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38 条记录 (耗时 0.058 秒)

    Amino acid N-carboxyanhydrides with acyl substituents on nitrogen atoms thereof
    31.
    发明授权
    Amino acid N-carboxyanhydrides with acyl substituents on nitrogen atoms thereof 失效
    在其氮原子上具有酰基取代基的氨基酸N-羧酸酐

    公开(公告)号：US06670447B2

    公开(公告)日：2003-12-30

    申请号：US10070156

    申请日：2002-03-04

    申请人： Hidetoshi Tsunoda ,  Michiru Sekiguchi ,  Hajime Iizuka ,  Kazuya Sakai

    发明人： Hidetoshi Tsunoda ,  Michiru Sekiguchi ,  Hajime Iizuka ,  Kazuya Sakai

    IPC分类号： C07K1600

    CPC分类号： C07D263/44 ,  C07C231/10 ,  C07C237/22 ,  C07D231/12 ,  C07D233/56 ,  C07D249/08 ,  C07D295/185 ,  C07D413/06 ,  C07D413/14 ,  C07D417/06 ,  C07D417/14 ,  C07D471/04 ,  C07D487/08

    摘要： This invention provides amino acid N-carboxyanhydrides, each of which has an N-acyl substituent on its nitrogen atom, is represented by the following formula (1): readily reacts with nucleophilic reagents such as free amino acids, alcohols, anions or the like, and are intermediates useful for the high-yield production of amino acid derivatives, optically active compounds, peptides, polypeptides and the like useful in many fields lead by the fields of pharmaceuticals and agrochemicals, and also provides a process for the production of the amino acid N-carboxyanhydrides. Further, the present invention also provides a process for the production of diamides, which uses the compounds of the formula (1) and amine derivatives represented by the following formula (7): These diamides can also be suitably used for the production of amino acid derivatives, optically active compounds, peptides, polypeptides and the like.

    摘要翻译： 本发明提供氨基酸N-羧酸酐，其各自在其氮原子上具有N-酰基取代基，由下式（1）表示：容易与亲核试剂如游离氨基酸，醇，阴离子等反应 并且是用于高产量生产氨基酸衍生物，光学活性化合物，肽，多肽等的中间体，其在许多领域中可用于药物和农用化学品的领域，并且还提供了制备氨基酸的方法 酸性N-羧酸酐。 此外，本发明还提供了使用式（1）的化合物和由下式（7）表示的胺衍生物的二酰胺的制备方法：这些二酰胺也可以适合用于制备氨基酸 衍生物，光学活性化合物，肽，多肽等。

    Method for production of pyrrolidinone derivatives
    32.
    发明授权
    Method for production of pyrrolidinone derivatives 失效
    吡咯烷酮衍生物的制备方法

    公开(公告)号：US06555694B1

    公开(公告)日：2003-04-29

    申请号：US09694340

    申请日：2000-10-24

    申请人： Hajime Iizuka ,  Hiroshi Nagase ,  Naruyoshi Mita

    发明人： Hajime Iizuka ,  Hiroshi Nagase ,  Naruyoshi Mita

    IPC分类号： C07D20726

    CPC分类号： C07D207/277

    摘要： A compound represented by the following formula (12) useful as an intermediate for production of drug or agricultural chemical: (wherein R21 to R25 are each independently a hydrogen atom, a hydroxyl group, a halogen atom, an alkyl group of 1 to 4 carbon atoms, an alkoxy group of 1 to 4 carbon atoms, a perfluoroalkyl group of 1 to 4 carbon atoms, a cyano group, a nitro group, an amino group, a carboxyl group, a thiol group, an alkylthio group of 1 to 4 carbon atoms or a carbamoyl group) can be produced by reacting a compound represented by the formula (13): (wherein R21 to R25 have the same definitions as given above) with 1,1-cyclopropanedicarboxylic acid. The compound of the formula (12) is useful as a raw material for production of a pyrrolidinone compound useful as an active ingredient of drug.

    摘要翻译： 由下式（12）表示的化合物可用作药物或农药的生产中间体：（其中R21至R25各自独立地为氢原子，羟基，卤素原子，1-4个碳原子的烷基 1〜4个碳原子的烷氧基，1〜4个碳原子的全氟烷基，氰基，硝基，氨基，羧基，硫醇基，1〜4个碳的烷硫基 原子或氨基甲酰基）可以通过使式（13）表示的化合物（其中R21至R25具有与上述相同的定义）与1,1-环丙烷二羧酸反应来制备。 式（12）的化合物可用作生产用作药物活性成分的吡咯烷酮化合物的原料。

    Semiconductor device and mount structure thereof
    35.
    发明授权
    Semiconductor device and mount structure thereof 失效
    半导体器件及其安装结构

    公开(公告)号：US5777386A

    公开(公告)日：1998-07-07

    申请号：US698624

    申请日：1996-08-16

    申请人： Mitsutoshi Higashi ,  Hajime Iizuka ,  Kei Murayama

    发明人： Mitsutoshi Higashi ,  Hajime Iizuka ,  Kei Murayama

    IPC分类号： H01L21/60 ,  H01L21/56 ,  H01L23/12 ,  H01L23/13 ,  H01L23/28 ,  H01L23/498 ,  H05K1/02 ,  H05K3/30 ,  H05K3/34 ,  H01L23/48

    CPC分类号： H01L21/563 ,  H01L23/13 ,  H01L23/49816 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/1532 ,  H05K1/0201 ,  H05K3/303 ,  H05K3/3436

    摘要： A semiconductor device includes a semiconductor element having first and second surfaces. The element has connecting terminals on the first surface. A substrate has a substrate surface on which external connecting terminals and conductive patterns are formed. The connecting terminals of the semiconductor element are electrically connected to the external connecting terminals by means of the conductive patterns. The connecting terminals of the semiconductor element are each connected to one end of respective ones of the conductive patterns of the substrate by a flip-chip bonding. Resin hermetically seals the connecting terminals of the semiconductor element, so that the second surface of the semiconductor element is not covered by the sealing resin. A mounting substrate has a surface provided with circuit patterns. The semiconductor device is mounted on the mounting substrate in such a manner that the external connecting terminals are electrically connected to the circuit patterns of the mounting substrate and the second surface of the semiconductor element comes into contact with the surface of the mounting substrate.

    摘要翻译： 半导体器件包括具有第一和第二表面的半导体元件。 元件在第一表面具有连接端子。 衬底具有其上形成有外部连接端子和导电图案的衬底表面。 半导体元件的连接端子通过导电图案与外部连接端子电连接。 半导体元件的连接端子通过倒装芯片接合分别连接到基板的相应导电图案的一端。 树脂密封半导体元件的连接端子，使得半导体元件的第二表面不被密封树脂​​覆盖。 安装基板具有设置有电路图案的表面。 半导体器件以这样的方式安装在安装基板上，使得外部连接端子电连接到安装基板的电路图案，并且半导体元件的第二表面与安装基板的表面接触。