摘要:
An unsymmetrical MOS device is disclosed which includes a semiconductor layer of a first conductive type having a surface having a first area and a second area which is offset from the first area; a gate insulator layer located on the first area of the surface of the semiconductor layer; a gate electrode located on the gate insulator layer; and a source region of a second conductive type and a drain region of the second conductive type each located in the semiconductor layer below the second area of the surface. The electric resistance of an area between the first area of the surface and the surface of the source region is smaller than the electric resistance of an area between the first area of the surface and the surface of the drain region.
摘要:
A pattern inspection apparatus includes a magnification conversion unit to convert first sample optical image data to higher resolution second sample optical image data, a low-pass filter configured to filter first design image data which has a resolution N times that of the first sample optical image data, an optical filter which calculates third design image data by convolving the second design image data with an optical model function, a coefficient acquisition unit configured to acquire a coefficient of the predetermined optical model function using the second sample optical image data and the third design image data, an optical image acquisition unit configured to acquire actual optical image data of an inspection target workpiece, a reference image data generation unit configured to generate reference image data corresponding to the actual optical image data, and a comparison unit configured to compare the actual optical image data with the reference image data.
摘要:
A data searching unit 12 of a data searching apparatus 10 Obtains, according to a searching request including a search condition specified by a data searching application 16, metadata which satisfy the search condition from a data storage unit 11, and instructs an external communication unit 15 to request searching of data to a data providing apparatus 20 with the same search condition.
摘要:
A pattern inspection apparatus uses a die-to-database comparison method which compares detected pattern data obtained from an optical image of a pattern of a plate to be inspected with first reference pattern data obtained from designed pattern data in combination with a die-to-die comparison method which compares the detected pattern data with second reference pattern data obtained by detecting an area to be a basis for repetition. A computer detects presence of a plurality of repeated pattern areas from layout information contained in the designed pattern data, reads the arrangement, the number, the dimension and the repeated pitch of the repeated pattern areas, and automatically fetches an inspection area of the die-to-die comparison method.
摘要:
A CBCM circuit is capable of separately measuring each component of a measuring target capacitance. A node (N1) is electrically connected to a terminal (P2) between the drains of PMOS and NMOS transistors (MP2, MN2). As a target capacitance forming part, a coupling capacitance (Cc) is formed between the node (N1) and a node (N2). The node (N2) is connected to a pad (58) through the terminal (P2) and an NMOS transistor (MN3), and a node (N3) is connected to a terminal (P3) between the drains of PMOS and NMOS transistors (MP1, MN1). A reference capacitance (Cref) is formed at the node (N3) as a dummy capacitance. Currents (Ir, It) supplied from a power source to the nodes (N3, N1) are measured with current meters (61, 62), respectively and a current (Im) induced from the node (N2) and flowing to a ground level is measured with a current meter (63).
摘要:
In layout design of a semiconductor device including a device forming region formed on a substrate; an isolation region formed on the semiconductor substrate so as to surround the device forming region; a gate electrode formed on the device forming region; and a gate interconnect connected to the gate electrode and formed on both sides of the device forming region on the isolation region, the semiconductor device is designed as follows: The gate interconnect has a first portion with a larger dimension along the gate length direction than the gate electrode on one side of the device forming region and has a second portion with a larger dimension along the gate length direction than the gate electrode on the other side of the device forming region; and a distance between the first portion and the device forming region is equal to a distance between the second portion and the device forming region.
摘要:
An isolation which is higher in a stepwise manner than an active area of a silicon substrate is formed. On the active area, an FET including a gate oxide film, a gate electrode, a gate protection film, sidewalls and the like is formed. An insulating film is deposited on the entire top surface of the substrate, and a resist film for exposing an area stretching over the active area, a part of the isolation and the gate protection film is formed on the insulating film. There is no need to provide an alignment margin for avoiding interference with the isolation and the like to a region where a connection hole is formed. Since the isolation is higher in a stepwise manner than the active area, the isolation is prevented from being removed by over-etch in the formation of a connection hole to come in contact with a portion where an impurity concentration is low in the active area. In this manner, the integration of a semiconductor device can be improved and an area occupied by the semiconductor device can be decreased without causing degradation of junction voltage resistance and increase of a junction leakage current in the semiconductor device.
摘要:
A MOS transistor includes a gate oxide film, and a gate electrode which is formed by a lamination of first and second conductor films. A capacitive element includes a lower capacitive electrode formed of the first conductor film, a capacitive film made of an insulating film which is different from the gate oxide film, an upper capacitive electrode formed of the second conductor film on the capacitive film, and a leading electrode of the lower capacitive electrode formed of the second conductor film. At the same number of steps as in the case where the gate oxide film is used as the capacitive film, a semiconductor device can be manufactured with the capacitive film provided, the capacitive film being made of a nitride film or the like that is different from the gate oxide film. Consequently, a capacitive film having a great capacitance value per unit area is used so that the occupied area can be reduced and an increase in manufacturing cost can be controlled. In the semiconductor device in which a transistor, a capacitive element, a resistive film and the like are provided, the occupied area can be reduced and the manufacturing cost can be cut down.
摘要:
A first diffraction grating is formed on a mask, and a second diffraction grating is formed on a wafer. Two light beams having slightly different frequencies interfere with each other and are diffracted as they travel through the first diffraction grating, are reflected by the second diffraction grating, and again pass through the first diffraction grating. As a result, they change into thrice diffracted light beams. The diffracted light beams are combined into a detection light beam which has a phase shift .phi..sub.A representing the displacement between the wafer and the mask, or a phase shift .phi..sub.G representing the gap between the wafer and the mask. The detection light beam is converted into a detection signal. The phase difference between the detection signal and a reference signal having no phase shifts are calculated, thus determining phase shift .phi..sub.A or .phi..sub.G. The displacement or the gap is determined from the phase shift. In accordance with the displacement or the gap, the wafer and the mask are aligned to each other, or the gap between them is adjusted to a desired value. Since the detection signal is generated from diffracted light beams, its S/N ratio is sufficiently great. Therefore, the displacement or the gap is determined with high precision. In addition, it is possible with the invention to perform the aligning of the wafer and the mask and the adjusting of the gap therebetween, simultaneously. Further, the incident light may be either circularly polarized light or non-polarized light.
摘要:
A pattern inspection apparatus includes a first unit configured to acquire an optical image of pattern, a second unit configured to generate a reference image to be compared, a third unit configured to calculate elements of a normal matrix for a least-squares method for calculating a displacement amount displaced from a preliminary alignment position, a forth unit configured to estimate a type of the reference image pattern, by using some of the elements of the normal matrix, a fifth unit configured to calculate the displacement amount based on the least-squares method, by using a normal matrix obtained by deleting predetermined elements depending upon the type of the pattern, a sixth unit configured to correct an alignment position between the optical image and the reference image to a position displaced by the displacement amount, and a seventh unit configured to compare the optical image and the reference image.