公开(公告)号：US08962754B2

公开(公告)日：2015-02-24

申请号：US14116660

申请日：2012-05-08

Applicant: Hiroshi Haruna ,  Shingo Itoh

Inventor： Hiroshi Haruna ,  Shingo Itoh

IPC: H01M6/16 ,  H01M6/04 ,  C08L83/04 ,  H01M10/0567 ,  H01M10/0525 ,  H01M10/0568

CPC classification number: H01M10/0567 ,  H01M10/0525 ,  H01M10/0568 ,  Y02E60/122

Abstract: A nonaqueous electrolyte and a lithium ion battery with reduced temporal variations in battery characteristics from initial values are provided. A mixed solution is prepared by dissolving a lithium salt such as LiPF6 in a nonaqueous solvent such as ethylene carbonate. Allylboronate ester and siloxane are mixed with the mixed solution. The content of the allylboronate ester is 1 wt % or less. The content of the siloxane is 2 wt % or less. 2-Allyl-4,4,5,5-tetramethyl-1,3,2-dioxaborolane is used as the allylboronate ester. At least one kind selected from hexamethyldisiloxane and 1,3-divinyltetramethyldisiloxane is used as the siloxane.

Abstract translation: 提供了一种从初始值减小电池特性的时间变化的非水电解质和锂离子电池。 通过将LiPF 6等锂盐溶解在碳酸亚乙酯等非水溶剂中来制备混合溶液。 将烯丙基硼酸酯和硅氧烷与混合溶液混合。 烯丙基硼酸酯的含量为1重量％以下。 硅氧烷的含量为2重量％以下。 使用2-烯丙基-4,4,5,5-四甲基-1,3,2-二氧杂硼杂环戊烷作为烯丙基硼酸酯。 使用选自六甲基二硅氧烷和1,3-二乙烯基四甲基二硅氧烷的至少一种作为硅氧烷。

公开(公告)号：US20140079987A1

公开(公告)日：2014-03-20

申请号：US14116660

申请日：2012-05-08

Applicant: Hiroshi Haruna ,  Shingo Itoh

Inventor： Hiroshi Haruna ,  Shingo Itoh

IPC: H01M10/0567 ,  H01M10/0525

CPC classification number: H01M10/0567 ,  H01M10/0525 ,  H01M10/0568 ,  Y02E60/122

Abstract: A nonaqueous electrolyte and a lithium ion battery with reduced temporal variations in battery characteristics from initial values are provided. A mixed solution is prepared by dissolving a lithium salt such as LiPF6 in a nonaqueous solvent such as ethylene carbonate. Allylboronate ester and siloxane are mixed with the mixed solution. The content of the allylboronate ester is 1 wt % or less. The content of the siloxane is 2 wt % or less. 2-Allyl-4,4,5,5-tetramethyl-1,3,2-dioxaborolane is used as the allylboronate ester. At least one kind selected from hexamethyldisiloxane and 1,3-divinyltetramethyldisiloxane is used as the siloxane.

Abstract translation: 提供了一种从初始值减小电池特性的时间变化的非水电解质和锂离子电池。 通过将LiPF 6等锂盐溶解在碳酸亚乙酯等非水溶剂中来制备混合溶液。 将烯丙基硼酸酯和硅氧烷与混合溶液混合。 烯丙基硼酸酯的含量为1重量％以下。 硅氧烷的含量为2重量％以下。 使用2-烯丙基-4,4,5,5-四甲基-1,3,2-二氧杂硼杂环戊烷作为烯丙基硼酸酯。 使用选自六甲基二硅氧烷和1,3-二乙烯基四甲基二硅氧烷的至少一种作为硅氧烷。

公开(公告)号：US20120292774A1

公开(公告)日：2012-11-22

申请号：US13519226

申请日：2011-01-20

Applicant: Shingo Itoh

Inventor： Shingo Itoh

IPC: H01L23/49

CPC classification number: H01L21/56 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49503 ,  H01L24/05 ,  H01L24/09 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05144 ,  H01L2224/05164 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/43 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/48844 ,  H01L2224/48864 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01059 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01105 ,  H01L2924/01201 ,  H01L2924/01202 ,  H01L2924/01204 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/00 ,  H01L2224/48824 ,  H01L2924/00012 ,  H01L2924/013 ,  H01L2924/0002 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2224/43848 ,  H01L2924/20751

Abstract: A semiconductor device of the present invention includes a semiconductor element having an electrode pad; a substrate over which the semiconductor element is mounted and has an electrical bonding part; and a bonding wire electrically connecting the electrode pad to the electrical bonding part, wherein a main metal component of the electrode pad is the same or different from a main metal component of the bonding wire, and when the main metal component of the electrode pad is different from the main metal components of the bonding wire, a rate of interdiffusion of the main metal components of the bonding wire and the electrode pad at a junction of the bonding wire and the electrode pad under a post-curing temperature of an encapsulating resin is lower than that of interdiffusion of gold (Au) and aluminum (Al) at a junction of aluminum (Al) and gold (Au) under the post-curing temperature.

Abstract translation: 本发明的半导体器件包括具有电极焊盘的半导体元件; 半导体元件安装在其上并具有电接合部的基板; 以及将电极焊盘电连接到电接合部分的接合线，其中电极焊盘的主金属部件与接合线的主金属部件相同或不同，并且当电极焊盘的主金属部件为 与接合线的主要金属成分不同，在封装树脂的后固化温度下，接合线和电极焊盘的接合处的接合线和电极焊盘的主金属成分的相互扩散率为 低于后固化温度下铝（Al）和金（Au）的接合处的金（Au）和铝（Al）的相互扩散。

公开(公告)号：US20120168927A1

公开(公告)日：2012-07-05

申请号：US13394642

申请日：2010-08-27

Applicant: Shingo Itoh

Inventor： Shingo Itoh

IPC: H01L23/495

CPC classification number: H01L23/49575 ,  H01L23/295 ,  H01L23/3107 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/43 ,  H01L2224/4321 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45664 ,  H01L2224/45698 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2224/85186 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01105 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/01056 ,  H01L2924/0102 ,  H01L2924/01038 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01204 ,  H01L2924/01006 ,  H01L2924/0002 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01205

Abstract: A semiconductor device is configured that two or more semiconductor elements are stacked and mount on a lead frame, the aforementioned lead frame is electrically joined to the semiconductor element with a wire, and the semiconductor element, the wire and an electric junction are encapsulated with a cured product of an epoxy resin composition for encapsulating semiconductor device, and that the epoxy resin composition for encapsulating semiconductor device contains (A) an epoxy resin; (B) a curing agent; and (C) an inorganic filler, and that the (C) inorganic filler contains particles having particle diameter of equal to or smaller than two-thirds of a thinnest filled thickness at a rate of equal to or higher than 99.9% by mass.

Abstract translation: 半导体器件被构造成将两个或更多个半导体元件堆叠并安装在引线框架上，上述引线框架用导线与半导体元件电连接，并且半导体元件，导线和电连接被封装在 用于封装半导体器件的环氧树脂组合物的固化产物，并且用于封装半导体器件的环氧树脂组合物包含（A）环氧树脂; （B）固化剂; 和（C）无机填料，并且（C）无机填料以等于或高于99.9质量％的速率含有粒径等于或小于最薄填充厚度的三分之二的颗粒。

公开(公告)号：US07906378B2

公开(公告)日：2011-03-15

申请号：US11905968

申请日：2007-10-05

Applicant: Shingo Itoh

Inventor： Shingo Itoh

IPC: H01L21/00

CPC classification number: H01L23/295 ,  C08K5/523 ,  C08K5/5435 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An epoxy resin composition for encapsulating a semiconductor element and a semiconductor device manufactured using the epoxy resin composition are provided. The epoxy resin composition includes epoxy resin, a curing agent, at least one kind of an inorganic filler selected from the group consisting of silicates such as talc and calcined clay, oxides such as silica and fused silica, and hydroxides such as aluminum hydroxide and magnesium hydroxide, and a pH buffer agent having a pH buffer area of pH 4 to 8. Further, the semiconductor device is manufactured by encapsulating at least one semiconductor element with a cured product of the above epoxy resin composition. Such a semiconductor device can have excellent moisture resistance.

Abstract translation: 提供一种用于封装半导体元件的环氧树脂组合物和使用该环氧树脂组合物制造的半导体器件。 环氧树脂组合物包括环氧树脂，固化剂，至少一种选自硅酸盐如滑石粉和煅烧粘土的无机填料，氧化物如二氧化硅和熔融二氧化硅，以及氢氧化物如氢氧化铝和镁 氢氧化物和pH缓冲区域为pH4〜8的pH缓冲剂。此外，半导体器件通过将至少一种半导体元件与上述环氧树脂组合物的固化物封装而制造。 这种半导体器件可以具有优异的耐湿性。

公开(公告)号：US20080085969A1

公开(公告)日：2008-04-10

申请号：US11905968

申请日：2007-10-05

Applicant: Shingo Itoh

Inventor： Shingo Itoh

IPC: C08K3/34 ,  C08L63/02

CPC classification number: H01L23/295 ,  C08K5/523 ,  C08K5/5435 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An epoxy resin composition for encapsulating a semiconductor element and a semiconductor device manufactured using the epoxy resin composition are provided. The epoxy resin composition includes epoxy resin, a curing agent, at least one kind of an inorganic filler selected from the group consisting of silicates such as talc and calcined clay, oxides such as silica and fused silica, and hydroxides such as aluminum hydroxide and magnesium hydroxide, and a pH buffer agent having a pH buffer area of pH 4 to 8. Further, the semiconductor device is manufactured by encapsulating at least one semiconductor element with a cured product of the above epoxy resin composition. Such a semiconductor device can have excellent moisture resistance.

Abstract translation: 提供一种用于封装半导体元件的环氧树脂组合物和使用该环氧树脂组合物制造的半导体器件。 环氧树脂组合物包括环氧树脂，固化剂，至少一种选自硅酸盐如滑石粉和煅烧粘土的无机填料，氧化物如二氧化硅和熔融二氧化硅，以及氢氧化物如氢氧化铝和镁 氢氧化物和pH缓冲区域为pH4〜8的pH缓冲剂。此外，半导体器件通过将至少一种半导体元件与上述环氧树脂组合物的固化物封装而制造。 这种半导体器件可以具有优异的耐湿性。

公开(公告)号：US06323962B1

公开(公告)日：2001-11-27

申请号：US08780330

申请日：1997-01-08

Applicant: Shingo Itoh ,  Fumihiro Minamizawa ,  Yuji Asano

Inventor： Shingo Itoh ,  Fumihiro Minamizawa ,  Yuji Asano

IPC: H04N132

CPC classification number: H04N1/32026 ,  H04N1/00204 ,  H04N1/32005 ,  H04N1/32379 ,  H04N1/324 ,  H04N1/32704 ,  H04N1/32708 ,  H04N1/32719 ,  H04N2201/0015 ,  H04N2201/007

Abstract: A facsimile machine including a first facsimile-data transmitter including a first connector connectable to an external computer via a first communication line, and a second connector connectable to a second facsimile-data transmitter via a second communication line, the first facsimile-data transmitter transmitting, to the external computer via the first communication line, facsimile data transmitted from the second facsimile-data transmitter via the second communication line, the machine also including a facsimile-data receiver, and a control device which controls the first facsimile-data transmitter not to transmit the facsimile data to the external computer, and controls the facsimile-data receiver to receive the facsimile data, in place of the external computer.

Abstract translation: 一种传真机，包括第一传真数据发射机，包括经由第一通信线路可连接到外部计算机的第一连接器，以及经由第二通信线路连接到第二传真数据发射机的第二连接器，所述第一传真数据发射机发送 经由第一通信线路向外部计算机传送经由第二通信线从第二传真数据发送器发送的传真数据，该机器还包括传真数据接收器，以及控制设备，其控制第一传真数据发送器 将传真数据发送到外部计算机，并且控制传真数据接收器来代替外部计算机来接收传真数据。

公开(公告)号：US5841838A

公开(公告)日：1998-11-24

申请号：US559114

申请日：1995-11-16

Applicant: Shingo Itoh ,  Junji Hatamura

Inventor： Shingo Itoh ,  Junji Hatamura

IPC: H04M1/57 ,  H04M1/65 ,  H04M1/64

CPC classification number: H04M1/6505 ,  H04M1/575

Abstract: In a versatile telephone unit subjected to a caller's telephone number reception service wherein at least a caller's telephone number is transmitted to a telephone unit prom a switchboard via a telephone line, the telephone unit has a caller's telephone number displaying feature allowing the user to know who telephoned while the user is absent or away from the telephone. When a call signal from a remote telephone is detected a predetermined number of times, the caller's telephone number transmitted with the call signal from the switchboard is stored in a memory. When the telephone is in an automatic answering mode, the caller's telephone number is stored in the memory along with incoming message. The caller's telephone number stored in the memory can be displayed on a display while reproducing the incoming message if any. A determination of whether an incoming message contains voice is performed and if no voice is determined to be recorded then the incoming message is erased from memory and the device indicates the associated telephone number has no voice recording.

Abstract translation: 在经过呼叫者的电话号码接收服务的多功能电话单元中，至少有一个呼叫者的电话号码经由电话线路传送给电话单元前往交换机，电话单元具有呼叫者的电话号码显示功能，允许用户知道谁 当用户不在电话或离开电话时打电话。 当来自远程电话的呼叫信号被检测到预定次数时，用来自总机的呼叫信号发送的呼叫者的电话号码被存储在存储器中。 当电话处于自动应答模式时，呼叫者的电话号码与传入消息一起存储在存储器中。 存储在存储器中的呼叫者的电话号码可以在再现传入消息（如果有的话）的同时显示在显示器上。 执行进入消息是否包含语音的确定，并且如果没有确定要录制的语音，则从存储器擦除输入消息，并且设备指示相关联的电话号码没有语音记录。

公开(公告)号：US5521716A

公开(公告)日：1996-05-28

申请号：US426013

申请日：1995-04-20

Applicant: Shingo Itoh

Inventor： Shingo Itoh

IPC: H04N1/00 ,  H04M1/65 ,  H04N1/21 ,  H04N1/32

CPC classification number: H04M1/6505 ,  H04N1/32363

Abstract: A data storage device for a facsimile machine, or similar device, is provided with a voice/image memory. The voice/image memory is so designed to store voice digital data and image digital data. By manipulation of a record key and a play key which are provided on an operation panel and serve as an erase key and a cursor key, erasure of the voice digital data, erasure of the image digital data and erasure of both of the voice and image digital data can be selectively realized.

Abstract translation: 用于传真机或类似设备的数据存储设备设置有语音/图像存储器。 语音/图像存储器被设计为存储语音数字数据和图像数字数据。 通过操作设置在操作面板上并用作擦除键和光标键的记录键和播放键，擦除语音数字数据，擦除图像数字数据并擦除语音和图像两者 可以选择性地实现数字数据。