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    Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof
    31.
    发明授权
    Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof 有权
    具有多级反射面结构的发光二极管封装及其制造方法

    公开(公告)号：US07547923B2

    公开(公告)日：2009-06-16

    申请号：US11783948

    申请日：2007-04-13

    申请人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

    发明人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

    IPC分类号： H01L29/207

    CPC分类号： H01L33/483 ,  H01L33/60 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A high luminance and high output LED package using an LED as a light source and a fabrication method thereof. The LED package includes an Al substrate with a recessed multi-stepped reflecting surface formed therein and a light source composed of LEDs mounted on the reflecting surface and electrically connected to patterned electrodes. The LED package also includes anodized insulation layers formed between the patterned electrodes and the substrate, and an encapsulant covering over the light source of the substrate. The LED package further includes an Al heat radiator formed under the LEDs to enhance heat radiation capacity. According to the present invention, the substrate is made of Al material and anodized to form insulation layers thereon, allowing superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED package.

    摘要翻译： 使用LED作为光源的高亮度和高输出LED封装及其制造方法。 LED封装包括Al基板，其中形成有凹入的多阶反射表面，以及由安装在反射表面上并与图案化电极电连接的LED组成的光源。 LED封装还包括形成在图案化电极和衬底之间的阳极氧化绝缘层，以及覆盖在衬底的光源上的密封剂。 LED封装还包括形成在LED下面的Al散热器，以增强散热能力。 根据本发明，基板由Al材料制成并阳极氧化以在其上形成绝缘层，从而允许LED的良好的散热效果，从而显着提高LED封装的寿命和发光效率。

    Heat radiating substrate and method of manufacturing the same
    33.
    发明申请
    Heat radiating substrate and method of manufacturing the same 审中-公开
    散热基板及其制造方法

    公开(公告)号：US20120085574A1

    公开(公告)日：2012-04-12

    申请号：US13064364

    申请日：2011-03-21

    申请人： Ji Hyun Park ,  Tae Hoon Kim ,  Sang Hyun Shin ,  Ki Ho Seo ,  Cheol Ho Heo ,  Young Ki Lee

    发明人： Ji Hyun Park ,  Tae Hoon Kim ,  Sang Hyun Shin ,  Ki Ho Seo ,  Cheol Ho Heo ,  Young Ki Lee

    IPC分类号： H05K1/14 ,  H05K3/42

    CPC分类号： H05K3/44 ,  H05K1/0203 ,  H05K1/053 ,  H05K3/202 ,  H05K3/4053 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2203/0315 ,  Y10T29/49165

    摘要： Provided are a heat radiating substrate and a method of manufacturing the same. The heat radiating substrate includes a substrate having a via-hole, an anode oxide layer formed on the entire surface of the substrate having the via-hole through an anodizing process, a first circuit pattern formed on the substrate on which the anode oxide layer is formed, and a second circuit pattern formed at a lower part of the via-hole to be connected to the via-hole. Therefore, it is possible to simplify a circuit forming process and readily manufacture the heat radiating substrate by applying a metal anodic bonding process, without using a conventional adhesion layer and metal seed when the heat radiating substrate is manufactured.

    摘要翻译： 提供一种散热基板及其制造方法。 散热基板包括具有通孔的基板，通过阳极氧化处理形成在具有通孔的基板的整个表面上的阳极氧化层，形成在基板上的阳极氧化物层为阳极氧化层 以及形成在通孔的下部以连接到通孔的第二电路图案。 因此，通过在制造散热基板时不使用常规的粘合层和金属种子，通过施加金属阳极接合工艺来简化电路形成工艺并容易地制造散热基板。

    RADIATING PACKAGE MODULE FOR EXOTHERMIC ELEMENT
    36.
    发明申请
    RADIATING PACKAGE MODULE FOR EXOTHERMIC ELEMENT 审中-公开
    放射元件放射性包装模块

    公开(公告)号：US20110042042A1

    公开(公告)日：2011-02-24

    申请号：US12581129

    申请日：2009-10-17

    申请人： Jong Man KIM ,  Seog Moon Choi ,  Sang Hyun Shin ,  Jin Su Kim

    发明人： Jong Man KIM ,  Seog Moon Choi ,  Sang Hyun Shin ,  Jin Su Kim

    IPC分类号： F28D15/04 ,  F28F7/00 ,  F28F13/18

    CPC分类号： F28F1/08 ,  F21V29/51 ,  F21Y2115/10 ,  F21Y2115/30 ,  F28D15/0275 ,  F28F2275/025 ,  F28F2275/14 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Disclosed herein is a radiating package module for an exothermic element. The radiating package module includes a heat conducting plate which has a groove of an internal thread shape, with the exothermic element being mounted on a surface of the heat conducting plate. A heat pipe is inserted into the groove in a screw-type coupling manner and has a coupling part of an external thread shape. An adhesive is applied between the groove and the coupling part. A cooling unit is coupled to an end of the heat pipe. The radiating package module maintains the reliability with which the radiating package radiates heat and improves structural reliability.

    摘要翻译： 本文公开了用于放热元件的辐射封装模块。 辐射封装模块包括具有内螺纹形状的槽的导热板，放热元件安装在导热板的表面上。 热管以螺旋式联接的方式插入凹槽中并具有外螺纹形状的联接部分。 在凹槽和耦合部分之间施加粘合剂。 冷却单元联接到热管的一端。 辐射封装模块保持辐射封装散热的可靠性，提高结构可靠性。

    Printed circuit board
    37.
    发明授权
    Printed circuit board 失效
    印刷电路板

    公开(公告)号：US08624123B2

    公开(公告)日：2014-01-07

    申请号：US13102323

    申请日：2011-05-06

    申请人： Cheol Ho Heo ,  Young Ki Lee ,  Sang Hyun Shin

    发明人： Cheol Ho Heo ,  Young Ki Lee ,  Sang Hyun Shin

    IPC分类号： H05K1/00 ,  H05K7/20

    CPC分类号： H05K7/205 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0209 ,  H05K3/0061 ,  H05K3/3452 ,  H05K2201/0209 ,  H05K2201/026 ,  H05K2201/0323 ,  H01L2924/00

    摘要： The present invention relates to a printed circuit board. A heat radiation coating material is applied to a portion of a circuit layer formed on an outermost portion of the printed circuit board, thereby making it possible to improve heat radiation performance of the printed circuit board. The heat radiation coating material also serves as a solder resist, thereby making it possible to insulate and protect the printed circuit board without a separate solder resist.

    摘要翻译： 印刷电路板技术领域本发明涉及印刷电路板。 将辐射涂层材料施加到形成在印刷电路板的最外部的电路层的一部分，从而可以提高印刷电路板的散热性能。 散热涂层材料也用作阻焊剂，从而可以在没有单独的阻焊剂的情况下绝缘和保护印刷电路板。

    PRINTED CIRCUIT BOARD
    38.
    发明申请
    PRINTED CIRCUIT BOARD 失效
    印刷电路板

    公开(公告)号：US20120199381A1

    公开(公告)日：2012-08-09

    申请号：US13102323

    申请日：2011-05-06

    申请人： Cheol Ho Heo ,  Young Ki Lee ,  Sang Hyun Shin

    发明人： Cheol Ho Heo ,  Young Ki Lee ,  Sang Hyun Shin

    IPC分类号： H05K7/20

    CPC分类号： H05K7/205 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0209 ,  H05K3/0061 ,  H05K3/3452 ,  H05K2201/0209 ,  H05K2201/026 ,  H05K2201/0323 ,  H01L2924/00

    摘要： The present invention relates to a printed circuit board. A heat radiation coating material is applied to a portion of a circuit layer formed on an outermost portion of the printed circuit board, thereby making it possible to improve heat radiation performance of the printed circuit board. The heat radiation coating material also serves as a solder resist, thereby making it possible to insulate and protect the printed circuit board without a separate solder resist.

    摘要翻译： 印刷电路板技术领域本发明涉及印刷电路板。 将辐射涂层材料施加到形成在印刷电路板的最外部的电路层的一部分，从而可以提高印刷电路板的散热性能。 散热涂层材料也用作阻焊剂，从而可以在没有单独的阻焊剂的情况下绝缘和保护印刷电路板。

    Lighting apparatus using PN junction light-emitting element and dimming method thereof
    39.
    发明授权
    Lighting apparatus using PN junction light-emitting element and dimming method thereof 有权
    使用PN结发光元件的照明装置及其调光方法

    公开(公告)号：US08471481B2

    公开(公告)日：2013-06-25

    申请号：US13081616

    申请日：2011-04-07

    申请人： Sang Hyun Shin ,  Seon Ho Kim

    发明人： Sang Hyun Shin ,  Seon Ho Kim

    IPC分类号： H05B37/00 ,  H05B39/00 ,  H05B41/00

    CPC分类号： H05B33/0806 ,  F21V5/04 ,  F21V23/005 ,  F21V29/507 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05B33/0815 ,  H05B33/0821

    摘要： The present disclosure discloses a dimming method of a lighting apparatus using a PN junction light-emitting element, the method including: supplying AC controlled by a dimmer; causing a first group, which has one PN junction light-emitting element positioned within a first boundary and one PN junction light-emitting element positioned within a second boundary, to emit light at a first voltage by the supplied AC when a first switch is in the ON state; and causing a second group, which has another PN junction light-emitting element positioned within the first boundary and another PN junction light-emitting element positioned within the second boundary and which is connected in series to the first group, to emit light at a second voltage higher than the first voltage by the supplied current when the first switch positioned between the first group and the second group is in the OFF state.

    摘要翻译： 本公开公开了一种使用PN结发光元件的照明装置的调光方法，所述方法包括：提供由调光器控制的AC; 引起第一组，其具有位于第一边界内的一个PN结发光元件和位于第二边界内的一个PN结发光元件，当第一开关处于第一组时，通过所提供的AC发射第一电压的光 ON状态; 并且引起第二组，其具有位于第一边界内的另一个PN结发光元件，以及位于第二边界内并与第一组串联连接的另一个PN结发光元件，以在第二组中发射光 当位于第一组和第二组之间的第一开关处于关闭状态时，供给电流高于第一电压的电压。

    Lighting Apparatus Using PN Junction Light-Emitting Element
    40.
    发明申请
    Lighting Apparatus Using PN Junction Light-Emitting Element 有权
    使用PN结发光元件的照明设备

    公开(公告)号：US20120217891A1

    公开(公告)日：2012-08-30

    申请号：US13081625

    申请日：2011-04-07

    申请人： Sang Hyun Shin ,  Seon Ho Kim

    发明人： Sang Hyun Shin ,  Seon Ho Kim

    IPC分类号： H05B41/16

    CPC分类号： H05B33/083 ,  H05B33/0809

    摘要： The present disclosure discloses a lighting apparatus using a PN junction light-emitting element, the apparatus including: a power transmitting substrate having a plurality of boundaries defined thereon; a plurality of PN junction light-emitting elements positioned within each boundary and divided into a plurality of groups; and a first switch provided on the power transmitting substrate, wherein the first switch goes into the ON state by a supplied AC having a first voltage to cause PN junction light-emitting elements of a first group positioned within each boundary to emit light, and the first switch is in the OFF state when PN junction light-emitting elements of a second group, which is positioned within each boundary and connected in series to the first group, emit light by a supplied AC having a second voltage higher than the first voltage.

    摘要翻译： 本公开公开了一种使用PN结发光元件的照明装置，该装置包括：具有限定在其上的多个边界的电力传输基板; 多个PN结发光元件，其位于每个边界内并分成多个组; 以及设置在所述电力传输基板上的第一开关，其中所述第一开关通过具有第一电压的所提供的AC进入导通状态，以使位于每个边界内的第一组的PN结发光元件发光，并且 位于每个边界内且与第一组串联连接的第二组的PN结发光元件通过具有高于第一电压的第二电压的提供的AC发光，第一开关处于关闭状态。