3121 ,  H01L23/3135 ,  H01L24/16 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14618 ,  H01L31/186 ,  H01L31/1876 ,  H01L2224/16225 ,  H01L2224/29011 ,  H01L2224/48091 ,  H01L2224/48235 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/1815 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An integrated circuit chip is mounted on top of a base wafer, and a protection wafer is mounted on top of the integrated circuit chip. An encapsulation block is formed around the integrated circuit chip and the protection wafer and on a peripheral part of the front face of the base wafer. The encapsulation block includes a first encapsulation ring arranged around the integrated circuit chip and the protection wafer, having an annular beading protruding with respect to the front face of the protection wafer and forming a peripheral groove (24) recessed with respect to this protruding annular beading. A second encapsulation ring of the encapsulation block fills the peripheral groove of the first encapsulation ring.

Abstract translation: 集成电路芯片安装在基底晶片的顶部，保护晶片安装在集成电路芯片的顶部。 封装块形成在集成电路芯片和保护晶片周围以及基底晶片正面的周边部分周围。 封装块包括布置在集成电路芯片和保护晶片周围的第一封装环，其具有相对于保护晶片的前表面突出的环形凸缘，并且形成相对于该突出的环形珠形凹陷的周边凹槽（24） 。 封装块的第二封装环填充第一封装环的外围沟槽。

公开(公告)号：US20160148879A1

公开(公告)日：2016-05-26

申请号：US14821902

申请日：2015-08-10

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine Saxod ,  Marika Sorrieul

IPC: H01L23/00 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L23/562 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/315 ,  H01L23/3171 ,  H01L24/17 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14683 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/1876 ,  H01L2224/1329 ,  H01L2224/13291 ,  H01L2224/14179 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/30135 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/81862 ,  H01L2224/81874 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: A method for fabricating an electronic device, and an electronic device in a stacked configuration, includes a rear face of an integrated-circuit chip that is fixed to a front face of a support wafer. A protective wafer is located facing and at a distance from the front face of the chip, and an infused adhesive is interposed between the chip and the protective wafer and located on a zone of the front face of the chip outside a central region of this front face. The infused adhesive includes a curable adhesive and solid spacer elements infused in the curable adhesive. An obstruction barrier is arranged between the chip and the protective wafer and is disposed outside the central region of the front face of the chip. An encapsulation ring surrounds the chip, the protective wafer and the obstruction barrier.

Abstract translation: 一种电子器件的制造方法和层叠结构的电子器件，其特征在于，包括固定在支撑晶片前面的集成电路芯片的背面。 保护晶片位于与芯片前表面相对并且距离芯片的前面一定距离处，并且输入的粘合剂被插入在芯片和保护晶片之间，并且位于该芯片的正面的中心区域外的区域 面对。 输注的粘合剂包括注入可固化粘合剂中的可固化粘合剂和固体间隔元件。 在芯片和保护晶片之间设置障碍屏障，并且设置在芯片前表面的中心区域的外侧。 封装环围绕芯片，保护晶片和阻塞屏障。

公开(公告)号：US09101077B2

公开(公告)日：2015-08-04

申请号：US13722282

申请日：2012-12-20

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Jean-Michel Riviere ,  Karine Saxod

IPC: H05K7/20 ,  H01L23/34 ,  G01F1/20 ,  G06F1/20

CPC classification number: H05K7/20 ,  G01F1/20 ,  H01L23/34 ,  H01L23/4334 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H05K1/0209 ,  H05K3/284 ,  H05K7/20436 ,  H05K2201/10378 ,  H05K2201/10734 ,  H05K2203/1316 ,  H01L2924/00

Abstract: An electronic component package includes a support and heat conductor. The heat conductor has a protuberance and the support has a socket arranged to be able to receive the protuberance so that the movement of heat conductor relative to the support during the assembly process is reduced.

Abstract translation: 电子部件封装包括支撑件和导热体。 热导体具有突起，并且支撑件具有布置成能够容纳突起的插座，使得在组装过程期间热导体相对于支撑件的移动减小。

公开(公告)号：US20150036309A1

公开(公告)日：2015-02-05

申请号：US14444583

申请日：2014-07-28

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Jean-Michel Riviere ,  Karine Saxod

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/30

CPC classification number: H05K1/0271 ,  H01L23/49844 ,  H01L23/562 ,  H01L24/16 ,  H01L2224/131 ,  H01L2224/16111 ,  H01L2224/16237 ,  H05K1/181 ,  H05K3/28 ,  H05K3/30 ,  H05K2201/0275 ,  H05K2201/09909 ,  H05K2201/10007 ,  H05K2201/2009 ,  Y10T29/4913 ,  H01L2924/014

Abstract: A substrate board includes an electrical connection network on a face thereof. An integrated-circuit chip is mounted to the face of the substrate board in electrical contact with the electrical connection network. A local reinforcing or balancing layer made of a non-metallic material is mounted to the face of the substrate board in at least one local zone free of the face which is free of metal portions of the electrical connection network.

Abstract translation: 基板包括在其表面上的电连接网络。 集成电路芯片安装到与电连接网络电接触的基板的表面。 由非金属材料制成的局部增强或平衡层在至少一个不具有电连接网络的金属部分的表面的局部区域中安装到基板的表面上。