Abstract:
Disclosed herein is a plate-shaped secondary battery constructed in a structure in which an electrode assembly of a cathode/separator/anode structure is mounted in a battery case, and the battery case is sealed by thermal welding, wherein the secondary battery has at least one valve (one-way exhaust valve), having a small thickness, mounted at a sealed portion, formed at the outer circumference of an electrode assembly receiving part of the battery case, for allowing internal high-pressure gas to be exhausted out of a battery cell and preventing external gas from being introduced into the battery cell. The secondary battery according to the present invention has the effect of effectively exhausting internal high-pressure gas generated during the abnormal operation of the battery, such as overcharge, out of the battery case, while maintaining the sealability of the battery case, thereby simultaneously improving the efficiency and safety of the battery.
Abstract:
Disclosed herein is a secondary battery including an electrode assembly of a cathode/separator/anode structure mounted in a pouch-shaped battery case in a sealed state, wherein a residue portion, which is not sealed (non-sealing residue portion), is defined between a sealing portion of the battery case and the electrode assembly for collecting generated gas, and the non-sealing residue portion is formed by mounting the electrode assembly between upper and lower laminate sheets, at least one of which has a receiving part of a size approximately corresponding to the electrode assembly, sealing three sides of the upper and lower laminate sheets, including two sides where electrode terminals are disposed, among four sides of the upper and lower laminate sheets, injecting an electrolyte in the battery case through the non-sealing portion, and sealing the non-sealing portion such that the resultant sealing portion is spaced a predetermined width from the receiving part.
Abstract:
A bonding pad having an anti-pad peeling-off structure is disclosed. In a method of forming the bonding pad, after a metal pad layer is formed, a slit is formed in the metal pad layer. A protecting layer is formed on the metal pad layer. The protecting layer is partially removed to expose the metal pad such that a portion of the protecting layer remains in the slits to be connected to the main protecting layer. The protecting layer formed in the slit is connected to the protecting layer such that the residual protecting layer pattern buffer when physical impacts are generated, to prevent peeling-off of the metal pad layer.
Abstract:
a nonvolatile memory device Includes an active region defined in a semiconductor substrate and a control gate electrode crossing over the active region. A gate insulating layer is interposed between the control gate electrode and the active reigon. A floating gate is formed in the active region to penetrate the control gate electrode and extend to a predetermined depth into the semiconductor substrate. A tunnel insulating layer is successively interposed between the control gate electrode and the floating gate, and between the semiconductor substrate and the floating gate. The floating gate may be formed after a trench is formed by sequentially etching a control gate conductive layer and the semiconductor substrate, and a tunnel insulating layer is formed on the trench and sidewalls of the control gate conductive layer. The floating gate is formed in the trench to extend into a predetermined depth into the semiconductor substrate.
Abstract:
In a non-volatile memory device and methods of forming and operating the same, one memory transistor includes sidewall selection gates covering both sidewalls of a floating gate when the floating gate and a control gate are stacked. The sidewall selection gates are in a spacer form. Since the sidewall selection gates are in a spacer form on the sidewall of the floating gate, the degree of integration of cells can be improved. Additionally, since the side wall selection gates are disposed on both sidewalls of the floating gate, a voltage applied from a bit line and a common source line can be controlled and thus conventional writing/erasing errors can be prevented. Therefore, distribution of threshold voltage can be improved.
Abstract:
A nonvolatile semiconductor device and a method of fabricating the same are provided. The nonvolatile semiconductor device includes a semiconductor body formed on a substrate to be elongated in one direction and having a cross section perpendicular to a main surface of the substrate and elongated direction, the cross section having a predetermined curvature, a channel region partially formed along the circumference of the semiconductor body, a tunneling insulating layer disposed on the channel region, a floating gate disposed on the tunneling insulating layer and electrically insulated from the channel region, an intergate insulating layer disposed on the floating gate, a control gate disposed on the intergate insulating layer and electrically insulated from the floating gate, and source and drain regions which are aligned with both sides of the control gate and formed within the semiconductor body.
Abstract:
A mask read only memory (ROM) device includes a plurality of isolation patterns disposed at predetermined regions of a semiconductor substrate to define a plurality of active regions. The semiconductor substrate includes a mask ROM region where a plurality of on cells and a plurality of off-cells are disposed. The mask ROM further includes a plurality of gate lines disposed over the active regions, and which cross over the isolation patterns, a plurality of gate insulating layers interposed between the gate lines and the active regions and a floating conductive pattern and a inter-gate dielectric pattern located between the gate line and the gate insulating layer of the off-cell.
Abstract:
A silicon-oxide-nitride-oxide-silicon (SONOS) memory cell and a method of forming the same are disclosed. The SONOS memory cell includes a substrate in which a recessed region having at least one side wall is arranged and a trap storage pattern with which the recessed region is filled with a first insulating film is interposed. A control gate electrode is arranged on the top surface of the substrate and the top surface of the trap storage pattern with a second insulating film interposed. First and second source/drain regions are arranged in the substrate on both sides of the control gate electrode. The top surface of the trap storage pattern is flat and is at least as high as the top surface of the substrate.