摘要:
A DRAM includes an internal boosting circuit, a global power-line, a plurality of blocks, a row decoder, and a POR generating circuit. Each block includes word lines, local power-lines, AND gates, drive transistors, and word line drivers. The AND gate turns a corresponding drive transistor on/off in response to a power on reset signal /POR and a corresponding block select signal. Therefore, all the local boosted power-lines are connected to the global boosted power-line during a power on reset period, whereby all the local boosted power-lines are initially charged up to boosted power supply potential Vpp.
摘要:
A semiconductor memory device comprises a DRAM memory cell array comprising a plurality of dynamic type memory cells arranged in a plurality of rows and columns, and an SRAM memory cell array comprising static type memory cells arranged in a plurality of rows and columns. The DRAM memory cell array is divided into a plurality of blocks each comprising a plurality of columns. The SRAM memory cell array is divided into a plurality of blocks each comprising a plurality of columns, corresponding to the plurality of blocks in the DRAM memory cell array. The SRAM memory cell array is used as a cache memory. At the time of cache hit, data is accessed to the SRAM memory cell array. At the time of cache miss, data is accessed to the DRAM memory cell array. On this occasion, data corresponding to one row in each of the blocks in the DRAM memory cell array is transferred to one row in the corresponding block in the SRAM memory cell array.
摘要:
A semiconductor memory device includes a sense amp band comprising a plurality of sense amplifiers, and a plurality of power supply and ground lines arranged in a meshed shape. Power supply and ground lines include lines arranged in parallel with and in proximity to the sense amp band. Each sense amplifier in the sense amp band is connected to a power supply and ground line arranged in proximity to and in parallel with the sense amplifier through a drive component. Each drive component is provided for a predetermined number of sense amplifiers, and is rendered conductive in response to a sense amplifier activation signal from a signal line arranged in parallel with the sense amp band. The plurality of power supply and ground lines arranged in a meshed shape are contacted at crossings. Therefore, in the semiconductor memory device, no distribution of power supply potential is generated to allow a stable supply of a power supply and ground potential to an arbitrary circuit portion. In addition, since a sense amplifier is connected to proximate power supply and ground lines through a drive component, a reliable and high-speed sensing operation is possible irrespective of a length of a sense amp drive signal line.
摘要:
A power supply line is disposed parallel to a sense amplifier train including a plurality of sense amplifiers at the side of each subarray. The power supply line is connected to the sense amplifier included in the sense amplifier train via a plurality of drive transistors and a sense amplifier drive line.
摘要:
Each of sense amplifiers is coupled to two bit lines with another bit line being interposed therebetween. Information stored in a memory cell is read out onto one of the two bit lines coupled to each of the sense ampliers, while a reference potential is read out onto the other bit line. Outside of the two bit lines, a reference potential is respectively read out onto other bit lines adjacent to the two bit lines. The information stored in the memory cell is read out onto the other bit line between the two bit lines.
摘要:
Drains of first and second transistors are connected to a low level line of an internal circuitry such as a sense amplifier related to determination of a potential in a memory cell. The first transistor has its gate diode-connected to a sense drive line and its source grounded. The second transistor receives at its gate an internally generated signal, and its source is grounded. In the standby state, the potential of the sense drive line is set higher than low level of said word lines by the threshold voltage Vthn of the first transistor and used as dummy GND potential Vss′, and in the active state, the second transistor is rendered conductive so as to prevent floating of the sense drive line from the dummy GND potential Vss′.
摘要:
A semiconductor memory device comprises a DRAM memory cell array comprising a plurality of dynamic type memory cells arranged in a plurality of rows and columns, and an SRAM memory cell array comprising static type memory cells arranged in a plurality of rows and columns. The DRAM memory cell array is divided into a plurality of blocks each comprising a plurality of columns. The SRAM memory cell array is divided into a plurality of blocks each comprising a plurality of columns, corresponding to the plurality of blocks in the DRAM memory cell array. The SRAM memory cell array is used as a cache memory. At the time of cache hit, data is accessed to the SRAM memory cell array. At the time of cache miss, data is accessed to the DRAM memory cell array. On this occasion, data corresponding to one row in each of the blocks in the DRAM memory cell array is transferred to one row in the corresponding block in the SRAM memory cell array.
摘要:
In a set of memory cells selected by one column select line, a memory cell of at least 1 bit is connected to an internal data line that is different from the internal data line to which another memory cell in the same set is connected. An internal data line pair is connected to a data terminal. Thus, data having different logic levels can be written into adjacent memory cells even in an IO compression test mode.
摘要:
A semiconductor memory device includes a first test row decoder (9a) for selecting memory cells in normal rows in a test mode, a second test row decoder (9b) for selecting spare memory cell rows, a first test column decoder (10a) for selecting memory cells in normal columns, and a second test column decoder (10b) for selecting spare memory cell columns. A control circuit (11) may perform switching between four combinations of the row and column decoders by using a control signal (SRT) and a control signal (SCT). All spare memory cells are tested prior to reparation of a defective memory cell for yield enhancement.
摘要:
An output buffer includes a pull up transistor of N type field effect to charge a data output terminal by an external power supply potential Vdd in a high level data output operation, and a pull down transistor of N type field effect to discharge the data output terminal to a ground potential Vss in a low level data output operation. The substrate potential of the pull up NMOS transistor is set to a potential of a level higher than the normal case in a high level data output operation. As a result, the output buffer can speedily charge the data terminal in a high level data output operation.