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    SELF-HEALING METAL STRUCTURES
    31.
    发明申请
    SELF-HEALING METAL STRUCTURES 审中-公开

    公开(公告)号：US20200132400A1

    公开(公告)日：2020-04-30

    申请号：US16176121

    申请日：2018-10-31

    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.

    Inventor： Shailesh N. Joshi ,  Naoya Take

    IPC: F28F19/06 ,  C23C16/455 ,  F28F21/08 ,  H05K7/20 ,  H01L23/427 ,  H01L21/48

    Abstract: A self-healing metal structure is provided for transferring heat between an electronics component and a substrate. The self-healing metal structure includes a base metal structural component. A phase change material is provided adjacent at least a portion of the base metal structural component. A protective component at least partially encapsulates the phase change material. Upon the presence of a spatial defect in the base metal structural component, the phase change material reacts with the base structural component to form an intermetallic compound to at least partially occupy the spatial defect. The phase change material at least partially encapsulated with the protective component may be disposed within the base metal structural component as a plurality of separate capsules incorporated therein, or the phase change material at least partially surrounds the base metal structural component.

    FAULT DIAGNOSIS USING DISTRIBUTED PCA ARCHITECTURE
    33.
    发明申请
    FAULT DIAGNOSIS USING DISTRIBUTED PCA ARCHITECTURE 审中-公开

    公开(公告)号：US20190311552A1

    公开(公告)日：2019-10-10

    申请号：US15947662

    申请日：2018-04-06

    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc. ,  University of Connecticut

    Inventor： Lingyi Zhang ,  Weiqiang Chen ,  Krishna Pattipatti ,  Ali M. Bazzi ,  Shailesh N. Joshi ,  Ercan M. Dede

    IPC: G07C5/00 ,  G06N99/00 ,  G07C5/08

    Abstract: A system includes a vehicle having an electronic device, a sensor designed to detect sensor data corresponding to at least one property of the electronic device, an output device designed to output data, and a vehicle network access device designed to transmit the sensor data. The system also includes a machine learning server separate from the vehicle and having a machine learning processor designed to receive the sensor data, and generate, using a machine learning algorithm, a model of the electronic device. The machine learning processor is also designed to determine that a fault is likely to occur with the electronic device by conducting a T squared statistical analysis of the sensor data using the model, and generate a signal to be transmitted to the vehicle network access device when the fault is likely to occur and output information indicating that the fault is likely to occur.

    Cooling bond layer and power electronics assemblies incorporating the same
    34.
    发明授权
    Cooling bond layer and power electronics assemblies incorporating the same 有权

    公开(公告)号：US10388590B1

    公开(公告)日：2019-08-20

    申请号：US15885115

    申请日：2018-01-31

    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.

    Inventor： Shailesh N. Joshi ,  Ercan Mehmet Dede

    IPC: H01L23/34 ,  H01L23/473 ,  H01L21/48 ,  H01L23/00 ,  H01L23/467

    Abstract: A cooling bond layer for a power electronics assembly is provided. The cooling bond layer includes a first end, a second end spaced apart from the first end, a metal matrix extending between the first end and the second end, and a plurality of micro-channels extending through the metal matrix from the first end to the second end. The plurality of micro-channels are configured for a cooling fluid to flow through and remove heat from the cooling bond layer. In some embodiments, the plurality of micro-channels are cylindrical shaped micro-channels. In such embodiments, the plurality of micro-channels may have a generally constant average inner diameter along a thickness of the cooling bond layer. In the alternative, the plurality of micro-channels may have a graded average inner diameter along a thickness of the cooling bond layer. In other embodiments, the plurality of micro-channels may have a wire mesh layered structure.

    SYSTEMS AND METHODS FOR ADDITIVE MANUFACTURING OF WICK STRUCTURE FOR VAPOR CHAMBER
    35.
    发明申请
    SYSTEMS AND METHODS FOR ADDITIVE MANUFACTURING OF WICK STRUCTURE FOR VAPOR CHAMBER 审中-公开

    公开(公告)号：US20190082560A1

    公开(公告)日：2019-03-14

    申请号：US15699549

    申请日：2017-09-08

    Applicant: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.

    Inventor： Ercan Dede ,  Feng Zhou ,  Shailesh N. Joshi

    IPC: H05K7/20 ,  B22F3/105 ,  B01B1/00 ,  B33Y80/00

    Abstract: A vapor chamber includes a wick structure created by an additive selective laser sintering process. The wick structure includes a substrate, a first copper powder layer, a second copper powder layer, and a plurality of additional layers. The first copper powder layer is deposited across the substrate, wherein the first copper powder layer is subsequently selectively fused via a fusing instrument. The second copper powder layer is deposited across the first copper powder layer, wherein the second copper powder layer is subsequently selectively fused via the fusing instrument. Additionally, a plurality of additional copper powder layers are deposited wherein each additional layer is deposited on the previous layer, wherein each of the additional copper powder layers is selectively fused with a predetermined structure.

    Two-sided jet impingement assemblies and power electronics modules comprising the same
    40.
    发明授权
    Two-sided jet impingement assemblies and power electronics modules comprising the same 有权
    双面喷射冲击组件和包括其的电力电子模块

    公开(公告)号：US09437523B2

    公开(公告)日：2016-09-06

    申请号：US14291686

    申请日：2014-05-30

    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.

    Inventor： Shailesh N. Joshi ,  Ercan M. Dede

    IPC: H01L23/473 ,  H01L25/07

    CPC classification number: H01L23/4735 ,  H01L25/07 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Power electronics modules having jet impingement assemblies utilized to cool heat generating devices are disclosed. In one embodiment, a jet impingement assembly includes coupled manifold plates having a fluid inlet and outlet, a distribution surface, and a collection surface. The distribution surface of the first and second manifold plate is coupled to define a distribution manifold having a fluid distribution channel and one or more arrays of orifices extending through both manifold plates. Heat transfer plates are coupled to each manifold plate's collection surface forming impingement chambers. The heat transfer plates include one or more arrays of fins extending toward the collection surface of each manifold plate fluidly coupled to the fluid outlet. The first and second manifold plates and the first and second heat transfer plates are positioned in a horizontal stack such that the fluid inlets of both manifold plates are adjacent.

    Abstract translation: 公开了具有用于冷却发热装置的喷射冲击组件的电力电子模块。 在一个实施例中，喷射冲击组件包括具有流体入口和出口，分配表面和收集表面的联接歧管板。 第一和第二歧管板的分配表面被联接以限定具有流体分配通道和一个或多个延伸穿过两个歧管板的孔阵列的分配歧管。 传热板联接到形成冲击室的每个歧管板的收集表面。 传热板包括一个或多个翅片阵列，其朝向流体连接到流体出口的每个歧管板的收集表面延伸。 第一和第二歧管板以及第一和第二传热板被定位在水平堆叠中，使得两个歧管板的流体入口相邻。

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