POLYCARBONATE POLYOL COMPOSITIONS AND METHODS
    31.
    发明申请
    POLYCARBONATE POLYOL COMPOSITIONS AND METHODS 有权
    聚碳酸酯多元醇组合物和方法

    公开(公告)号:US20110230580A1

    公开(公告)日:2011-09-22

    申请号:US12994544

    申请日:2009-09-08

    摘要: In one aspect, the present disclosure encompasses polymerization systems for the copolymerization of CO2 and epoxides comprising 1) a catalyst including a metal coordination compound having a permanent ligand set and at least one ligand that is a polymerization initiator, and 2) a chain transfer agent having two or more sites that can initiate polymerization. In a second aspect, the present disclosure encompasses methods for the synthesis of polycarbonate polyols using the inventive polymerization systems. In a third aspect, the present disclosure encompasses polycarbonate polyol compositions characterized in that the polymer chains have a high percentage of —OH end groups and a high percentage of carbonate linkages. The compositions are further characterized in that they contain polymer chains having an embedded polyfunctional moiety linked to a plurality of individual polycarbonate chains.

    摘要翻译: 一方面,本公开内容涵盖用于CO 2和环氧化物共聚的聚合体系,其包括1)包含具有永久性配体组的金属配位化合物和至少一种作为聚合引发剂的配体的催化剂,和2)链转移剂 具有两个或更多个可引发聚合的位点。 在第二方面,本发明包括使用本发明聚合体系合成聚碳酸酯多元醇的方法。 在第三方面,本公开内容包括聚碳酸酯多元醇组合物,其特征在于聚合物链具有高百分比的-OH端基和高百分比的碳酸酯键。 组合物的特征还在于它们含有聚合物链,其具有与多个单独的聚碳酸酯链连接的嵌入的多官能部分。

    Etch process for improving yield of dielectric contacts on nickel silicides
    38.
    发明授权
    Etch process for improving yield of dielectric contacts on nickel silicides 有权
    用于提高硅化镍电介质触点产量的蚀刻工艺

    公开(公告)号:US07354867B2

    公开(公告)日:2008-04-08

    申请号:US10906112

    申请日:2005-02-03

    IPC分类号: H01L21/44 H01L21/461

    CPC分类号: H01L21/76802 H01L21/31116

    摘要: The embodiments of the invention generally relate to an etching process, and more particularly to an etch processing for improving the yield of dielectric contacts on nickel silicides. An oxygen-free feedgas is used in an etching process to reduce or eliminate residuals, including oxidation and consumption of the silicide layer, at the contact surface. The contact resistance at contact surface is reduced, thereby improving the performance of the device.

    摘要翻译: 本发明的实施例通常涉及蚀刻工艺,更具体地涉及用于提高硅化镍上的电介质触点的产量的蚀刻处理。 在蚀刻过程中使用无氧原料气,以减少或消除在接触表面处的残余物,包括硅化物层的氧化和消耗。 接触表面的接触电阻降低,从而提高器件的性能。